|
|
|
|
|
(State or Other Jurisdiction of Incorporation)
|
(Commission File Number)
|
(IRS Employer Identification No.)
|
|
|
|
|
|
|
|
|
|
(Address of Principal Executive Offices)
|
|
(Zip Code)
|
|
Written communications pursuant to Rule 425 under the Securities Act (17 CFR 230.425)
|
|
Soliciting material pursuant to Rule 14a-12 under the Exchange Act (17 CFR 240.14a-12)
|
|
Pre-commencement communications pursuant to Rule 14d-2(b) under the Exchange Act (17 CFR 240.14d-2(b))
|
|
Pre-commencement communications pursuant to Rule 13e-4(c) under the Exchange Act (17 CFR 240.13e-4(c))
|
|
Title of each class
|
|
Trading symbol
|
|
Name of each exchange on which registered
|
|
|
|
|
|
|
|
Item 8.01.
|
Other Events.
|
| • |
a listing of shares of our subsidiary ACM Research (Shanghai), Inc., or ACM Shanghai, on the Shanghai Stock Exchange’s Sci-Tech innovAtion boaRd, known as
the STAR Market; and
|
| • |
a concurrent initial public offering of ACM Shanghai shares in the Peoples Republic of China.
|
|
Item 9.01
|
Financial Statements and Exhibits.
|
|
(d)
|
Exhibits.
|
|
Exhibit
|
|
Description
|
|
Information Document of ACM Research (Shanghai), Inc. published by the Shanghai Stock Exchange on November 12, 2021
|
||
|
Record of Investor Relation Activity (No. 2021‑01) filed by ACM Research (Shanghai), Inc. with the Shanghai Stock Exchange on December 1,
2021
|
||
|
104
|
Cover Page Interactive Data File (embedded within the XBRL document)
|
|
ACM RESEARCH, INC.
|
|||
|
By:
|
/s/ Mark McKechnie
|
||
|
Mark McKechnie
|
|||
|
Chief Financial Officer and Treasurer
|
|||
|
The shares in the Offering intends to be listed on the STAR Market, which has high investment risks. The listed companies on the STAR Market have the characteristics of large investment in research and
development, high risk of operation, unstable performance and high risk of delisting, where Investors are facing high market risks. Investors should fully understand the investment risks of the STAR Market and the risk factors disclosed
by the Company, and make investment decisions prudently.
|

|
The application for the offering of the Company has yet not been approved by the Shanghai Stock Exchange or the CSRC. This [***] does not have the legal force for
stock issue, which is used only for advance disclosure purpose. Investors shall make investment decisions based on the officially announced [***].
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Class of Shares
|
RMB-denominated Common Shares (A Shares)
|
||
|
Number of Shares in the Offering
|
The number of shares offered in the Public Offering shall be 43,355,753.00, accounting for 10.00% of the total share capital of the Company after the Offering. The Offering does not involve
any public offering of shares by shareholders.
|
||
|
Par Value per Share
|
RMB 1.00 Yuan
|
||
|
Offering Price per Share
|
RMB 85.00 Yuan
|
||
|
Offering Date
|
November 8, 2021
|
||
|
The Stock Exchange and Board for Listing
|
the STAR Market of the Shanghai Stock Exchange
|
||
|
Total Share Capital after the Offering
|
433,557,100 shares
|
||
|
Participation of the Sponsor’s Relevant Subsidiaries in Strategic Placement
|
[***], a subsidiary of [***], is arranged by the latter to participate in the strategic placement concerning the Offering, with the number of follow-up investment shares to be 1,176,470
accounting for 2.71% of the shares in the Offering. The said shares placed to [***] shall be subject to a lock-up period of 24 months from the date of the IPO and Listing of the Issuer.
|
||
|
Sponsor (Lead Underwriter)
|
[***]
|
||
|
Joint Lead Underwriter
|
[***]
|
||
|
Signing Date
|
November 12, 2021
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SECTION I INTERPRETATIONS
|
11
|
|
SECTION II OVERVIEW
|
19
|
|
I. Overview of the Issuer and the Intermediaries
|
19 |
|
II. Overview of the Offering
|
19 |
|
III. Major Financial Data and Indicators for the Issuer’s Reporting Period
|
21 |
|
IV. Main Business and Operation of the Issuer
|
22 |
|
V. Technology Advancement, R&D Technology Industrialization and Future Development Strategies of the Issuer
|
24 |
|
VI.Listing Criteria Chosen by the Issuer
|
24 |
|
VII. Description of the Issuer’s Compliance with the Positioning of the STAR Market
|
25 |
|
VIII. Special Arrangements on the Issuer’s Corporate Governance
|
26 |
|
IX.Use of the Fund Raised by the Issuer
|
26 |
|
SECTION III OVERVIEW OF THE OFFERING
|
27 |
|
I. Basic Information of the Offering
|
27 |
|
II. Relevant Parties in the Offering
|
28 |
|
III. Relationship between the Issuer and Other Related Parties in the Offering
|
30 |
|
IV. Important Dates for the Offering
|
30 |
|
V. The Strategic Placement
|
30 |
|
SECTION IV RISK FACTORS
|
36 |
|
I. Technical Risks
|
36 |
|
II. Operating Risks
|
37 |
|
III. Risks of Management and Internal Control
|
40 |
|
IV. Financial Risks
|
41 |
|
V. Legal Risks
|
43
|
|
VI. Risks of Offering Failure
|
44
|
|
VII. Risks of Investment Projects of Raised Funds
|
44
|
|
VIII. Risks of Adverse Effect on the Semiconductor Industry Caused by the Global COVID-19 Epidemic
|
44 |
|
IX. Relevant Risks of the Company and ACMR, the Controlling Shareholder, being Listed on the STAR Market and the NASDAQ Stock Market Respectively
|
45 |
|
X. Other Risks
|
45 |
|
SECTION V OVERVIEW OF THE ISSUER
|
46 |
|
I. Overview of the Issuer
|
46 |
|
II. Establishment and Reorganization of the Issuer
|
46 |
|
III.Equity Structure of the Issuer
|
53
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
IV. Majority Owned Subsidiaries and Equity Participation Companies of the Issuer
|
53
|
|
V. Basic Information of Major Shareholders Holding More than 5% of the Shares and the Actual Controller
|
60
|
|
VI. Share Capital of the Issuer
|
78 |
|
VII. Brief Information of Directors, Supervisors, Senior Executives and Core Technicians
|
101 |
|
VIII. Agreements between the Company and any of Directors, Supervisors, Senior Executives and Key technicians and their Performance
|
107 |
|
IX. Changes in Directors, Supervisors, Senior Executives and Key Technicians of the Company within the Last Two Years
|
107 |
|
X. External Investments Made by Directors, Supervisors, Senior Executives and Key Technicians of the Company
|
109 |
|
XI. Shares Held by Directors, Supervisors, Senior Executives and Key technicians of the Company and their Immediate Relatives
|
109 |
|
XII. Information on Remuneration of Directors, Supervisors, Senior Executives and Key Technicians of the Company
|
110 |
|
XIII. Equity Incentives and Relevant Arrangements of the Issuer prior to this Offering
|
112 |
|
XIV. Employees of the Issuer and their Social Securities
|
117 |
|
SECTION VI BUSINESS AND TECHNOLOGY
|
121 |
|
Ⅰ. Main Business and Main Products of the Issuer
|
121 |
|
Ⅱ. The Basic Situation and Competition Condition of the Issuer’s Industry
|
134 |
|
III. Issuer’s Sales and Main Customers
|
174 |
|
IV. Issuer’s Procurement and Main Suppliers
|
181 |
|
V. Situation of Key Resource Elements, Such as Fixed Assets, Intangible Assets, ETC. That Have a Major Impact on Main Business
|
186 |
|
VI. Core Technologies of the Issuer
|
196 |
|
VII. Overseas Operation of the Issuer
|
230
|
|
SECTION VII CORPORATE GOVERNANCE AND INDEPENDENCE
|
231
|
|
I. Establishment, Perfection and Operation of Systems of General Meeting of Shareholders, Board of Directors, Supervisory Board, Independent Directors, Secretary of Board of Directors, Special Committees of
Board of Directors
|
231
|
|
II. Shares with Special Voting Rights of the Issuer
|
235
|
|
III. Structure of Contractual Control of the Issuer
|
238
|
|
IV. Self-appraisal of the Management and Certification Opinions of Certified Public Account on Internal Control
|
238
|
|
V. Funds Occupancy and External Securities of the Issuer
|
239
|
|
VI. Violations of Laws or Regulations by the Issuer
|
239
|
|
VII. Independent and Continuous Operation of the Issuer Directed to the Market
|
242
|
|
VIII. Horizontal Competition
|
243
|
|
IX. Related Party and Related Relationship
|
244
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
X. Related Transactions
|
251
|
|
XI. Decision-making Procedures and Opinions of Independent Directors of Related Transactions during the Reporting Period
|
267
|
|
XII. Changes in Related Parties
|
267
|
|
SECTION VIII FINANCIAL ACCOUNTING INFORMATION AND MANAGEMENT ANALYSIS
|
269
|
|
I. Audited Financial Statements
|
269
|
|
II. Preparation Basis of Financial Statements and Scope of Consolidated Statements
|
280
|
|
III. Audit Opinion of Certified Public Accountant
|
281
|
|
IV. Key Audit Matters and Judgment Criteria for Materiality Related to Financial Accounting Information
|
281
|
|
V. Potential Specific Impacts on or Risks to Issuer’s Future Profitability (Operation) or financial position
|
282
|
|
VI. Significant Accounting Policies and Accounting Estimates Adopted in the Reporting Period
|
284
|
|
VII. Applicable Tax Rate and Main Fiscal and Tax Preferential Policies
|
305
|
|
VIII. Segment Information
|
307
|
|
IX. Non-recurring Profits or Losses
|
307
|
|
X. Main Financial Indicators
|
309
|
|
XI. Operating Results Analysis
|
311
|
|
XII. Asset Quality and Solvency Analysis
|
335
|
|
XIII. Dividend Distribution Policy
|
371
|
|
XIV. Cash Flow Analysis
|
371
|
|
XV. Capital Expenditure Analysis
|
374
|
|
XVI. Analysis of Going Concern Capability
|
374
|
|
XVII. Major Equity Acquisition and Merger
|
374
|
|
XVIII. Subsequent Matters, Contingencies, Other Important Matters, Major Guarantees and Litigation Matters
|
375
|
|
XIX. Profit Forecast
|
375
|
|
XX. Main Financial Information and Operating Conditions after the Deadline for Auditing Financial Report
|
375
|
|
SECTION IX UTILIZATION OF RAISED FUNDS AND FUTURE DEVELOPMENT PLAN
|
376
|
|
I. Overview of Investment Projects with Raised Funds
|
376
|
|
II. Utilization of Raised Funds
|
381
|
|
III. Explanation on the Newly Acquired Land or Real Estate Involved in the Use of Raised Funds
|
388
|
|
IV. Strategic Planning of the Company
|
389
|
|
SECTION X INVESTOR PROTECTION
|
392
|
|
I. Main Arrangements by the Issuer on Investor Relations
|
392
|
|
II. Dividend Distribution Policy of the Issuer
|
393
|
|
III. Distribution Policy of Accumulated Profits before the Offering
|
395
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
IV. Voting Mechanism for Shareholders of the Issuer
|
395
|
|
V. Important Commitments Made by Relevant Parties to the Offering and Their Fulfillment
|
396
|
|
SECTION XI OTHER IMPORTANT MATTERS
|
411
|
|
I. Material Contracts
|
411
|
|
II. External Guarantee
|
420
|
|
III. Litigation and Arbitration
|
420
|
|
SECTION XII STATEMENTS
|
423
|
|
I. Statement by All Directors, Supervisors and Senior Executives of the Issuer
|
423
|
|
II. Statement by the Issuer’s Controlling Shareholder
|
425
|
|
III. Statement by the Issuer’s De Facto Controller
|
426
|
|
IV. Statement (I) by the Sponsor (Lead Underwriter)
|
427
|
|
IV. Statement (II) by the Sponsor (Lead Underwriter)
|
428
|
|
V. Statement by the Joint Lead Underwriter
|
430
|
|
VI. Statement by the Lawyer
|
431
|
|
VII. Statement by the Audit Institution
|
432
|
|
VIII. Statement by the Asset Appraisal Agency
|
433
|
|
IX. Statement by the Capital Verification Institution
|
434
|
|
SECTION XIII ATTACHMENTS
|
436
|
|
I. Documents for Future Reference
|
436
|
|
II. Access to Documents for Future Reference
|
436
|
|
SCHEDULE I: IMPORTANT PATENTS
|
437
|
|
SCHEDULE II: IMPORTANT TRADEMARKS
|
455
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
I. Basic Terms
|
||||
|
Issuer, Company, the Company
|
means
|
ACM Research (Shanghai), Inc. and its predecessor ACM Research (Shanghai), Inc. (before restructuring)
|
||
|
Corporation, ACMSH
|
means
|
ACM Research (Shanghai), Inc.
|
||
|
ACMSH (before restructuring)
|
means
|
ACM Research (Shanghai), Inc., the predecessor of the Issuer
|
||
|
ACM Wuxi
|
means
|
ACM Research (Wuxi), Inc., a wholly-owned subsidiary of the Issuer
|
||
|
Shengwei Shanghai
|
means
|
Shengwei Semiconductor Equipment (Shanghai) Co., Ltd., a wholly-owned subsidiary of the Issuer
|
||
|
CleanChip HK
|
means
|
CleanChip Technologies Limited, a wholly-owned subsidiary of the Issuer
|
||
|
ACMKR
|
means
|
ACM Research Korea Co., Ltd., a wholly-owned subsidiary of CleanChip HK
|
||
|
ACM CA
|
means
|
ACM Research (CA), Inc., a wholly-owned subsidiary of CleanChip HK
|
||
|
Shengyi Technology
|
means
|
Shengyi Semiconductor Technology (Wuxi) Co., Ltd., an equity participation enterprise of the Issuer
|
||
|
Shixi Chanheng
|
means
|
Hefei Shixi Chanheng Integrated Circuit Venture Capital Fund (L.P.), an equity participation enterprise of the Issuer
|
||
|
Qingdao Juyuan
|
means
|
Qingdao Juyuan Xinxing Equity Investment Partnership (L.P.)
|
||
|
ACMR
|
means
|
ACM Research, Inc., a Nasdaq stock market listed company and the controlling shareholder of the Issuer
|
||
|
Xinwei Consulting
|
means
|
Xinwei (Shanghai) Management Consulting Partnership (L.P.), a shareholder of the Issuer
|
||
|
SICIF
|
means
|
Shanghai Integrated Circuit Industry Fund Co., Ltd., a shareholder of the Issuer
|
||
|
PDHTI
|
means
|
Shanghai Pudong High-tech Investment Co., Ltd., a shareholder of the Issuer
|
||
|
[***]
|
means
|
[***], a shareholder of the Issuer
|
||
|
Shangrong Innovation
|
means
|
Shangrong Innovation (Ningbo) Equity Investment Center (L.P.), a shareholder of the Issuer
|
||
|
Jinpu Investment
|
means
|
Shanghai Jinpu Lingang Intelligent Technology Private Equity Investment Fund (L.P.), a shareholder of the Issuer
|
||
|
Taihu Guolian
|
means
|
Wuxi Taihu Guolian Emerging Industry Investment Enterprise (L.P.), a shareholder of the Issuer
|
||
|
Xinshi Consulting
|
means
|
Xinshi (Shanghai) Management Consulting Partnership (L.P.), a shareholder of the Issuer
|
||
|
Yongkong Consulting
|
means
|
Shanghai Yongkong Business Information Consulting Partnership (L.P.), a shareholder of the Issuer
|
||
|
Hai Feng Investment
|
means
|
Hai Feng Investment Holding Limited, a shareholder of the Issuer
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Runguang Investment
|
means
|
Hefei Runguang Equity Investment Partnership (L.P.), a shareholder of the Issuer
|
||
|
ZJTVC
|
means
|
Shanghai Zhangjiang Science and Technology Venture Capital Co., Ltd., a shareholder of the Issuer
|
||
|
SYEM
|
means
|
Shanghai Shanyi Enterprise Management Center (L.P.), a shareholder of the Issuer
|
||
|
Xingang Consulting
|
means
|
Xingang (Shanghai) Management Consulting Partnership (L.P.), a shareholder of the Issuer
|
||
|
SRJY
|
means
|
Shanghai Shangrong Juyuan Equity Investment Center (L.P.), a shareholder of the Issuer
|
||
|
means
|
Shengxin (Shanghai) Enterprise Management Consulting Partnership (L.P.)
|
|||
|
Zhangjiang Group
|
means
|
Shanghai Zhangjiang (Group) Co., Ltd.
|
||
|
Yangtze Memory
|
means
|
Yangtze Memory Technologies Co., Ltd., a customer of the Issuer
|
||
|
SMIC
|
means
|
Semiconductor Manufacturing International Corporation, a customer of the Issuer
|
||
|
Hynix
|
means
|
SK Hynix Inc., a customer of the Issuer
|
||
|
Hefei Changxin
|
means
|
Hefei Changxin Integrated Circuit Manufacture Co., Ltd., a customer of the Issuer
|
||
|
Huahong Group
|
means
|
Shanghai Huahong (Group) Co., Ltd., a customer of the Issuer
|
||
|
JCET
|
means
|
Jiangsu Changjiang Electronics Technology Co., Ltd., a customer of the Issuer
|
||
|
TFME
|
means
|
Tongfu Microelectronics Co., Ltd., a customer of the Issuer
|
||
|
Xiamen Tongfu
|
means
|
Xiamen Tongfu Microelectronics Co., Ltd.
|
||
|
SJsemi
|
means
|
SJ Semiconductor (Jiangyin) Limited, a customer of the Issuer
|
||
|
Nepes
|
means
|
Nepes corporation, a customer of the Issuer
|
||
|
Wafer Works
|
means
|
Wafer Works Corporation, a customer of the Issuer
|
||
|
JRH
|
means
|
Zhejiang QL Electronics Co., Ltd., a customer of the Issuer
|
||
|
ZING SEMI
|
means
|
Zing Semiconductor Corporation, a customer of the Issuer
|
||
|
PSI
|
means
|
Phoenix Silicon International Corporation, a customer of the Issuer
|
||
|
NCAP
|
means
|
National Center for Advanced Packaging Co., Ltd., a customer of the Issuer
|
||
|
ICRD
|
means
|
Shanghai IC R&D Center Co., Ltd., a customer of the Issuer
|
||
|
NINEBELL
|
means
|
NINEBELL Co., Ltd., a supplier of the Issuer
|
||
|
NOMURA
|
means
|
NOMURA MICRO SCIENCE CO., LTD., a supplier of the Issuer
|
||
|
Charter Base International
|
means
|
Charter Base International Logistics (Shanghai) Co., Ltd.
|
||
|
DNS
|
means
|
SCREEN Holdings Co., Ltd.
|
||
|
TEL
|
means
|
Tokyo Electron Ltd.
|
||
|
LAM
|
means
|
LAM Research Corporation
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SEMES
|
means
|
SEMES Co. Ltd.
|
||
|
NAURA
|
means
|
NAURA Technology Group Co., Ltd.
|
||
|
KINGSEMI
|
means
|
KINGSEMI Co., Ltd.
|
||
|
PNC System
|
means
|
PNC Process System Co., Ltd.
|
||
|
AMEC
|
means
|
Advanced Micro-Fabrication Equipment Inc.
|
||
|
HZCCTECH
|
means
|
Hangzhou Changchuan Technology Co., Ltd.
|
||
|
ASML
|
means
|
ASML Holding N.V.
|
||
|
KLA
|
means
|
KLA Corporation
|
||
|
Applied Materials
|
means
|
Applied Materials, Inc.
|
||
|
MOST
|
means
|
Ministry of Science and Technology of the People’s Republic of China
|
||
|
MIIT
|
means
|
Ministry of Industry and Information Technology of the People’s Republic of China
|
||
|
NDRC
|
means
|
National Development and Reform Commission of the People’s Republic of China
|
||
|
MOF
|
means
|
Ministry of Finance of the People’s Republic of China
|
||
|
CSRC
|
means
|
China Securities Regulatory Commission
|
||
|
SASAC
|
means
|
State-owned Assets Supervision and Administration Commission of the State Council
|
||
|
The Company Law
|
means
|
|||
|
The Securities Law
|
means
|
The Securities Law of the People’s Republic of China
|
||
|
The Articles of Association
|
means
|
The Articles of Association of ACM Research (Shanghai), Inc.
|
||
|
The Articles of Association (Draft)
|
means
|
The Articles of Association of ACM Research (Shanghai), Inc. (Draft) applicable to the Issuer after the Offering
|
||
|
NASDAQ
|
means
|
National Association of Securities Dealers Automated Quotations, the NASDAQ stock market
|
||
|
Sponsor, Lead Underwriter, [***]
|
means
|
[***]
|
||
|
Joint Lead Underwriter
|
means
|
[***]
|
||
|
Issuer’s Lawyer; King & Wood
|
means
|
King & Wood Mallesons
|
||
|
Reporting Accountant, Lixin
|
means
|
BDO CHINA SHU LUN PAN Certified Public Accountants LLP
|
||
|
Appraisal Agency, China United Appraisal
|
means
|
China United Assets Appraisal Group Co., Ltd.
|
||
|
Offering
|
means
|
the public offering of 43,355,753 shares
|
||
|
Reporting Period
|
means
|
2018, 2019, 2020 and the 6-month period ending June 30, 2021
|
||
|
RMB 1 Yuan, RMB 10,000 Yuan
|
means
|
RMB 1 Yuan and RMB 10,000 Yuan
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
II. Technical Terms
|
||||
|
Semiconductors
|
mean
|
materials which have an intermediate conductivity between that of conductors and insulators at room temperature, which can be divided into integrated circuits (IC), discrete devices,
optoelectronics and sensors in accordance with manufacturing technology. Semiconductors can be widely used in downstream communications, computers, consumer electronics, network technology, automobile, aerospace and other industries.
|
||
|
Silicon Slice
|
means
|
Silicon Wafer, a silicon slice of semiconductor used for the fabrication of semiconductor devices such as integrated circuits, discrete devices and sensors.
|
||
|
IC
|
means
|
Integrated Circuit, a circuit or system that uses a series of specific processing techniques to interconnect active components such as transistors and diodoes and passive originals such
resistors and capacitors, integrate them on a semiconductor wafer according to a certain circuit, and package them in a shell to achieve specific functions.
|
||
|
Wafer
|
means
|
the Silicon Slice during the specific processing such as oxidation/diffusion, photolithography, etching, ion implantation, film growth, cleaning and polishing, metallization, etc.
|
||
|
Fab
|
means
|
a manufacturer that produces semiconductor devices on silicon wafers through a series of specific processing techniques.
|
||
|
Chip
|
means
|
an IC carrier, and also the result of design, manufacturing, packaging, and testing of IC.
|
||
|
Graphic Wafer
|
means
|
a wafer with a patterned structure on its surface.
|
||
|
Wafer Fabrication, Chip Fabrication
|
means
|
the process of manufacturing semiconductor silicon wafers into chips through a series of specific processing technology, which are divided into front wafer manufacturing and back packaging
testing.
|
||
|
IDM
|
means
|
Integrated Device Manufacture, i.e., an Integrated Device Manufacturer completes the entire industrial chain from integrated circuit design, wafer manufacturing to test and packaging.
|
||
|
Storage Device
|
means
|
a memory device in an electronic system for holding programs and data.
|
||
|
Sensor
|
means
|
a detection device, which can feel the information measured and convert it to an electrical signal or information output in any other required form according to a certain law, thus to meet
the information transmission, processing, storage, display, record and control requirements.
|
||
|
Power Device
|
means
|
a large-power electronic device for power conversion and control circuits in power equipment.
|
||
|
Discrete Device
|
means
|
a semiconductor device having a fixed single characteristic and function.
|
||
|
NAND Flash Memory
|
means
|
flash memory/data storage type flash memory.
|
||
|
5G
|
means
|
5th-Generation, i.e., the Fifth Generation of Mobile Phone Mobile Communications Standards.
|
||
|
Photoetching
|
means
|
a process in which the circuit graphics are transferred to the surface of a single crystal or dielectric layer to form effective graphics windows or functional graphics by using the
optical-chemical reaction principle and chemical and physical etching methods.
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Etching
|
means
|
the process of selectively removing unwanted material from a silicon surface by chemical or physical means, which is one of the main processes for photolithographic processing and a key
step in semiconductor manufacturing.
|
||
|
Gluing
|
means
|
the process of applying photoresist evenly to the surface of a wafer.
|
||
|
Developing
|
means
|
the process of imaging the exposed wafer, by which the graphics imaged on the optical resistance are displayed.
|
||
|
CVD
|
means
|
Chemical Vapor Deposition
|
||
|
PVD
|
means
|
Physical Vapor Deposition
|
||
|
LPCVD
|
means
|
Low Pressure Chemical Vapor Deposition
|
||
|
ALD
|
means
|
Atomic Layer Deposition, a method that can plate the substance layer by layer in the form of monatomic film.
|
||
|
DRAM
|
means
|
Dynamic Random-Access Memory
|
||
|
RAM
|
means
|
Random Access Memory, a semiconductor memory.
|
||
|
LCD
|
means
|
Liquid Crystal Display
|
||
|
MEMS
|
means
|
Mechanical System
|
||
|
MOCVD
|
means
|
Metal-organic Chemical Vapor Deposition.
|
||
|
CMP
|
means
|
Chemical Mechanical Polishing, to make the surface of a wafer completely flat or flattened.
|
||
|
SFP
|
means
|
Stress Free Polish, a technology that uses the principle of electrochemical reaction to abandon the mechanical pressure of the polishing process during the process of discarding the metal film on the surface of
the wafer to eliminate the damage of the mechanical pressure on the metal wiring.
|
||
|
VOC
|
means
|
Volatile Organic Compounds.
|
||
|
Pa
|
means
|
The unit of pressure pascal, referred to as Pa.
|
||
|
Dielectric Substance
|
means
|
all materials that can be polarized under the action of an external electric field, which usually present their electrical properties in the form of induction rather than conduction in the electric field.
|
||
|
Precursor Chemicals
|
means
|
a chemical that can be mutated into another chemical or used to make another chemical.
|
||
|
Yield
|
means
|
the percentage of the number of circuits whose test results are good accounting for the total number of circuits under test after the circuits under test have gone through all test procedures.
|
||
|
Front-End, Back-End
|
means
|
the front-end process and the back-end process in the manufacture of the semiconductor devices, with the front-end process mainly including Photoetching, Etching, cleaning, ion implantation, chemical machinery
flat etc. and the back-end process mainly including routing, Bonder, FCB, BGA reballing, inspection, testing etc.
|
||
|
Packaging
|
means
|
the process of wrapping a small piece of material (such as a Chip) in a support housing during the final phase of Semiconductor development to prevent physical damage and corrosion and to allow the Chip to be
connected to a circuit board.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Advanced Packaging
|
means
|
cutting-edge Packaging forms and technologies. At present, Packaging with Flip Chip (FC) structure, Wafer Level Packaging (WLP), System in a Package (SIP), 2.5D Packaging and 3D Packaging
etc. are considered to belong to the category of Advanced Packaging
|
||
|
FC
|
means
|
Flip Chip, a DFN structure generally containing circuit units, which is designed to be electrically and mechanically connected to a circuit by an appropriate number of solder balls on its
surface (covered by a conductive adhesive).
|
||
|
WLP
|
means
|
Wafer Level Packaging, reducing the size of the Packaging to the size of an integrated circuit Chip and the fact that it can be made in batches as a wafer reduces the cost of the Packaging.
|
||
|
SIP
|
means
|
System in a Package, which integrates a variety of functional Chips, including processors, memory and other functional Chips in a package, so as to achieve a basic complete function.
|
||
|
3D Packaging
|
means
|
the Packaging technology in which more than two Chips are stacked vertically in the same packaging body without changing the size of the package body, with the main characteristics of
multi-function, high efficiency, large capacity, high density, diploid increase of the functions and applications in unit volume and low cost.
|
||
|
Fan-out
|
means
|
a wafer reconstruction technology, by which the Chip is re-embedded on the wafer, and then the Packaging is carried out according to the steps similar to the standard WLP process. The
actual package area is larger than the chip area, and other active devices and passive components can be added to form SIP when the area is expanded.
|
||
|
Under Bump Metal, UBM
|
means
|
the metal transition layer between the solder pad and the solder ball, which is located on top of the wafer passivation layer. There are very good adhesion characteristics between UBM and
the metallized layer on the wafer and UBM also has good wetting characteristics with the solder ball, which acts as the diffusion layer of solder between the welding ball and IC metal welding pad. As an oxidation barrier layer, UBM also plays
a role in protecting the Chip.
|
||
|
UBM/RDL Technology
|
means
|
the Under-Bump Metal/redistribution layer technology, by which the undercut can be minimized while removing the barrier layer and seed layer, and the time to complete the etching step can
be controlled and accurately monitored thus to reduce the undercut and ensure the critical feature (line or bump) size.
|
||
|
Pillar Bump
|
means
|
pillar bumps.
|
||
|
FinFET
|
means
|
Fin Field-Effect Transistor, a new complementary metal-oxide semiconductor transistor, which can improve circuit control, reduce leakage current and shorten the gate length of the
transistor.
|
||
|
SC-1 Solution
|
means
|
Standard Clean 1, a solution prepared by mixing a certain proportion of ammonia water, hydrogen peroxide and water and used for cleaning semiconductor silicon wafers.
|
||
|
ppm
|
means
|
Parts per million, a concentration expressed in parts per million of the mass of the solute in the total solution mass, also known as parts per million concentration.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
IPA Drying
|
means
|
the process of using low surface tension and volatile characteristics of isopropyl alcohol (IPA) to replace the water with high surface tension on the surface of silicon wafers and then
blowing dry with nitrogen to completely dry the silicon water film.
|
||
|
PTFE
|
means
|
Poly Tetra FluoroEthylene, with the characteristics of anti-acid, anti-alkali, anti-various organic solvents, high temperature resistance and very low friction coefficient.
|
||
|
TSV
|
means
|
Through Silicon Vias, a three-dimensional (3D) vertical integration with through silicon vias (TSV) copper interconnect, which is currently considered to be one of the most advanced
technologies in the Semiconductor industry.
|
||
|
Bernoulli Chuck
|
means
|
a device that uses the Bernoulli aerodynamic suspension principle to suck the wafer on the chuck during wafer cleaning.
|
||
|
Robot Arm
|
means
|
an automatic operation device that can imitate some action functions of human hand and arm to grab and carry objects or to operate tools according to fixed procedures. The feature is that
it can complete various expected tasks through programming. The structure and performance of the device have the advantages of both human and manipulator machines.
|
||
|
SAPS Cleaning Technology
|
means
|
Space Alternative Phase Shift technology, which utilizes megasonic alternating phases to provide megasonic energy to the flat and patterned wafer surfaces in a highly uniform manner at the
microscopic level, effectively removing random defects throughout the wafer and reducing the use of chemicals.
|
||
|
TEBO Cleaning Technology
|
means
|
Timely Energized Bubble Oscillation technology, which enables damage-free cleaning of patterned Chips through the use of a series of rapid pressure changes forcing the bubbles to oscillate
in the specific size and shape, precise and multiparameter control of cavitation of bubbles in the mega-frequency ultrasonic cleaning process, and avoidance of any damage to the patterns caused by transient cavitation in traditional
supersonic cleaning.
|
||
|
Tahoe Technology
|
means
|
the cleaning technology independently developed by the Issuer, which integrates the tank module and the single-chip module in a single wet cleaning equipment and has the advantages of both;
the cleaning effect and process applicability of the Tahoe cleaner can be compared with that of single-chip cleaner, can also greatly reduce the use of sulfuric acid, help customers reduce production costs and better comply with energy
conservation and environmental protection policies.
|
||
|
Damascus Process
|
means
|
a technique derived from the ancient Damascus craftsman, in which the dielectric layer is first etched with a film of a metal conductor and then filled with metal, with the feature that the
metal layer does not need to be etched.
|
||
|
Process, Node and Manufacturing Procedure
|
means
|
the size of the transistor gate width, used to measure the level of semiconductor chip manufacturing.
|
||
|
Moore’s Law
|
means
|
the Moore’s Law put forward by Gordon Moore, i.e., the number of transistors on an integrated circuit doubles every 18 months, the corresponding performance doubles, and the cost drops by
half.
|
||
|
ECP
|
means
|
Electro Chemical Plating, the process of coating the surface of a wafer with a thin layer of other metals or alloys by using the electrolysis principle.
|
||
|
mm
|
means
|
Millimeter, 10-3 meter, a unit used to describe the diameter of a Semiconductor Wafer.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
μm
|
means
|
Micrometer, 10-6 meter
|
||
|
nm
|
means
|
Nanometer, 10-9 meter
|
||
|
Gartner
|
means
|
a leading research and consulting company in the field of IT. Its research scope covers the entire IT industry from the upstream hardware design and manufacture and to the downstream
terminal applications.
|
||
|
WSTS
|
means
|
World Semiconductor Trade Statistics, a data statistics company in the semiconductor industry whose members include the world’s leading semiconductor manufacturers.
|
||
|
SEMI
|
means
|
Semiconductor Equipment and Materials International
|
||
|
VLSI Research
|
means
|
a leading research consultancy in the field of integrated circuits and pan-semiconductors, providing market research and economic analysis on technology, business and economics for the semiconductor industry
chain. It rates and ranks the world’s IC and pan-semiconductor manufacturing and equipment companies annually.
|
||
|
Yole
|
means
|
Yole Dévelopment, which provides market research, technology analysis, strategy consulting, targeted media and financial advisory services.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(I) Overview of the Issuer
|
|||
|
Issuer’s Name
|
ACM Research (Shanghai), Inc.
|
Date of Establishment
|
May 17, 2005
|
|
Registered Capital
|
RMB 390,201,300 Yuan
|
Legal Representative
|
HUI WANG
|
|
Registered Address
|
Building 4, No.1690 Cailun Road, China (Shanghai) Pilot Free Trade Zone
|
Main Production and Operation Premises
|
Building 4, No.1690 Cailun Road, China (Shanghai) Pilot Free Trade Zone
|
|
Controlling Shareholder
|
ACM Research, Inc.
|
Actual Controller
|
HUI WANG
|
|
Classification of Industry
|
Special Equipment Manufacturing (Classification Code: C35)
|
Status of Listing (Applying to List) on Another Exchange
|
None
|
|
(II) The Intermediaries for the Offering
|
|||
|
Sponsor
|
[***]
|
Lead Underwriter
|
[***]
|
|
Issuer’s Lawyer
|
King & Wood Mallesons
|
Joint Lead Underwriter
|
[***]
|
|
Audit Institution
|
BDO CHINA SHU LUN PAN Certified Public Accountants LLP
|
Appraisal Agency
|
China United Assets Appraisal Group Co., Ltd.
|
|
(I) Basic Information of the Offering
|
|||
|
Class of Shares
|
RMB-denominated Common Shares (A Shares)
|
||
|
Par Value per Share
|
RMB 1.00 Yuan
|
||
|
Number of Shares in the Offering
|
43,355,753 shares
|
Proportion in the Total Share Capital after the Offering
|
10.00%
|
|
Thereinto: Number of New Shares
|
43,355,753 shares
|
Proportion in the Total Share Capital after the Offering
|
10.00%
|
|
Number of Shares Offered by Shareholders
|
-
|
Proportion in the Total Share Capital after the Offering
|
-
|
|
Total Share Capital after the Offering
|
433,557,100 shares
|
||
|
Offering Price per Share
|
RMB 85.00 Yuan
|
||
|
Offering P/E
|
398.67 Times (offering price per share divided by earnings per share, of which, the earnings per share are calculated by dividing the lower of the audited net profits attributable to owners
of the parent company before and after deducting non-recurring profit and loss in the year 2020 by the total share capital after the Offering)
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Net Asset Value per Share Prior to the Offering
|
RMB 2.94 Yuan/Share (calculated by dividing the audited shareholder’s equity attributable to the parent company on the date of June 30, 2021 by the total share capital prior to the
Offering)
|
Earnings per Share Prior to the Offering
|
RMB 0.24 Yuan/Share (calculated by dividing the lower of the audited net profits attributable to owners of the parent company before and after deducting non-recurring profit and loss in the
year 2020 by the total share capital after the Offering)
|
|
Net Asset Value per Share after the Offering
|
RMB 10.68 Yuan (calculated by dividing the owner’s equity attributable to the parent company after the Offering by the total share capital after the Offering, of which, the owner’s equity
attributable to the parent company after the Offering is calculated by the sum of the audited owner’s equity attributable to the parent company as at June 30, 2021 and the net fund raised)
|
Earnings per Share after the Offering
|
RMB 0.21 Yuan (calculated by dividing the lower of the audited net profits attributable to owners of the parent company before and after deducting non-recurring profit and loss in the year
2020 by the total share capital after the Offering)
|
|
Offering P/B
|
7.96 Times (calculated by dividing the offering price per share by the net asset value per share after the Offering)
|
||
|
Offering Mode
|
The combination mode of private placement to strategic investors, offline inquiry placing to qualified investors and online fixed-price offering to social public investors holding
non-restricted A shares and non-restricted depositary receipts in Shanghai market will be adopted for the Offering.
|
||
|
Offering Targets
|
Qualified strategic investors, inquiry objects and domestic natural persons, legal persons and other investors opening accounts of the SSE and enabling trading on the STAR Market (other
than those prohibited by laws, regulations and the business rules of the SSE).
|
||
|
Underwriting Mode
|
Stand-by Underwriting
|
||
|
Name of Shareholders Proposing to Offer Shares to the Public
|
N/A
|
||
|
Principle of Offering Expenses Sharing
|
-
|
||
|
Total Fund Raised
|
RMB 3,685.239 million Yuan
|
||
|
Net Fund Raised
|
RMB 3,481.2585 million Yuan
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Projects to be Invested by the Fund Raised
|
1. ACMSH equipment R&D and manufacturing center
|
|
|
2. ACMSH high end semiconductor equipment R&D project
|
||
|
3. Supplementing working capital
|
||
|
Estimated Offering Expenses
|
Sponsor and underwriting fees
|
RMB 173.832 million Yuan
(excluding tax)
|
|
Accounting fees
|
RMB 12.467 million Yuan (excluding tax)
|
|
|
Lawyer’s fees
|
RMB 10.9045 million Yuan (excluding tax)
|
|
|
Information disclosure fees
|
RMB 4.5755 million Yuan (excluding tax)
|
|
|
Offering service charges
|
RMB 2.2015 million Yuan (excluding tax)
|
|
|
Note: The offering service charges amounted to RMB 1.331 million Yuan in the [***] disclosed last time, the difference between which and those in the [***] lying in the stamp tax of RMB
870,500 Yuan for the Offering. Except for such adjustment, there is no other adjustment to the offering expenses.
|
||
|
(II) Important Dates for the Offering
|
||
|
Date of Initial Bidding
|
November 3, 2021
|
|
|
Date for Publication of Offering Notice
|
November 5, 2021
|
|
|
Subscription Date
|
November 8, 2021
|
|
|
Payment Date
|
November 10, 2021
|
|
|
Listing Date
|
After the Offering, the Company will apply for listing on the STAR Market of SSE as soon as possible.
|
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Total Assets (RMB 10,000 Yuan)
|
229,393.43
|
184,352.37
|
130,800.15
|
63,602.25
|
|
Owner’s Equity Attributable to Parent Company (RMB 10,000 Yuan)
|
114,743.11
|
104,867.33
|
82,992.90
|
14,504.75
|
|
Debt Asset Ratio (Parent Company)
|
40.83%
|
35.60%
|
32.56%
|
76.34%
|
|
Item
|
From Jan.
to Jun. 2021
|
2020
|
2019
|
2018
|
|
Operating Income (RMB 10,000 Yuan)
|
62,528.08
|
100,747.18
|
75,673.30
|
55,026.91
|
|
Net Profit (RMB 10,000 Yuan)
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net Profit Attributable to the Shareholders of the Issuer (RMB 10,000 Yuan)
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net Profit Attributable to the Parent Company after Deduction of Non-recurring Profit and Loss (RMB 10,000 Yuan)
|
4,885.66
|
9,243.78
|
13,047.50
|
7,140.06
|
|
Basic Earnings per Share (RMB 1 Yuan)
|
0.23
|
0.50
|
0.36
|
N/A
|
|
Diluted Earnings per Share (RMB 1 Yuan)
|
0.23
|
0.50
|
0.36
|
N/A
|
|
Weighted Average Return on Equity (%)
|
8.20
|
21.20
|
34.22
|
137.72
|
|
Net Cash Flow from the Operating Activities (RMB 10,000 Yuan)
|
4,093.21
|
-8,824.49
|
7,270.65
|
3,881.03
|
|
Cash Dividends (RMB 10,000 Yuan)
|
-
|
-
|
-
|
-
|
|
R & D Expenditure as a Percentage of Operating Income (%)
|
18.33
|
13.97
|
13.12
|
14.43
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Field of the Customer
|
Names of Customers
|
|
1
|
Wafer Fabrication
|
Hynix, Huahong Group, Yangtze Memory, SMIC, Hefei Changxin
|
|
2
|
Advanced Packaging
|
JCET, TFME, SJsemi, Nepes
|
|
3
|
Semiconductor Wafer Manufacturing and Recycling
|
ZING SEMI, JRH, Wafer Works, PSI
|
|
4
|
Scientific Research Institutions
|
Institute of Microelectronics of the Chinese Academy of Sciences, Shanghai IC R&D Center Co., Ltd., NCAP
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Ratio
|
Amount
|
Ratio
|
Amount
|
Ratio
|
Amount
|
Ratio
|
|
|
Semiconductor Cleaning Equipment
|
48,900.39
|
83.16%
|
81,627.25
|
83.69%
|
62,522.30
|
84.10%
|
50,135.96
|
92.91%
|
|
Including: Single-wafer Cleaning Equipment
|
43,884.74
|
74.63%
|
71,610.80
|
73.42%
|
55,099.52
|
74.12%
|
50,135.96
|
92.91%
|
|
Wet Bench Cleaning Equipment
|
5,015.65
|
8.53%
|
3,310.85
|
3.39%
|
4,801.36
|
6.46%
|
-
|
-
|
|
Single Wafer Wet Bench Combined Cleaning Equipment
|
-
|
-
|
6,705.60
|
6.88%
|
2,621.43
|
3.53%
|
-
|
-
|
|
Semiconductor Electro-plating Equipment
|
3,591.85
|
6.11%
|
5,290.13
|
5.42%
|
7,857.39
|
10.57%
|
1,191.13
|
2.21%
|
|
Advanced Packaging Wet Processing Equipment
|
6,312.54
|
10.73%
|
9,856.51
|
10.11%
|
3,961.12
|
5.33%
|
2,634.07
|
4.88%
|
|
Vertical furnace tube equipment
|
-
|
-
|
758.90
|
0.78%
|
-
|
-
|
-
|
-
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Ranking
|
Name of Enterprise
|
|
1
|
AMEC
|
|
2
|
NAURA
|
|
3
|
CETC Electronics Equipment Group Co., Ltd.
|
|
4
|
ACMSH
|
|
5
|
KINGSEMI
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Industry
field of the
Company
|
✓ Next-generation information and technology
|
The Company is in the “special equipment manufacturing industry” (C35) according to the Guidelines for the Industry Classification of Listed Companies (2012 Revision)
issued by the CSRC and engaged in the “manufacturing of special equipment for semiconductor devices” (C3562) under the “special equipment manufacturing industry” according to the Industrial Classification
for National Economic Activities (GB/T 4754-2017) issued by the National Bureau of Statistics. Pursuant to the Classification of Strategic Emerging Industries (2018) issued by the National
Bureau of Statistics, the manufacturing of special equipment for semiconductor devices engaged by the Company is a strategic emerging industry, as follows: 1. new-generation information and technology industry - 1.2 electronic core industry -
1.2.1 new electronic components and equipment manufacturing - manufacturing of special equipment for semiconductor devices.
|
|
☐ High-end equipment
|
||
|
☐ New materials
|
||
|
☐ New energy
|
||
|
☐ Energy saving and environmental protection
|
||
|
☐ Biomedicine
|
||
|
☐ Other fields in line with the positioning of the STAR Market
|
|
Criteria for evaluating the science and
technology innovation attributes
|
Whether the
criterion is
met
|
Indicators
|
|
|
Its research and development investment accounts for 5% or more of operating income in the last three years, or its total research and development investment in the last three years exceeds RMB 60 million Yuan.
|
✓ Yes
☐ No
|
In 2018, 2019 and 2020, the Company’s research and development investment totals to RMB 319.4741 million Yuan, accounting for 13.80% of the total operating income of RMB 2,314.4738 million Yuan in the last
three years, meeting the requirements defined in Article 1 (1) of the Guidelines for the Evaluation of Science and Technology Innovation Attributes (for Trial Implementation).
|
|
|
Its research and development personnel account for 10% or more of the total number of its employees in the corresponding year.
|
✓ Yes
☐ No
|
In 2020, the Company’s research and development personnel accounted for 42.07% of the total number of its employees, meeting the requirements defined in Article 1 (2) of the Guidelines
for the Evaluation of Science and Technology Innovation Attributes (for Trial Implementation).
|
|
|
It has five or more patents for invention (including defense patents) generating main operating income.
|
✓ Yes
☐ No
|
As of June 30, 2021, the Company has been granted 322 patents, including 317 invention patents, and in 2018, 2019 and 2020, its income from core technology products accounted for 98.06%, 98.24% and 96.81% of
its operating income, respectively, thereby meeting the requirements defined in Article 1 (3) of the Guidelines for the Evaluation of Science and Technology Innovation Attributes (for Trial Implementation).
|
|
|
The compound growth rate of its operating income in the last three years reaches 20%, or its operating income in the last year reaches RMB 0.3 billion Yuan.
|
✓ Yes
☐ No
|
In 2018, 2019 and 2020, the Company’s operating income was RMB 550,269,100 Yuan, RMB 756,733,000 Yuan and RMB 1,007,471,800 Yuan, respectively, with a compound growth rate of 35.31% in the last three years,
meeting the requirements defined in Article 1 (4) of the Guidelines for the Evaluation of Science and Technology Innovation Attributes (for Trial Implementation).
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Investment Orientation of the Raised Fund
|
Total
Investment
|
Amount of the Raised Fund
to be Used
|
|
1
|
ACMSH Equipment R&D and Manufacturing Center
|
88,245
|
70,000
|
|
2
|
ACMSH High-end Semiconductor Equipment R&D Project
|
45,000
|
45,000
|
|
3
|
To Supplement Liquidity
|
65,000
|
65,000
|
|
Total
|
198,245
|
180,000
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
RMB-denominated Common Shares (A Shares)
|
|
|
(II) Par Value per Share:
|
RMB 1.00 Yuan
|
|
(III) Number of Shares in the Offering:
|
The number of shares offered in the Public Offering shall be 43,355,753.00, accounting for 10.00% of the total share capital of the Company after the Offering. The Offering does not involve
any public offering of shares by shareholders.
|
|
(IV) Offering Price per Share:
|
RMB 85.00 Yuan/Share
|
|
(V) Participation of the Issuer’s Senior Executives and Employees in Strategic Placement:
|
On November 4, 2020, the Company held the 9th session of the first board of directors, deliberating and passing the Proposal on the Participation of
Officers and Core Employees in the Strategic Placement of the Offering and Listing, whereby some senior executives and core employees of the Company are allowed to participate in the strategic placement of the Offering and Listing by
establishing a special asset management plan and to subscribe for up to 10% of the shares in the Offering. On August 27, 2021, the Company held the 12th session of the first board of directors, deliberating and approving the Proposal on Adjusting the Company’s Senior Executives and New Core Employees Participating in the Strategic Placement of the Offering and Listing, pursuant to which the list of senior executives and core
employees participating in the strategic placement of the Offering and Listing was adjusted, and finally no one other than those in the list would be permitted to actually participate therein. The number of shares participated by the
aforementioned asset management plan in the strategic placement is 3,219,198, accounting for 7.43% of the total number of shares in the Public Offering. The Collective Asset Management Plan of CICC Wealth Management - ACMSH Employees
Participating in the Strategic Placement Involving the STAR Market undertakes that the shares available to it in the placement will be subject to a lock-up period of 12 months from the date of the Issuer’s IPO and Listing.
|
|
(VI) Participation of the Sponsor’s Subsidiaries in Strategic Placement:
|
[***], a subsidiary of [***], is arranged by the latter to participate in the strategic placement concerning the Offering, with the number of follow-up investment shares to be 1,176,470
accounting for 2.71% of the shares in the Public Offering. The said shares placed to [***] shall be subject to a lock-up period of 24 months from the date of the IPO and Listing of the Issuer.
|
|
(VII) Offering P/E:
|
398.67 Times (calculated by the offering price dividing by the earnings per share; the earnings per share is calculated by dividing the lower of the audited net profits attributable to
shareholders of the parent company before and after deducting non-recurring profit and loss in the year 2020 by the total share capital after the Offering)
|
|
(VIII) Net Asset Value per Share Prior to the Offering:
|
RMB 2.94 Yuan/Share (calculated by dividing the audited shareholder’s equity attributable to the parent company on the date of June 30, 2021 by the total share capital prior to the
Offering)
|
|
(IX) Net Asset Value per Share after the Offering:
|
RMB 10.68 Yuan/Share (calculated by dividing the sum of the audited shareholder’s equity attributable to the parent company on the date of June 30, 2021 plus the net proceeds of the
Offering by the total share capital after the Offering)
|
|
(X) Offering P/B:
|
7.96 Times (calculated by dividing the offering price per share by the net assets per share after the Offering)
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(XI) Offering Mode:
|
The combination mode of private placement to strategic investors, offline inquiry placing to qualified investors and online fixed-price offering to social public investors holding
non-restricted A shares and non-restricted depositary receipts in Shanghai market will be adopted for the Offering.
|
|
|
(XII) Offering Targets:
|
Qualified strategic investors, inquiry objects and domestic natural persons, legal persons and other investors opening accounts of the SSE and enabling trading on the STAR Market (other
than those prohibited by laws, regulations and the business rules of the SSE).
|
|
|
(XIII) Underwriting Mode:
|
Stand-by Underwriting
|
|
|
(XIV) Estimated Offering Fees:
|
Sponsor and underwriting fees
|
RMB 173.832 million Yuan (excluding tax)
|
|
Accounting fees
|
RMB 12.467 million Yuan (excluding tax)
|
|
|
Lawyer’s fees
|
RMB 10.9045 million Yuan (excluding tax)
|
|
|
Information disclosure fees
|
RMB 4.5755 million Yuan (excluding tax)
|
|
|
Offering service charges
|
RMB 2.2015 million Yuan (excluding tax)
|
|
|
Note: The offering service charges amounted to RMB 1.331 million Yuan in the [***] disclosed last time, the difference between which and those in the [***] lying in the stamp tax of RMB
870,500 Yuan for the Offering. Except for such adjustment, there is no other adjustment to the offering expenses.
|
||
|
(I) Issuer
|
|
|
Name
|
ACM Research (Shanghai), Inc.
|
|
Legal Representative
|
HUI WANG
|
|
Domicile
|
Building 4, No.1690 Cailun Road, China (Shanghai) Pilot Free Trade Zone
|
|
Telephone
|
021-50808868
|
|
Fax
|
021-50808860
|
|
Contact Person
|
MINGZHU LUO
|
|
(II) Sponsor (Lead Underwriter)
|
|
|
Name
|
[***]
|
|
Legal Representative
|
[***]
|
|
Domicile
|
[***]
|
|
Telephone
|
[***]
|
|
Fax
|
[***]
|
|
Sponsor Representatives
|
[***]
|
|
Project Co-organizer
|
|
|
Project Managers
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(III) Joint Lead Underwriter
|
|
|
Name
|
[***]
|
|
Legal Representative
|
[***]
|
|
Domicile
|
[***]
|
|
Telephone
|
[***]
|
|
Fax
|
[***]
|
|
Project Managers
|
[***]
|
|
(IV) Law Firm
|
|
|
Name
|
King & Wood Mallesons
|
|
Person in Charge
|
LING WANG
|
|
Domicile
|
17th & 18th Floors, East Tower, World Financial Center 1, No.1 Dongsanhuan Zhonglu, Chaoyang District, Beijing
|
|
Telephone
|
010-58785588
|
|
Fax
|
010-58785599
|
|
Responsible Lawyers
|
HUI XU, FUAN CHEN, ANRONG WANG
|
|
(V) Accounting Firm
|
|
|
Name
|
BDO CHINA SHU LUN PAN Certified Public Accountants LLP
|
|
Managing Partner
|
ZHIGUO YANG
|
|
Domicile
|
4 F, No.61 East Nanjing Road, Huangpu District, Shanghai
|
|
Telephone
|
0755-82584611
|
|
Fax
|
0755-82584611
|
|
Responsible Certified Public Accountants
|
YI TANG, JING Zhao
|
|
(VI) Asset Appraisal Agency
|
|
|
Name
|
China United Assets Appraisal Group Co., Ltd.
|
|
Legal Representative
|
ZHI HU
|
|
Domicile
|
F4, East Block, Kaichen World Trade Center, 28 Fuxingmennei Street, Xicheng District, Beijing
|
|
Telephone
|
010-88000066
|
|
Fax
|
010-88000066
|
|
Responsible Certified Appraisers
|
WEI LIU and QIQUAN GE
|
|
(VII) Stock Registrar
|
|
|
Name
|
China Securities Depository and Clearing Corporation Limited Shanghai Branch
|
|
Domicile
|
188 Yanggao South Road, China (Shanghai) Pilot Free Trade Zone
|
|
Telephone
|
021-58708888
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(VIII) Recipient Bank
|
|
|
Account Name
|
[***]
|
|
Opening Bank
|
[***]
|
|
Account Number
|
[***]
|
|
(IX) Stock Exchange Applied for Listing
|
|
|
Name
|
Shanghai Stock Exchange
|
|
Domicile
|
Shanghai Stock Exchange Building, 528 Pudong South Road, Shanghai
|
|
Telephone
|
021-68808888
|
|
Date of Initial Bidding
|
November 3, 2021
|
|
Date for Publication of Offering Notice
|
November 5, 2021
|
|
Subscription Date
|
November 8, 2021
|
|
Payment Date
|
November 10, 2021
|
|
Listing Date
|
After the Offering, the Company will apply for listing on the STAR Market of SSE as soon as possible.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name of Strategic Investor
|
Number of Placed Shares (10,000
Shares)
|
Placed Amount
(RMB 1 Yuan)
|
Brokerage
Commission for
New Share
Placement (RMB 1
Yuan)
|
Lock-up
Period
|
|
[***]
|
117.6470
|
99,999,950.00
|
-
|
24 months
|
|
CICC Wealth Management - ACMSH Employees Participating in the Strategic Placement Involving the STAR Market
|
321.9198
|
273,631,830.00
|
1,368,159.15
|
12 months
|
|
Shanghai Guosheng Group Co., Ltd.
|
43.3558
|
36,852,430.00
|
184,262.15
|
12 months
|
|
Shanghai Pudong Technology Innovation Group Co., Ltd.
|
43.3558
|
36,852,430.00
|
184,262.15
|
12 months
|
|
Shanghai Science and Technology Venture Capital (Group) Co., Ltd.
|
65.0337
|
55,278,645.00
|
276,393.23
|
12 months
|
|
Shanghai Huali Microelectronics Corporation
|
70.2370
|
59,701,450.00
|
298,507.25
|
12 months
|
|
Beijing Yitang Tongzhou Equity Investment Center (L.P.)
|
43.3558
|
36,852,430.00
|
184,262.15
|
12 months
|
|
Will Semiconductor CO., Ltd. Shanghai
|
43.3558
|
36,852,430.00
|
184,262.15
|
12 months
|
|
Shanghai Zhangjiang Science and Technology Venture Capital Co., Ltd.
|
21.6750
|
18,423,750.00
|
92,118.75
|
12 months
|
|
Total
|
769.9357
|
654,445,345.00
|
2,772,226.98
|
-
|
|
Actual dominant
entity
|
Record No.
|
Date of
establishment
time
|
Size of
raised funds
(RMB
10,000
Yuan)
|
Upper limit of
subscription size
(including brokerage
commission for
placement of new
shares) (RMB
10,000 Yuan)
|
Manager
|
|
|
CICC Wealth Management - ACMSH Employees Participating in the Strategic Placement Involving the STAR Market
|
CHINA CICC WEALTH MANAGEMENT SECURITIES COMPANY LIMITED
|
SSR594
|
September 24, 2021
|
27,500
|
27,500
|
CHINA CICC WEALTH MANAGEMENT SECURITIES COMPANY LIMITED
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
S/N
|
Name
|
Position
|
Paid-in amount (RMB
10,000 Yuan)
|
Proportion of shares
held under the asset
management plan
(%)
|
Employee category
|
|
1
|
WANG HUI
|
Chairman
|
3,000
|
10.91
|
Core employee
|
|
2
|
WANG JIAN
|
General Manager
|
6,000
|
21.82
|
Senior executive
|
|
3
|
FUPING CHEN
|
Vice General Manager
|
3,600
|
13.09
|
Senior executive
|
|
4
|
MINGZHU LUO
|
Board Secretary
|
1,100
|
4.00
|
Senior executive
|
|
5
|
WANG JUN
|
Deputy General Manager of Engineering
|
900
|
3.27
|
Core employee
|
|
6
|
XUEJUN LI
|
Deputy General Manager of After-sales Service
|
825
|
3.00
|
Core employee
|
|
7
|
FENG LISA YI LU
|
Financial Director
|
600
|
2.18
|
Senior executive
|
|
8
|
XIAOYAN ZHANG
|
Process Director
|
571
|
2.08
|
Core employee
|
|
9
|
YAN LI
|
Purchasing Director
|
530
|
1.93
|
Core employee
|
|
10
|
GUANGYU XIA
|
After-sales Service Director
|
495
|
1.80
|
Core employee
|
|
11
|
JUN WU
|
Mechanical Director
|
460
|
1.67
|
Core employee
|
|
12
|
SHENA JIA
|
Mechanical Director
|
430
|
1.56
|
Core employee
|
|
13
|
XIAOFENG TAO
|
Mechanical Director
|
375
|
1.36
|
Core employee
|
|
14
|
YINUO JIN
|
Process Director
|
360
|
1.31
|
Core employee
|
|
15
|
XIAYUN YANG
|
HR Director
|
350
|
1.27
|
Core employee
|
|
16
|
ZHENMING CHU
|
Process Manager
|
345
|
1.25
|
Core employee
|
|
17
|
WENJUN WANG
|
Process Director
|
344
|
1.25
|
Core employee
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
18
|
HU ZHAO
|
After-sales Service Director
|
315
|
1.15
|
Core employee
|
|
19
|
SHU YANG
|
Process Manager
|
305
|
1.11
|
Core employee
|
|
20
|
LAN WANG
|
Chief Financial Officer
|
270
|
0.98
|
Core employee
|
|
21
|
FANGYONG ZHEN
|
After-sales Service Manager
|
245
|
0.89
|
Core employee
|
|
22
|
GUANGBO HAN
|
Marketing Manager
|
230
|
0.84
|
Core employee
|
|
23
|
ZHAOWEI JIA
|
Process Director
|
215
|
0.78
|
Core employee
|
|
24
|
SHAN ZHANG
|
Process Manager
|
210
|
0.76
|
Core employee
|
|
25
|
XI WANG
|
Marketing Director
|
195
|
0.71
|
Core employee
|
|
26
|
QIANG WANG
|
After-sales Service Manager
|
195
|
0.71
|
Core employee
|
|
27
|
HUI SHEN
|
Software Director
|
195
|
0.71
|
Core employee
|
|
28
|
ANYUN BI
|
Finance Manager
|
190
|
0.69
|
Core employee
|
|
29
|
YU NIE
|
Standardization Manager
|
180
|
0.65
|
Core employee
|
|
30
|
XIAOQUN WANG
|
Quality Manager
|
165
|
0.60
|
Core employee
|
|
31
|
WEI ZHANG
|
After-sales Service Manager
|
165
|
0.60
|
Core employee
|
|
32
|
DEYUN WANG
|
Software Director
|
158
|
0.57
|
Core employee
|
|
33
|
XINZHENG WANG
|
Project Director
|
155
|
0.56
|
Core employee
|
|
34
|
WENJUN HU
|
After-sales Service Manager
|
145
|
0.53
|
Core employee
|
|
35
|
XINPING DENG
|
Mechanical Manager
|
142
|
0.52
|
Core employee
|
|
36
|
DONGCHENG ZHOU
|
After-sales Service Manager
|
130
|
0.47
|
Core employee
|
|
37
|
HONGCHAO YANG
|
Mechanical Director
|
130
|
0.47
|
Core employee
|
|
38
|
YANLI HU
|
Patent Manager
|
130
|
0.47
|
Core employee
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
39
|
GUANZHONG LU
|
Technical Sales Director
|
130
|
0.47
|
Core employee
|
|
40
|
WENQING JI
|
Information Technology Manager
|
130
|
0.47
|
Core employee
|
|
41
|
LIU FENG
|
Sales Manager
|
130
|
0.47
|
Core employee
|
|
42
|
FEI HUO
|
Project Manager
|
130
|
0.47
|
Core employee
|
|
43
|
DANYING WANG
|
Sales Manager
|
125
|
0.45
|
Core employee
|
|
44
|
YULU HU
|
Electrical Director
|
120
|
0.44
|
Core employee
|
|
45
|
YU WANG
|
Software Manager
|
105
|
0.38
|
Core employee
|
|
46
|
CHUANYUN ZHU
|
Assembly Manager
|
105
|
0.38
|
Core employee
|
|
47
|
LEI WU
|
Mechanical Manager
|
105
|
0.38
|
Core employee
|
|
48
|
ZHENJIANG QIN
|
Mechanical Manager
|
105
|
0.38
|
Core employee
|
|
49
|
XIAOHUI ZHANG
|
HR Manager
|
105
|
0.38
|
Core employee
|
|
50
|
RONG XU
|
Process Manager
|
105
|
0.38
|
Core employee
|
|
51
|
YUNCHEN YU
|
Electrical Manager
|
105
|
0.38
|
Core employee
|
|
52
|
MINLI GU
|
Finance Manager
|
105
|
0.38
|
Core employee
|
|
53
|
LAN XI
|
Administrative Manager
|
105
|
0.38
|
Core employee
|
|
54
|
YUAN ZONG
|
Process Manager
|
105
|
0.38
|
Core employee
|
|
55
|
XIAOWEI DI
|
Test Manager
|
105
|
0.38
|
Core employee
|
|
56
|
RONG CAO
|
Laboratory Manager
|
105
|
0.38
|
Core employee
|
|
57
|
CHENHUA LU
|
Process Manager
|
105
|
0.38
|
Core employee
|
|
58
|
YINGWEI DAI
|
Safety Manager
|
105
|
0.38
|
Core employee
|
|
59
|
CHENG CHENG
|
Mechanical Manager
|
105
|
0.38
|
Core employee
|
|
60
|
XINXIN JIAO
|
Mechanical Manager
|
105
|
0.38
|
Core employee
|
|
61
|
XIAOCHENG GU
|
Sales Manager
|
105
|
0.38
|
Core employee
|
|
62
|
LEI GUAN
|
Planning Manager
|
100
|
0.36
|
Core employee
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
63
|
LING ZHU
|
After-sales Service Manager
|
100
|
0.36
|
Core employee
|
|
64
|
FENG WANG
|
Purchasing Manager
|
100
|
0.36
|
Core employee
|
|
65
|
YUN SUN
|
Assembly Manager
|
100
|
0.36
|
Core employee
|
|
66
|
QI ZHU
|
Project Manager
|
100
|
0.36
|
Core employee
|
|
67
|
JUNZHUO WU
|
Electrical Manager
|
100
|
0.36
|
Core employee
|
|
Total
|
27,500
|
100.00
|
-
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| I. |
Overview of the Issuer
|
|
Name:
|
盛美半导体设备(上海)股份有限公司
|
|
English Name:
|
ACM Research (Shanghai), Inc
|
|
Legal Representative:
|
HUI WANG
|
|
Share Capital:
|
RMB 390,201,347 Yuan
|
|
Date of Establishment:
|
May 17, 2005
|
|
Date of Overall Change:
|
November 21, 2019
|
|
Domicile:
|
Building 4, No.1690 Cailun Road, China (Shanghai) Pilot Free Trade Zone
|
|
Post Code:
|
201203
|
|
Telephone:
|
021-50808868
|
|
Fax:
|
021-50808860
|
|
Internet Address:
|
www.acmrcsh.com.cn
|
|
Email Address:
|
ir@acmrcsh.com
|
|
Information Disclosure Department:
|
Board Office
|
|
Person in Charge of Information Disclosure:
|
MINGZHU LUO
|
|
Telephone of the Information Disclosure Department:
|
021-50276506
|
| (I) |
Establishment of ACM Research (Shanghai), Inc.
|
|
No.
|
Name of
Shareholder
|
Subscribed Capital
Contribution (Ten Thousand US)
|
Paid-up Capital Contribution
(Ten Thousand US)
|
Proportion of
Shareholding (%)
|
|
1
|
ACMR
|
120
|
18.0088
|
100
|
|
Total
|
120
|
18.0088
|
100
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| (II) |
Establishment of ACMSH
|
|
No.
|
Name of Shareholders
|
Shares Held (Ten Thousand
Shares)
|
Proportion of Shareholding (%)
|
|
1
|
ACMR
|
35,769.2308
|
95.99
|
|
2
|
Xinwei Consulting
|
475.6154
|
1.28
|
|
3
|
[***]
|
230.7692
|
0.62
|
|
4
|
Jinpu Investment
|
192.3077
|
0.52
|
|
5
|
Taihu Guolian
|
192.3077
|
0.52
|
|
6
|
Xinshi Consulting
|
178.1923
|
0.48
|
|
7
|
Hai Feng Investment
|
153.8462
|
0.41
|
|
8
|
Xingang Consulting
|
72.7115
|
0.20
|
|
Total
|
37,264.9808
|
100.00
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
2019/
December 31, 2019
|
2018/
December 31, 2018
|
2017/
December 31, 2017
|
|
Consolidated Financial Statements
|
|||
|
Operating Income
|
75,673.30
|
55,026.91
|
25,358.73
|
|
Net Profit
|
13,488.73
|
9,253.04
|
1,086.06
|
|
Undistributed Profit
|
6,559.47
|
-7,598.98
|
-16,852.02
|
|
Financial Statements of the Parent Company
|
|||
|
Operating Income
|
72,799.03
|
53,826.81
|
25,358.73
|
|
Net Profit
|
14,076.03
|
8,785.44
|
1,091.39
|
|
Undistributed Profit
|
6,724.45
|
-8,021.29
|
-16,806.73
|
|
Debit/Credit
|
Accounting Name
|
Amount
|
|
Debit
|
Paid-up Capital
|
37,264.98
|
|
Debit
|
Undistributed Profit
|
-1,416.88
|
|
Debit
|
Capital Reserves
|
19,440.89
|
|
Credit
|
Share Capital
|
37,264.98
|
|
Credit
|
Capital Reserves - Share Premium
|
18,024.01
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| (III) |
Changes in the shareholders of the Issuer
|
| 1. |
Equity Structure of the Issuer at the Beginning of the Reporting Period
|
|
No.
|
Name of Shareholder
|
Subscribed Capital
Contribution (RMB 10,000
Yuan)
|
Paid-up Capital Contribution
(RMB 10,000 Yuan)
|
Proportion of
Shareholding (%)
|
|
1
|
ACMR
|
13,400.0000
|
13,400.0000
|
62.87
|
|
2
|
Shanghai Venture Capital Co., Ltd.
|
4,000.0000
|
4,000.0000
|
18.77
|
|
3
|
ZJTVC
|
1,615.1250
|
1,615.1250
|
7.58
|
|
4
|
PDHTI
|
2,297.3700
|
2,297.3700
|
10.78
|
|
Total
|
21,312.4950
|
21,312.4950
|
100.00
|
|
| 2. |
In August, 2017, the Second Equity Transfer of ACMSH
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name of Shareholder
|
Subscribed Capital
Contribution (RMB
10,000 Yuan)
|
Paid-up Capital
Contribution (RMB
10,000 Yuan)
|
Proportion of
Shareholding (%)
|
|
1
|
ACMR
|
17,400.0000
|
17,400.0000
|
81.64
|
|
2
|
ZJTVC
|
1,615.1250
|
1,615.1250
|
7.58
|
|
3
|
PDHTI
|
2,297.3700
|
2,297.3700
|
10.78
|
|
Total
|
21,312.4950
|
21,312.4950
|
100.00
|
|
| 3. |
In November, 2017, the Third Equity Transfer of ACMSH
|
|
No.
|
Name of Shareholder
|
Subscribed Capital
Contribution (RMB 10,000
Yuan)
|
Paid-up Capital
Contribution (RMB
10,000 Yuan)
|
Proportion of
Shareholding (%)
|
|
1
|
ACMR
|
21,312.4950
|
21,312.4950
|
100.00
|
|
Total
|
21,312.4950
|
21,312.4950
|
100.00
|
|
| 4. |
In May, 2019, the Fourth Capital Increase of ACMSH
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name of Shareholder
|
Subscribed Capital
Contribution (RMB 10,000
Yuan)
|
Paid-up Capital
Contribution (RMB
10,000 Yuan)
|
Proportion of
Shareholding (%)
|
|
1
|
ACMR
|
35,769.2308
|
35,769.2308
|
100.00
|
|
Total
|
35,769.2308
|
35,769.2308
|
100.00
|
|
| 5. |
In June, 2019, the Fifth Capital Increase of ACMSH
|
|
No.
|
Name of Shareholder
|
Subscribed Capital
Contribution (RMB
10,000 Yuan)
|
Paid-up Capital
Contribution (RMB
10,000 Yuan)
|
Proportion of
Shareholding (%)
|
|
1
|
ACMR
|
35,769.2308
|
35,769.2308
|
95.99
|
|
2
|
Xinwei Consulting
|
475.6154
|
475.6154
|
1.28
|
|
3
|
[***]
|
230.7692
|
230.7692
|
0.62
|
|
4
|
Jinpu Investment
|
192.3077
|
192.3077
|
0.52
|
|
5
|
Taihu Guolian
|
192.3077
|
192.3077
|
0.52
|
|
6
|
Xinshi Consulting
|
178.1923
|
178.1923
|
0.48
|
|
7
|
Hai Feng Investment
|
153.8462
|
153.8462
|
0.41
|
|
8
|
Xingang Consulting
|
72.7115
|
72.7115
|
0.20
|
|
Total
|
37,264.9808
|
37,264.9808
|
100.00
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
6.
|
In November 2019, the Overall Change of ACMSH to Establish a Joint Stock Company Limited
|
| 7. |
In November, 2019, the First Capital Increase of ACMSH
|
|
No.
|
Name of Shareholder
|
Quantity of Shares Held (Ten
Thousand Shares)
|
Proportion of Shareholding
(%)
|
|
1
|
ACMR
|
35,769.23
|
91.67
|
|
2
|
Xinwei Consulting
|
475.62
|
1.22
|
|
3
|
SICIF
|
461.54
|
1.18
|
|
4
|
PDHTI
|
461.54
|
1.18
|
|
5
|
[***]
|
230.77
|
0.59
|
|
6
|
Shangrong Innovation
|
207.69
|
0.53
|
|
7
|
Jinpu Investment
|
192.31
|
0.49
|
|
8
|
Taihu Guolian
|
192.31
|
0.49
|
|
9
|
Xinshi Consulting
|
178.19
|
0.46
|
|
10
|
Yongkong Consulting
|
176.92
|
0.45
|
|
11
|
Hai Feng Investment
|
153.85
|
0.39
|
|
12
|
Runguang Investment
|
153.85
|
0.39
|
|
13
|
ZJTVC
|
153.85
|
0.39
|
|
14
|
SYEM
|
116.69
|
0.30
|
|
15
|
Xingang Consulting
|
72.71
|
0.19
|
|
16
|
SRJY
|
23.08
|
0.06
|
|
Total
|
39,020.13
|
100.00
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| (IV) |
Material assets reorganization during the Issuer’s Reporting Period
|
| (V) |
Listing of the Issuer in other securities markets
|

| (I) |
Majority owned subsidiaries
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
清芯科技有限公司
|
||
|
English Name
|
CleanChip Technologies Limited
|
||
|
Address
|
FLAT/RM K 15/F, MG TOWER, 133 HOI BUN ROAD, KWUN TONG KL, HONGKONG
|
||
|
Legal Representative
|
HUI WANG
|
||
|
Registered Capital
|
10 Hong Kong
|
||
|
Date of Establishment
|
June 9, 2017
|
||
|
Main Business and Its Relationship with Main Business of the Issuer
|
Sales of Special Equipment for Semiconductors; Sales Platform of the Issuer’s Export Business
|
||
|
Shareholders
|
The Company holds its 100% equity interests.
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
52,291.91
|
44,261.03
|
|
Net Assets
|
-2,092.06
|
-1,570.57
|
|
Net Profit
|
-538.07
|
-1,028.28
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
ACM Research (Wuxi), Inc.
|
|
Unified Social Credit Code
|
91320214579450405R
|
|
Domicile
|
J1-6, Export Processing Zone, Wuxi New District
|
|
Legal Representative
|
HUI WANG
|
|
Registered Capital
|
RMB 5 million Yuan
|
|
Paid-in Capital
|
RMB 5 million Yuan
|
|
Date of Establishment
|
July 14, 2011
|
|
Type of Company
|
Limited Liability Company (Sole Proprietorship by Legal Person)
|
|
Business Scope
|
The design, production, processing of electronic special equipment and parts, sales of self-produced products, and provision of after-sales technical services and consulting services (for the above items
subject to the administrative permits, relevant permits shall be obtained for operation)
|
|
Main Business and Its Relationship with Main Business of the Issuer
|
After-sales services for semiconductor equipment; providing after-sales services for some clients of the issuer
|
|
Shareholder
|
The Company holds its 100% equity interests.
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
205.27
|
81.33
|
|
Net Assets
|
-168.51
|
-205.64
|
|
Net Profit
|
37.13
|
-647.35
|
|
Name
|
Shengwei Semiconductor Equipment (Shanghai) Co., Ltd.
|
|
Unified Social Credit Code
|
91310115MA1HAJFA8M
|
|
Domicile
|
Building C, No.888 Huanhu West II Road, Nanhui New Town, Lingang New Area, China (Shanghai) Pilot Free Trade Zone
|
|
Legal Representative
|
HUI WANG
|
|
Registered Capital
|
RMB 5 million Yuan
|
|
Paid-in Capital
|
RMB 1 million Yuan
|
|
Date of Establishment
|
March 25, 2019
|
|
Type of Company
|
Limited Liability Company (Sole Proprietorship by WFOE Legal Person)
|
|
Business Scope
|
The technology development, technical services, technical consulting and technology transfer in the field of semiconductor equipment technology, the design and sales of electronic equipment and its parts, the
import and export of goods and technology. (for the above items subject to the administrative permits, relevant permits shall be obtained for operation)
|
|
Main Business and Its Relationship with Main Business of the Issuer
|
Intending to be engaged in research and development, production and sales of semiconductor special equipment; under construction, not yet carrying out any business.
|
|
Shareholder
|
The Company holds its 100% equity interests.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
33,422.16
|
33,314.73
|
|
Net Assets
|
57.45
|
141.49
|
|
Net Profit
|
-84.03
|
-158.50
|
|
Name
|
ACM Research Korea Co., LTD.
|
|
Registration No.
|
134411-0078948
|
|
Registered Address
|
No.402, 2106 Gyeongchung-daero, Bubal-eup, Icheon-si, Gyeonggi-do (Modern City Plaza)
|
|
CEO
|
YOUNG YOUL KIM
|
|
Registered Capital
|
KRW 100 Million
|
|
Number of Issued Shares
|
20,000 shares
|
|
Date of Establishment
|
December 5, 2017
|
|
Main Business and Its Relationship with Main Business of the Issuer
|
Research and development, production and sales of semiconductor special equipment; conducting research and development of semiconductor special equipment and the spare parts for the Issuer, and at the same
time, purchasing the spare parts of semiconductor special equipment for the Issuer
|
|
Shareholders
|
CleanChip HK holds its 100% equity interests.
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
5,112.69
|
4,211.31
|
|
Net Assets
|
610.88
|
335.57
|
|
Net Profit
|
197.19
|
3.29
|
|
Name
|
ACM Research (CA), Inc.
|
|
Address
|
42307 Osgood Road, Suite #I, ROOM B, Fremont, CA 94539
|
|
Director
|
JIAN WANG
|
|
Number of Shares Outstanding
|
10,000 shares
|
|
Main Business and Its Relationship with Main Business of the Issuer
|
Purchase and sales of the spare parts of semiconductor special equipment; purchasing the spare parts of semiconductor special equipment for the Issuer
|
|
Date of Establishment
|
April 5, 2019
|
|
Shareholder
|
CleanChip HK holds its 100% equity interests.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
7,476.70
|
3,129.06
|
|
Net Assets
|
765.34
|
383.71
|
|
Net Profit
|
386.14
|
423.12
|
| (II) |
Equity participation companies
|
| 1. |
Shengyi Technology
|
|
Name
|
Shengyi Semiconductor Technology (Wuxi) Co., Ltd.
|
|
Unified Social Credit Code
|
91320214MA1XD32R1A
|
|
Domicile
|
F/7, China Internet of Things International Innovation Park, 200 Linghu Avenue, Xinwu District, Wuxi
|
|
Legal Representative
|
BEIYI WANG
|
|
Registered Capital
|
RMB 5 million Yuan
|
|
Type of Company
|
Limited Liability Company
|
|
Business Scope
|
Semiconductor technology development, technical services, technical consultation and technology transfer; Semiconductor equipment production, sales, installation, maintenance, testing; Sales of electronic
products, electrical and mechanical equipment, mechanical equipment and accessories, instrumentation, chemical raw materials and products (with the hazardous chemicals business permit), metal materials, environmental protection equipment,
metal products, rubber and plastic products, electrical and mechanical equipment, hardware and electrical equipment, building materials, chemical raw materials (except dangerous goods), fire-fighting equipment, packaging materials, furniture
supplies, office supplies, articles of daily use, cleaning supplies; Import and export of all kinds of commodities and technologies on its own behalf or on behalf of others (except for commodities and technologies whose import and export are
restricted or prohibited by the state). (For the above items subject to the administrative permits, relevant permits shall be obtained for operation)
|
|
Main Business
|
Production and sales of components and parts of semiconductor special equipment
|
|
Date of Establishment
|
October 29, 2018
|
|
No.
|
Name of Shareholder
|
Subscribed Capital Contribution (RMB 10,000 Yuan)
|
Proportion of Contributions (%)
|
|
1
|
BEIYI WANG
|
425
|
85
|
|
2
|
ACMSH
|
75
|
15
|
|
Total
|
500
|
100
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
|
Total Assets
|
3,976.94
|
1,690.61
|
|
Net Assets
|
825.63
|
586.44
|
|
Net Profit
|
257.87
|
68.49
|
|
Name
|
Hefei Shixi Chanheng Integrated Circuit Venture Capital Fund (L.P.)
|
|
Unified Social Credit Code
|
91340111MA2U3KUJ5C
|
|
Domicile
|
Room 6103, Haiheng Building, No.6 Cuiwei Road, Hefei Economic and Technological Development Area, Anhui Province
|
|
Managing Partner
|
Beijing Shixi Qingliu Investment Co., Ltd.
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Venture project investment; Venture capital investment consulting; Provision of entrepreneurial management services for enterprises. (For projects subject to approval according to law, business activities can
only be carried out after the approval of relevant departments)
|
|
Main Business
|
Venture capital investment, consulting and entrepreneurial management services
|
|
Date of Establishment
|
September 10, 2019
|
|
No.
|
Name of Partners
|
Subscribed Capital Contributions (RMB 10,000 Yuan)
|
Proportion of Contributions (%)
|
|
1
|
Hefei Tongyi Equity Investment Partnership (L.P.)
|
7,600
|
25.33
|
|
2
|
Hefei Economic and Technological Development Zone Industrial Investment Guide Fund Co., Ltd.
|
6,600
|
22.00
|
|
3
|
Infotech National Emerging Fund (L.P.)
|
6,500
|
21.67
|
|
4
|
Hefei Guozheng Assets Management Co., Ltd.
|
5,000
|
16.67
|
|
5
|
ACMSH
|
3,000
|
10.00
|
|
6
|
Shenzhen Waitan Technology Development Co., Ltd.
|
1,000
|
3.33
|
|
7
|
Beijing Shixi Qingliu Investment Co., Ltd.
|
300
|
1.00
|
|
Total
|
30,000
|
100.00
|
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
29,644.41
|
29,908.96
|
|
Net Assets
|
29,344.41
|
29,608.96
|
|
Net Profit
|
-264.55
|
-322.91
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Qingdao Juyuan Xinxing Equity Investment Partnership (L.P.)
|
|
Unified Social Credit Code
|
91370214MA3T7CBF22
|
|
Domicile
|
302, Building 10, 89 Changcheng Road, Chengyang Street, Chengyang District, Qingdao, Shandong Province
|
|
Managing Partner
|
China Fortune-Tech Capital Co., Ltd.
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Equity investment with its own funds, asset management, investment management, equity investment management, venture capital and venture capital management (without the
approval of the financial regulatory department according to law, it is not allowed to engage in financial services such as deposit absorption from the public, financing guarantee and financial management services for clients); Economic
information consultation (excluding finance, securities, futures, financial management, fund-raising, financing and other related businesses). (For projects subject to approval according to law, business activities can only be
carried out after the approval of relevant departments.)
|
|
Main Business
|
Equity investment and asset management
|
|
Date of Establishment
|
June 4, 2020
|
|
No.
|
Name of Partners
|
Subscribed Capital Contributions (RMB 10,000 Yuan)
|
Proportion of Contributions (%)
|
|
1
|
China Fortune-Tech Capital Co., Ltd.
|
500
|
0.22%
|
|
2
|
Advanced Micro-Fabrication Equipment Inc. China
|
30,000
|
13.02%
|
|
3
|
Shanghai Sinyang Semiconductor Materials Co., Ltd.
|
30,000
|
13.02%
|
|
4
|
Zing Semiconductor Corporation
|
20,000
|
8.68%
|
|
5
|
LanChi Investment Co., Ltd.
|
20,000
|
8.68%
|
|
6
|
Will Semiconductor CO., Ltd. Shanghai
|
20,000
|
8.68%
|
|
7
|
TIANJIN ZHONGHUAN SEMICONDUCTOR CO., LTD.
|
20,000
|
8.68%
|
|
8
|
Shenzhen Goodix Technology Co., Ltd.
|
20,000
|
8.68%
|
|
9
|
Giantec Semiconductor Corporation
|
10,000
|
4.34%
|
|
10
|
Allwinnertech Technology Co., Ltd.
|
10,000
|
4.34%
|
|
11
|
Anji Microelectronics Technology (Shanghai) Co., Ltd.
|
10,000
|
4.34%
|
|
12
|
ACMSH
|
10,000
|
4.34%
|
|
13
|
Shanghai Laimu Electronics Co., Ltd
|
10,000
|
4.34%
|
|
14
|
Konfoong Materials International Co., Ltd.
|
10,000
|
4.34%
|
|
15
|
PNC Process Systems Co., Ltd.
|
10,000
|
4.34%
|
|
Total
|
230,500
|
100.00%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
481,326.60
|
425,041.61
|
|
Net Assets
|
481,326.60
|
425,041.61
|
|
Net Profit
|
56,284.99
|
198,041.61
|
| (1) |
Basic Information
|
|
Name
|
ACM RESEARCH INC
|
|
Stock Code
|
ACMR
|
|
Listing Date
|
November 3, 2017
|
|
Date of Establishment
|
January 18, 1998
|
|
Corporate Website
|
www.acmrcsh.com
|
|
Chairman
|
David H. Wang
|
|
Registered Address
|
c/o Corporation Service Company, 251 Little Falls Drive, County of New Castle, Wilmington, Delaware 19808
|
|
Office Address
|
42307 Osgood Road, Suite # #I, ROOM A, Fremont, CA 94539
|
| (2) |
The Setting and Conversion of Class A, B Common Shares
|
| ① |
The Setting of Class A, B Common Shares
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
②
|
The Disclosure of Conversion of Class A, B Common Shares
|
|
③
|
Commitments made by the actual controller
|
|
④
|
The reasons for ACMR to create Class A and Class B shares and for the related conversion provisions
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Circumstances for conversion
|
Reasons for creation of conversion provisions
|
|
1
|
“Each outstanding share of Class B common stock is convertible into one share of Class A common stock at any time, at the option of the holder”
|
To realize the liquidity of shares of Class B common stock
|
|
2
|
“Each outstanding share of Class B common stock is convertible into one share of Class A common stock upon any transfer of such share of Class B common stock, whether or not for value,
except for certain transfers described in the Restated Certificate of Incorporation, including transfers to family members, trusts solely for the benefit of the shareholder or its family members, and partnerships, corporations, or other
entities exclusively owned by the stockholder or their family members”
|
To maintain the stability of holders of shares of Class B common stock and their voting rights
|
|
3
|
“Upon the adoption by the holders of a majority of the then outstanding shares of Class B common stock”
|
To grant shareholders of Class B common stock the power to convert all shares of Class B common stock into shares of Cass A common stock through majority voting
|
|
4
|
“On the first December 31 that occurs five years after the date of this Prospectus if the “October Market Cap” with respect to the month of October immediately preceding such December 31
exceeds US$1.0 billion”
|
The shares of Class B common stock will not be automatically converted into shares of Class A common stock before the “October Market Cap” exceeds US$ 1.0 billion,
which can avoid ACMR being taken over hostilely during the period of the lower market value
|
|
5
|
“The above provision on conversion shall not apply and no automatic conversion of Class B common stock into Class A common stock will ever occur pursuant to the provisions above if the
“October Market Cap” for the month of October immediately preceding a December 31 exceeds US$1.0 billion prior to the fifth anniversary of the date of this Prospectus.
|
To motivate major holders of shares of Class B common stock of ACMR and its officer HUI WANG; if the “October Market Value” exceeds US$ 1.0 billion within five years
from the date of ACMR’s listing, no automatic conversion of Class B common stock into Class A common stock will ever occur, and HUI WANG may continue to maintain the control on the operation and management of ACMR
|
| (3) |
Major Shareholders
|
|
①
|
Top 5 Shareholders of Class A Common Shares
|
|
No.
|
Name of Shareholder
|
Quantity of Shares
Held
|
Proportion of
Shareholding
|
|
1
|
Shanghai Science and Technology Venture Capital Co., Ltd.
|
1,506,170
|
8.52%
|
|
2
|
Pudong Science and Technology (Cayman) Co., Ltd.
|
1,119,576
|
6.34%
|
|
3
|
Xinxin (Hongkong) Capital Co., Limited
|
833,334
|
4.72%
|
|
4
|
HAIPING DUN
|
285,030
|
1.61%
|
|
5
|
Shengxin (Shanghai) Management Consulting Limited Partnership
|
242,681
|
1.37%
|
|
Total
|
3,986,791
|
22.56%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
②
|
Top 5 Shareholders of Class B Common Shares
|
|
No.
|
Name of Shareholder
|
Quantity of Shares Held
|
Proportion of
Shareholding
|
|
1
|
HUI WANG
|
1,146,934
|
67.17%
|
|
2
|
BRIAN WANG
|
117,334
|
6.87%
|
|
3
|
SOPHIA WANG
|
117,334
|
6.87%
|
|
4
|
HAIPING DUN
|
100,000
|
5.86%
|
|
5
|
STEPHEN SUN-HAI CHIAO
|
69,815
|
4.09%
|
|
Total
|
1,551,417
|
90.85%
|
|
|
③
|
Whether there are existing or potential disputes among the relevant shareholders of ACMR
|
|
④
|
Shareholders of ACMR acting as trust funds
|
|
Title
|
David Hui Wang & Jing Chen Family Living Trust
|
|
Establishment Date
|
2001/2/28
|
|
Type of Trust
|
Living Trust
|
|
Term
|
Long-term
|
|
Settlor and Settlor’s Right and Obligation
|
Settlor: HUI WANG & JING CHEN
The Grantors have no rights and bear no obligations with respect to the Trust Assets.
|
|
Trustee and Trustee’s Right and Obligation
|
Trustee: JING CHEN
The Trustee has rights and bears obligations under the provisions of this Trust Agreement.
|
|
Beneficiary and Beneficiary’s Right and Obligation
|
Beneficiary: BRIAN WANG & SOPHIA WANG
If JING CHEN shall die, BRIAN WANG and SOPHIA WANG will benefit 50% each. Prior to this, the Beneficiaries have no rights and bear no obligations with respect to the Trust Assets.
|
|
Actual Exercise of Trust Voting Rights Since Its Establishment
|
Trustee JING CHEN exercises voting rights over the Trust Assets under the provisions of this Trust Agreement.
|
|
Management of the Trust
|
The trustee is responsible for managing the Trust according to the trustee’s rights listed in the Trust Agreement.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Title
|
David Hui Wang & Jing Chen Irrevocable Trust
|
|
Establishment Date
|
2000/1/29
|
|
Type of Trust
|
Irrevocable Trust
|
|
Term
|
Long-term
|
|
Settlor and Settlor’s Right and Obligation
|
Settlor: HUI WANG & JING CHEN
The Settlor have no rights and bear no obligations with respect to the Trust Assets.
|
|
Trustee and Trustee’s Right and Obligation
|
Trustee: JING CHEN
Except for the voting rights of the Trust, the trustee has no benefit rights over the Trust Assets under the provisions of this Trust Agreement.
The trustee’s obligation is to hold, manage and distribute the Trust Assets for the benefit of the Beneficiary under the provisions of this Trust Agreement.
|
|
Beneficiary and Beneficiary’s Right and Obligation
|
Beneficiary: BRIAN WANG & SOPHIA WANG (Children of HUI WANG), 50% each.
The Beneficiary has rights to the Trust Assets under the provisions of this Trust Agreement.
The Beneficiary has no fiduciary obligation to the Trust Assets.
|
|
Actual Exercise of Trust Voting Rights Since Its Establishment
|
Trustee JING CHEN exercises voting rights over the Trust Assets under the provisions of this Trust Agreement.
|
|
Management of the Trust
|
The trustee is responsible for managing the Trust according to the Trustee’s rights listed in the Trust Agreement.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021/From Jan. to Jun. 2021
|
December 31, 2020/2020
|
|
Total Assets
|
418,958
|
341,257
|
|
Net Assets
|
229,556
|
208,170
|
|
Net Profit
|
13,156
|
21,677
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(6)
|
Relevant procedures for ACMR’s carve-out of the Issuer for listing on the Science and Technology Innovation Board
|
|
①
|
As to the examination and approval procedures of the governmental regulators and NASDAQ
|
|
②
|
As to approval procedures of the shareholders of ACMR
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
③
|
As to approval procedures of the board of directors of ACMR
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| ① |
Non-financial information comparison
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Matters
|
Disclosed in the Issuer’s [***]
|
Disclosed by ACMR on the website of the SEC
|
|
ACMR’s shareholding ratio in the Issuer
|
Prior to this offering and listing of the Issuer, ACMR holds 91.67% of shares in the Issuer.
|
ACMR discloses in the “Risk Factors” of 2019 annual report that:
“ACMSH is our major operating company, and prior to the listing on the Science and Technology Innovation Board, is a wholly-owned subsidiary of ACMR. ”
|
|
Labor Contract and Non-competition Agreement between the Issuer and its employees and officers and performance thereof
|
“As of the date of signing the [***], the Company has entered into the Labor Contract, the Non-competition Agreement and the Confidentiality and Intellectual Property Protection Agreement regarding horizontal
competition and confidentiality matters with each director, supervisor, officer and key technician who works in and receives remuneration from the Company, and the Company and directors, supervisors, officers and key technicians are protected
and bound by provisions of relevant labor contracts. ”
|
ACMR discloses in the “Risk Factors” of 2019 annual report that: “We have not signed any employee or retention agreements with any employee, or maintain any key personal insurance policy for any employee...
Further, our senior executive may join any competitor or establish any competing company.”
|
|
Shareholder Name of ACMSH (before restructuring)
|
“On May 2, 2017, Shanghai Venture Capital Co., Ltd. and ACMR signed a Shanghai Assets and Equity Exchange Contract, stipulating that Shanghai Venture Capital Co., Ltd. would transfer its 18.77% equity of ACMSH
(before restructuring) to ACMR for a consideration of RMB 40 million Yuan. ”
|
ACMR discloses in the “Financial Statements and Supplementary Data” of 2019 annual report that:
“In August 2017, ACMR acquired 18.77% of equity held by Shanghai Science and Technology Venture Capital Co., Ltd. in ACMSH.”
|
|
Amount of funds raised by the Issuer through two rounds of equity financing
|
(1) “On August 29, 2019, BDO China verified the paid-up status of the registered capital of ACMSH (before restructuring), and issued the Capital Verification Report (Xin Kuai Shi Bao Zi [2019] No. ZI10620). As
of August 22, 2019, ACMSH (before restructuring) had received the newly increased capital of RMB 187,924,000 Yuan paid by the above shareholders, with RMB 14,957,500 Yuan included in the registered capital and RMB 172,966,500 Yuan included in
the capital reserves.”
(2) “BDO China verified the paid-up status of the registered capital of ACMSH and issued the Capital Verification Report (Xin Kuai Shi Bao Zi [2020] No. ZI10025). As of December 10, 2019, ACMSH had received the
newly increased capital of RMB 228,170,000 Yuan paid by the above shareholders, with RMB 17,551,500 Yuan included in the registered capital and RMB 210,618,500 Yuan included in the capital reserves.”
|
ACMR discloses in the “Financial Statements and Supplementary Data” of 2019 annual report that:
“In order to obtain the qualifications for listing and for IPO on the Science and Technology Innovation Board, on June 12, 2019, ACMSH signed an agreement with seven investors (“Tranche 1 Investors”), upon
which Tranche 1 Investors agree to pay ACMSH a total price of RMB 187,900,000 Yuan (equivalent to US$ 27,300,000) to acquire 4.2% of the outstanding equity of ACMSH. And on November 29, 2019, ACMSH signed an agreement with eight investment
entities in China (“Tranche 2 Investors”), upon which Tranche 2 Investors agree to acquire shares of ACMSH at the price of RMB 13 Yuan per share (same with the Tranche 1 Investors) and an aggregate value of RMB 228,200,000 Yuan (equivalent to
US$ 32,400,000). ”
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Date of incorporation of ACMSH (before restructuring) and ACM CA
|
(1) ACMSH (before restructuring) was incorporated on May 17, 2005.
(2) ACM CA was incorporated on April 5, 2019.
|
ACMR discloses in the “Financial Statements and Supplementary Data” of 2019 annual report that: “CleanChip established its wholly-owned subsidiary in California, being ACM Research (CA), Inc. (“ACM CA”) on June
2019, which provides the procurement services on behalf of ACMSH. …ACM Research (CA), Inc. was incorporated in June 2019.”
“ACM Research (Shanghai), Inc. was incorporated in May 2006.”
|
|
Leased Premises of the Issuer
|
(1) The Issuer leased from Zhangjiang Group the premise located at Building 4, No. 1690 Cailun Road, Zhangjiang Hi-tech Park, Shanghai, the total area of which is 5,900.28 m2 and the lease term of which is from January 1, 2018 to December 31, 2024.
(2) The Issuer leased from Shanghai Shengyu Culture Development Co., Ltd. the whole building located at Building 2, No. 365, Chuanhong Road, Shanghai, the total area of which is 9,629.87 m2 and the lease term of which is from September 26, 2019 to January 15, 2023.
|
ACMR discloses in the “Financial Statements and Supplementary Data” of 2019 annual report that:
“In 2007, ACMSH and Zhangjiang Group (a related party, see note 11) signed an operating lease with respect to appr. 63,510 square feet of manufacturing and office space located in Shanghai, China. The lease
term and payment terms were amended and extended from time to time upon negotiation with Zhangjiang Group. The lease signed with Zhangjiang Group expired on December 31, 2017, and ACMSH leased promises on a monthly basis from January 1, 2018
to April 25, 2018. ACMSH and Zhangjiang Group signed the renewal lease on April 26, 2018, with the term being from January 1, 2018 to December 31, 2022. Pursuant to the aforesaid renewal lease, ACMSH shall pay a rental in an amount of RMB
366,000 Yuan (equivalent to US$ 55,000) on a monthly basis. The required security deposit is RMB 1,077,000 Yuan (equivalent to US$ 163,000). … In January 2018, ACMSH signed an operating lease with respect to the No. 2 Factory located at
Pudong District, Shanghai, with the term being from January 2018 to January 2023. This facility covers a total construction area of 50,000 square feet. The monthly rental may change within the lease term.”
|
|
Public rental housing pre-sale contract
|
In October 2020, Shengwei Shanghai and Shanghai Lingang Industrial Zone Public Rental Housing Construction Operation Management Co., Ltd. entered into an Overall Pre-sale Contract on Shanghai Public Rental
Housing, whereby the former shall purchase from the latter 162 houses at No. 14, No. 21, No. 41 and No. 42, Lane 128, Qunfeng Road, with a predicted total area of 15,322.14 square meters at a predicted price totaling to RMB 257,303,200 Yuan.
|
ACMR discloses in the “Real Estate” of 2020 annual report that:
“On October 28, 2020, Shengwei’s wholly-owned subsidiary and Shanghai Lingang Industrial Zone Public Rental Housing Construction Operation Management Co., Ltd. entered into an Overall Pre-sale Contract on
Shanghai Public Rental Housing with a total price of about US$40 million. According to the contract, as part of the pilot project on the “renting before selling” public rental housing in the Lingang Industrial Zone, Shengwei’s subsidiary will
obtain the housing and corresponding land use rights by October 31, 2021.”
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
②
|
Comparison of financial information differences between ACMR and the Company
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Issuer
|
ACMR
|
Difference
|
Percentage
|
|
2020/December 31, 2020
|
||||
|
Operating income
|
100,747.18
|
108,016.43
|
-7,269.25
|
-6.73%
|
|
Net profit
|
19,676.99
|
14,950.12
|
4,726.87
|
31.62%
|
|
Total assets
|
184,352.37
|
222,607.81
|
-38,255.44
|
-17.19%
|
|
Net assets
|
104,867.33
|
135,793.08
|
-30,925.75
|
-22.77%
|
|
2019/December 31, 2019
|
||||
|
Operating income
|
75,673.30
|
74,154.74
|
1,518.56
|
2.05%
|
|
Net profit
|
13,488.73
|
13,419.76
|
68.97
|
0.51%
|
|
Total assets
|
130,800.15
|
151,921.16
|
-21,121.01
|
-13.90%
|
|
Net assets
|
82,992.90
|
109,897.35
|
-26,904.45
|
-24.48%
|
|
2018/December 31, 2018
|
||||
|
Operating income
|
55,026.91
|
49,399.75
|
5,627.16
|
11.39%
|
|
Net profit
|
9,253.04
|
4,350.79
|
4,902.25
|
112.68%
|
|
Total assets
|
63,602.25
|
70,725.74
|
-7,123.50
|
-10.07%
|
|
Net assets
|
14,504.75
|
35,912.60
|
-21,407.85
|
-59.61%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| 2. |
De Facto Controller
|
| ① |
Distribution of voting rights held by shareholders in ACMR
|
|
No.
|
Name of Shareholder
|
No. of Class A
Shares (Share)
|
No. of Class B
Shares (Share)
|
Percentage of
voting rights
|
|
1
|
HUI WANG
|
168,006
|
1,146,934
|
43.24%
|
|
2
|
SOPHIA WANG
|
15,279
|
117,334
|
4.42%
|
|
3
|
BRIAN WANG
|
-
|
117,334
|
4.39%
|
|
4
|
HAIPING DUN
|
285,030
|
100,000
|
4.28%
|
|
5
|
Shanghai Science and Technology Venture Capital Co., Ltd
|
1,666,170
|
-
|
3.12%
|
|
Total
|
2,134,485
|
1,481,602
|
59.45%
|
|
|
No.
|
Name of Shareholder
|
No. of Class A
Shares (Share)
|
No. of Class B
Shares (Share)
|
Percentage
of voting
rights
|
|
1
|
HUI WANG
|
168,006
|
1,146,934
|
44.59%
|
|
2
|
SOPHIA WANG
|
15,279
|
117,334
|
4.56%
|
|
3
|
BRIAN WANG
|
-
|
117,334
|
4.53%
|
|
4
|
HAIPING DUN
|
285,030
|
100,000
|
4.41%
|
|
5
|
Shanghai Science and Technology Venture Capital Co., Ltd
|
1,506,170
|
-
|
2.91%
|
|
Total
|
1,974,485
|
1,481,602
|
60.99%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| ② |
Agreements on concerted action with respect to ACMR
|
| ③ |
Position of HUI WANG
|
|
①
|
HUI WANG and his wife/children constitute the statutory relationship of acting in concert under the PRC laws
|
|
②
|
The basis that his wife/children are not determined as common de facto controllers
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
③
|
Commitments of HUI WANG’s wife/Children as persons acting in concert
|
|
No.
|
Name of Shareholder
|
No. of Class A
shares (Share)
|
Percentage of
voting rights
|
|
1
|
Shanghai Science and Technology Venture Capital Co., Ltd.
|
1,506,170
|
7.77%
|
|
2
|
HUI WANG
|
1,314,940
|
6.79%
|
|
3
|
Pudong Science and Technology (Cayman) Co., Ltd.
|
1,119,576
|
5.78%
|
|
4
|
Xinxin (Hongkong) Capital Co., Limited
|
833,334
|
4.30%
|
|
5
|
HAIPING DUN
|
385,030
|
1.99%
|
|
Total
|
5,159,050
|
26.63%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
| 3. |
Other Companies Controlled by the Controlling Shareholder
|
|
Name
|
ACM Research (Cayman), Inc.
|
|
Address
|
Suite #4-210, Governors Square, 23 Lime Tree Bay Avenue, PO Box 32311, Grand Cayman KY1-1209, Cayman Islands
|
|
Director
|
HUI WANG
|
|
Number of Issued Shares
|
10,000 Shares
|
|
Main Business
|
No actual business carried out
|
|
Shareholders
|
100% equity rights held by ACMR
|
|
Name
|
ACM RESEARCH (SINGAPORE) PTE. LTD.
|
|
Address
|
77 ROBINSON ROAD,#20-01, ROBINSON 77, SINGAPORE 068896
|
|
Director
|
HUI WANG,LIU JIA
|
|
Number of Issued Shares
|
100,000 Shares
|
|
Main Business
|
No actual business carried out
|
|
Shareholders
|
100% equity rights held by ACMR
|
|
Date of Establishment
|
August 17, 2021
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name of Shareholder
|
Capital Structure before the
Offering
|
Capital Structure after the Offering
|
||
|
Number of
Shares Held
(10,000 Shares)
|
Proportion of
Shareholding (%)
|
Number of Shares
Held (10,000
Shares)
|
Proportion of
Shareholding
(%)
|
||
|
1
|
ACMR
|
35,769.23
|
91.67
|
35,769.23
|
82.50
|
|
2
|
Xinwei Consulting
|
475.62
|
1.22
|
475.62
|
1.10
|
|
3
|
SICIF
|
461.54
|
1.18
|
461.54
|
1.06
|
|
4
|
PDHTI
|
461.54
|
1.18
|
461.54
|
1.06
|
|
5
|
[***]
|
230.77
|
0.59
|
230.77
|
0.53
|
|
6
|
Shangrong Innovation
|
207.69
|
0.53
|
207.69
|
0.48
|
|
7
|
Taihu Guolian
|
192.31
|
0.49
|
192.31
|
0.44
|
|
8
|
Jinpu Investment
|
192.31
|
0.49
|
192.31
|
0.44
|
|
9
|
Xinshi Consulting
|
178.19
|
0.46
|
178.19
|
0.41
|
|
10
|
Yongkong Consulting
|
176.92
|
0.45
|
176.92
|
0.41
|
|
11
|
Hai Feng Investment
|
153.85
|
0.39
|
153.85
|
0.35
|
|
12
|
Runguang Investment
|
153.85
|
0.39
|
153.85
|
0.35
|
|
13
|
ZJTVC
|
153.85
|
0.39
|
153.85
|
0.35
|
|
14
|
SYEM
|
116.69
|
0.30
|
116.69
|
0.27
|
|
15
|
Xingang Consulting
|
72.71
|
0.19
|
72.71
|
0.17
|
|
16
|
SRJY
|
23.08
|
0.06
|
23.08
|
0.05
|
|
Shares in the Offering
|
-
|
-
|
4,335.5753
|
10.00
|
|
|
Total
|
39,020.13
|
100.00
|
43,355.71
|
100.00
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name of Shareholder
|
Time of Acquisition
|
Quantity of Shares Held (Ten
Thousand)
|
Proportion of
Shareholding
|
|
1
|
SICIF
|
December 13, 2019
|
461.54
|
1.18%
|
|
2
|
PDHTI
|
December 13, 2019
|
461.54
|
1.18%
|
|
3
|
ZJTVC
|
December 13, 2019
|
153.85
|
0.39%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name of
Shareholder
|
Time of
Acquisition
|
Method
|
Quantity of
Shares Held (Ten
Thousand)
|
Proportion of
Shareholding
|
Capital Increase
Price
(Yuan/Share)
|
Pricing Basis
|
|
1
|
Xinwei Consulting
|
August 20, 2019
|
Capital Increase
|
475.62
|
1.22%
|
13.00
|
Negotiated Pricing
|
|
2
|
[***]
|
August 20, 2019
|
Capital Increase
|
230.77
|
0.59%
|
13.00
|
Negotiated Pricing
|
|
3
|
Taihu Guolian
|
August 20, 2019
|
Capital Increase
|
192.31
|
0.49%
|
13.00
|
Negotiated Pricing
|
|
4
|
Jinpu Investment
|
August 20, 2019
|
Capital Increase
|
192.31
|
0.49%
|
13.00
|
Negotiated Pricing
|
|
5
|
Xinshi Consulting
|
August 20, 2019
|
Capital Increase
|
178.19
|
0.46%
|
10.40
|
Negotiated Pricing
|
|
6
|
Hai Feng Investment
|
August 20, 2019
|
Capital Increase
|
153.85
|
0.39%
|
13.00
|
Negotiated Pricing
|
|
7
|
Xingang Consulting
|
August 20, 2019
|
Capital Increase
|
72.71
|
0.19%
|
10.40
|
Negotiated Pricing
|
|
8
|
SICIF
|
December 13, 2019
|
Capital Increase
|
461.54
|
1.18%
|
13.00
|
Negotiated Pricing
|
|
9
|
PDHTI
|
December 13, 2019
|
Capital Increase
|
461.54
|
1.18%
|
13.00
|
Negotiated Pricing
|
|
10
|
Shangrong Innovation
|
December 13, 2019
|
Capital Increase
|
207.69
|
0.53%
|
13.00
|
Negotiated Pricing
|
|
11
|
Yongkong Consulting
|
December 13, 2019
|
Capital Increase
|
176.92
|
0.45%
|
13.00
|
Negotiated Pricing
|
|
12
|
Runguang Investment
|
December 13, 2019
|
Capital Increase
|
153.85
|
0.39%
|
13.00
|
Negotiated Pricing
|
|
13
|
ZJTVC
|
December 13, 2019
|
Capital Increase
|
153.85
|
0.39%
|
13.00
|
Negotiated Pricing
|
|
14
|
SYEM
|
December 13, 2019
|
Capital Increase
|
116.69
|
0.30%
|
13.00
|
Negotiated Pricing
|
|
15
|
SRJY
|
December 13, 2019
|
Capital Increase
|
23.08
|
0.06%
|
13.00
|
Negotiated Pricing
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
Basic Information
|
|
Name
|
Xinwei (Shanghai) Management Consulting Partnership (L.P.)
|
|
Domicile
|
Room 4166, Building 1, No.63 Liantai Road, Baoshan District, Shanghai
|
|
Unified Social Credit Code
|
91310113MA1GNJQF9E
|
|
Executive Partner
|
Xinrun Management Consulting (Shanghai) Ltd.
|
|
Registered Capital
|
RMB 61.83 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Enterprise management consultancy; enterprise marketing planning; commercial information consultancy; market information consultancy and investigation (being prohibited from engaging in social investigation,
social survey, public opinion survey, public opinion poll); conference services. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been
obtained]
|
|
Business Term
|
From June 11, 2019 to June 10, 2049
|
|
②
|
As of the signing date of the [***], the shareholder structure of Xinwei Consulting is as follows:
|
|
Name of Partner
|
Category of Partner
|
Capital Contributions
(RMB 10,000 Yuan)
|
Contribution
Proportion (%)
|
|
BAOMING LI
|
Limited Partner
|
1,200
|
19.41
|
|
DAQUAN YU
|
Limited Partner
|
1,000
|
16.17
|
|
BEIYI WANG
|
Limited Partner
|
900
|
14.56
|
|
ZHONGPING LUO
|
Limited Partner
|
500
|
8.09
|
|
HONG HU
|
Limited Partner
|
350
|
5.66
|
|
QUAN ZHANG
|
Limited Partner
|
300
|
4.85
|
|
SHU ZHU
|
Limited Partner
|
300
|
4.85
|
|
YUN MA
|
Limited Partner
|
300
|
4.85
|
|
JIANBO ZHANG
|
Limited Partner
|
220
|
3.56
|
|
GANG HUANG
|
Limited Partner
|
220
|
3.56
|
|
XIAOHONG WANG
|
Limited Partner
|
210
|
3.40
|
|
QIAN DONG
|
Limited Partner
|
200
|
3.23
|
|
YU HOU
|
Limited Partner
|
152.5
|
2.47
|
|
SHOULEI JIANG
|
Limited Partner
|
130
|
2.10
|
|
XIAOLAN SU
|
Limited Partner
|
130
|
2.10
|
|
JINSONG LE
|
Limited Partner
|
70
|
1.13
|
|
Xinrun Management Consulting (Shanghai) Ltd.
|
General Partner
|
0.5
|
0.01
|
|
Total
|
--
|
6,183
|
100.00
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Xinrun Management Consulting (Shanghai) Ltd.
|
|
Principal Place of Business
|
Room 239, 2/F, Whole Building, No.390-408 East Beijing Road, Huangpu District, Shanghai
|
|
Date of Establishment
|
May 22, 2019
|
|
Unified Social Credit Code
|
91310101MA1FPEW358
|
|
Legal Representative
|
GANG HUANG
|
|
Registered Capital
|
RMB 500,000 Yuan
|
|
Business Scope
|
Enterprise management consultancy; enterprise marketing planning; commercial information consultancy; market information consultancy and investigation (being prohibited from engaging in social investigation,
social survey, public opinion survey, public opinion poll). [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
①
|
Basic Information
|
|
Name
|
[***]
|
|
Domicile
|
[***]
|
|
Unified Social Credit Code
|
[***]
|
|
Executive Partner
|
[***]
|
|
Registered Capital
|
RMB 323.625 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Investment and investment management of non-securities businesses. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant
authorities has been obtained]
|
|
Business Term
|
From January 24, 2018 to January 23, 2028
|
|
Name of Partner
|
Category of
Partner
|
Capital
Contributions
(RMB 10,000
Yuan)
|
Capital Proportion
(%)
|
|
China Merchants Wealth
|
Limited Partner
|
25,890.00
|
80.00
|
|
[***]
|
General Partner
|
6,276.50
|
19.39
|
|
Jiaxing Xiyue Investment Management Partnership (L.P.)
|
Limited Partner
|
196.00
|
0.61
|
|
Total
|
32,362.5
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
[***]
|
|
Domicile
|
[***]
|
|
Date of Establishment
|
[***]
|
|
Unified Social Credit Code
|
[***]
|
|
Legal Representative
|
[***]
|
|
Registered Capital
|
RMB 7,500 million Yuan
|
|
Business Scope
|
Using self-owned funds or setting up direct investment funds to make equity investment or equity-related debt investment in enterprises, or investing other investment funds related to equity investment;
providing investment consultancy, investment management, financial consultancy service related to equity investment; other businesses approved by the CSRC. (For projects subject to any approval in accordance with laws, business activities may
be carried out only after such approval of relevant authorities has been obtained)
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Jiangsu Jiequan Taihu Guolian Emerging Industry Investment Enterprise (L.P.) (Formerly known as: Wuxi Taihu Guolian Emerging Industry Investment Enterprise (L.P.))
|
|
Domicile
|
5/F, Guolian Financial Building, No.8 Jinrongyi 1st Street, Binhu District, Wuxi City
|
|
Unified Social Credit Code
|
91320200MA1Y27GM1N
|
|
Executive Partner
|
Wuxi Guolian Industry Investment Co., Ltd.
|
|
Registered Capital
|
RMB 5 billion Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Using self-owned funds to conduct foreign investment. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has
been obtained]
|
|
Business Term
|
From March 13, 2019 to March 12, 2027
|
|
Name of Partner
|
Category of Partner
|
Capital Contributions
(RMB 10,000 Yuan)
|
Contribution
Proportion (%)
|
|
Wuxi Guolian Financial Investment Group Co., Ltd.
|
Limited Partner
|
299,500
|
59.90
|
|
Wuxi Municipal Finance Bureau
|
Limited Partner
|
133,500
|
26.70
|
|
Jiangsu Provincial Government Investment Fund (L.P.)
|
Limited Partner
|
66,500
|
13.30
|
|
Wuxi Guolian Industry Investment Co., Ltd.
|
General Partner
|
500
|
0.10
|
|
Total
|
500,000
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Wuxi Guolian Industry Investment Co., Ltd.
|
|
Domicile
|
E1-202, China Sensor Network International Innovation Park, No. 200, Linghu Avenue, Xinwu District, Wuxi City
|
|
Date of Establishment
|
September 21, 2006
|
|
Unified Social Credit Code
|
9132021479331907XR
|
|
Executive Partner
|
HAIJIANG MA
|
|
Registered Capital
|
RMB 1.2 billion Yuan
|
|
Business Scope
|
Investment management; venture capital investment; industry investment (Except for sectors prohibited, restricted by the laws and regulations); high-tech industry investment and management. [For projects
subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Jinpu Lingang Intelligent Technology Private Equity Investment Fund (L.P.)
|
|
Domicile
|
Room 865, No.888, West Huanhu’er Road, Nanhui New Town, Pudong New District, Shanghai
|
|
Unified Social Credit Code
|
91310000MA1FL3Q357
|
|
Executive Partner
|
Shanghai Jinpu Intelligent Technology Investment Management Co., Ltd.
|
|
Registered Capital
|
RMB 1.286 billion Yuan
|
|
Type of Company
|
Limited Partnership
|
|
Business Scope
|
Equity Investment, investment management, investment consultancy, asset management, industrial investment. [For projects subject to any approval in accordance with laws, business activities may be carried out
only after such approval of relevant authorities has been obtained]
|
|
Business Term
|
From March 27, 2017 to March 26, 2037
|
|
Name of Partner
|
Category of
Partner
|
Capital Contributions
(RMB 10,000 Yuan)
|
Contribution
Proportion (%)
|
|
Shanghai Lingang Zhiyao Equity Investment Fund Partnership (L.P.)
|
Limited Partner
|
20,000
|
15.55
|
|
Shanghai Huilin Enterprise Management Center (L.P.)
|
Limited Partner
|
18,800
|
14.62
|
|
Shanghai Guofang Master Fund Phase I Venture Vapital Partnership (L.P.)
|
Limited Partner
|
11,250
|
8.75
|
|
Shanghai Jinxin Enterprise Management Co., Ltd.
|
Limited Partner
|
10,000
|
7.78
|
|
Quzhou Green Development Group Co., Ltd.
|
Limited Partner
|
10,000
|
7.78
|
|
Zhenjiang Dantu Huajian Asset Investment Co., Ltd.
|
Limited Partner
|
10,000
|
7.78
|
|
Shanghai Tiantai Real Estate Co., Ltd.
|
Limited Partner
|
10,000
|
7.78
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Zhenjiang High-tech Investment Co., Ltd.
|
Limited Partner
|
10,000
|
7.78
|
|
Gongqingcheng Pulian Investment Partnership (L.P.)
|
Limited Partner
|
5,500
|
4.28
|
|
Shanghai Lianming Investment Group Co., Ltd.
|
Limited Partner
|
5,000
|
3.89
|
|
Shanghai Lingang Fengxian Economic Development Co., Ltd.
|
Limited Partner
|
4,000
|
3.11
|
|
Shanghai Guofang Master Fund Phase II Venture Vapital Partnership (L.P.)
|
Limited Partner
|
3,750
|
2.92
|
|
Xiamen International Trust Co., Ltd.
|
Limited Partner
|
2,000
|
1.56
|
|
Xiamen Tiandi Equity Investment Co., Ltd.
|
Limited Partner
|
2,000
|
1.56
|
|
Zhenjiang Tuanshan Capital Management Co., Ltd.
|
Limited Partner
|
2,000
|
1.56
|
|
Shanghai Songjiang Chengqian Investment Co., Ltd.
|
Limited Partner
|
1,900
|
1.48
|
|
Shanghai Jieyue Enterprise Management Partnership (L.P.)
|
Limited Partner
|
1,200
|
0.93
|
|
Ningbo Enguang Venture Capital Investment Partnership (L.P.)
|
Limited Partner
|
1,000
|
0.78
|
|
Shanghai Xuanhong Enterprise Management Partnership (L.P.)
|
General Partner
|
100
|
0.08
|
|
Shanghai Jinpu Intelligent Technology Investment Management Co., Ltd.
|
General Partner
|
100
|
0.08
|
|
Total
|
128,600
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Shanghai Xuanhong Enterprise Management Partnership (L.P.)
|
|
Domicile
|
Building 1, No.139 Rongmei Road, Songjiang District, Shanghai
|
|
Date of Establishment
|
March 17, 2017
|
|
Unified Social Credit Code
|
91310117MA1J21JHXM
|
|
Executive Partner
|
HUAFENG TIAN
|
|
Business Scope
|
Enterprise management consultancy; commercial information consultancy; exhibition services; enterprise marketing planning; enterprise image planning; cultural and art exchange activities planning; financial
consulting; market information consulting and investigation (being prohibited from engaging in social investigation, social survey, public opinion survey, public opinion poll); the design and making of various advertisements; using self-owned
media to publish advertisements. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Shanghai Jinpu Intelligent Technology Investment Management Co., Ltd.
|
|
Domicile
|
Tower C, No.888 West Huanhu’er Road, Nanhui New Town, Pudong New District
|
|
Date of Establishment
|
March 15, 2017
|
|
Unified Social Credit Code
|
91310115MA1H8Q3H7H
|
|
Legal Representative
|
HOUJUN LV
|
|
Registered Capital
|
RMB5 million Yuan
|
|
Business Scope
|
Investment management; asset management; industrial investment. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant
authorities has been obtained]
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Xinshi (Shanghai) Management Consulting Partnership (L.P.)
|
|
Domicile
|
Room 4162, Building 1, No.63 Liantai Road, Baoshan District, Shanghai
|
|
Unified Social Credit Code
|
91310113MA1GNJDY1N
|
|
Executive Partner
|
Xindai Management Consulting (Shanghai) Ltd.
|
|
Registered Capital
|
RMB 18.532 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Enterprise management consultancy; enterprise marketing planning; commercial information consultancy; market consultancy and investigation (being prohibited from engaging in social investigation, social survey,
public opinion survey, public opinion poll). [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
Business Term
|
From June 5, 2019 to June 4, 2049
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name of Partner
|
Category of
Partner
|
Contribution
Proportion
|
Capital Contributions (RMB
10,000 Yuan)
|
Position
|
|
JUN WANG
|
Limited Partner
|
5.40%
|
100.00
|
Core Technician
|
|
XUEJUN LI
|
Limited Partner
|
5.40%
|
100.00
|
Core Technician
|
|
HUI SHEN
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
XIAYUN YANG
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
YAN LI
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
SHENA JIA
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
DEYUN WANG
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
XIAOYAN ZHANG
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
XI WANG
|
Limited Partner
|
4.32%
|
80.00
|
Core Management Personnel
|
|
XIAOFENG TAO
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
JUN WU
|
Limited Partner
|
3.24%
|
60.00
|
Core Management Personnel
|
|
HU ZHAO
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
GUANGYU XIA
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
GUANZHONG LU
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
HONGCHAO YANG
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
YULU HU
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
ZHAOWEI JIA
|
Limited Partner
|
3.24%
|
60.00
|
Core Management Personnel
|
|
YINUO JIN
|
Limited Partner
|
3.24%
|
60.00
|
Core Management Personnel
|
|
WENJUN WANG
|
Limited Partner
|
3.24%
|
60.00
|
Core Business Personnel
|
|
XIAOQUN WANG
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
GUANGBO HAN
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
WENQING JI
|
Limited Partner
|
2.16%
|
40.00
|
Core Management Personnel
|
|
FENG LIU
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
QIANG WANG
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
YANLI HU
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
FANGYONG ZHEN
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
ANYUN BI
|
Limited Partner
|
2.16%
|
40.00
|
Core Management Personnel
|
|
XINZHENG WANG
|
Limited Partner
|
2.16%
|
40.00
|
Core Business Personnel
|
|
LAN WANG
|
Limited Partner
|
1.62%
|
30.00
|
Core Management Personnel
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
XIAOWEI DI
|
Limited Partner
|
1.62%
|
30.00
|
Core Business Personnel
|
|
CHUANYUN ZHU
|
Limited Partner
|
1.08%
|
20.00
|
Core Business Personnel
|
|
BINGGENG LONG
|
Limited Partner
|
0.81%
|
15.00
|
Core Business Personnel
|
|
DONGHUI LU
|
Limited Partner
|
0.54%
|
10.00
|
Core Management Personnel
|
|
HAILANG DUAN
|
Limited Partner
|
0.54%
|
10.00
|
Core Business Personnel
|
|
JUNZHUO WU
|
Limited Partner
|
0.43%
|
8.00
|
Core Business Personnel
|
|
FEI ZHOU
|
Limited Partner
|
0.43%
|
8.00
|
Core Business Personnel
|
|
WENJUN HU
|
Limited Partner
|
0.11%
|
2.00
|
Core Business Personnel
|
|
Xindai Management
Consulting (Shanghai) Ltd.
|
General Partner
|
0.01%
|
0.20
|
-
|
|
Total
|
-
|
100.00%
|
1,853.20
|
-
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Xindai Management Consulting (Shanghai) Ltd.
|
|
Unified Social Credit Code
|
91310101MA1FPEW27D
|
|
Principal Place of Business
|
Room 240, 2/F, Whole Building, No. 390-408 East Beijing Road, Huangpu District, Shanghai
|
|
Registered Capital
|
RMB10,000 Yuan
|
|
Legal Representative
|
XIAYUN YANG
|
|
Date of Establishment
|
May 22, 2019
|
|
Business Scope
|
Enterprise management consultancy; enterprise marketing planning; commercial information consultancy; market information consultancy and investigation (being prohibited from engaging in social investigation,
social survey, public opinion survey, public opinion poll). [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
Name
|
Hai Feng Investment Holding Limited
|
|
Address of Registered Office
|
Room 5301, 53/F, The Center, No.99 Queen’s Road, Hong Kong
|
|
Company ID
|
2788115
|
|
Number of Issued Shares
|
1 share
|
|
Directors
|
CHONGJIU SHA, Youngjin KO
|
|
Composition of Shareholders
|
100% equity rights held by SL Capital Fund I, L. P.
|
|
De Facto Controller
|
The sole shareholder of Hai Feng Investment is SL Capital Fund I, L. P., and the general partner of SL Capital Fund I, L. P. is SLSF I GP Limited, with SK Investment Management Co., Ltd. and Legend Capital
Management Co., Ltd. each having a 50% shareholding in SLSF I GP Limited.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
Basic Information
|
|
Nam
|
Xingang (Shanghai) Management Consulting Partnership (L.P.)
|
|
Domicile
|
Room 4163, Building 1, No.63 Liantai Road, Baoshan District, Shanghai
|
|
Unified Social Credit Code
|
91310113MA1GNJDX3U
|
|
Executive Partner
|
Xindai Management Consulting (Shanghai) Ltd.
|
|
Registered Capital
|
RMB7.562 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Enterprise management consultancy; enterprise marketing planning; commercial information consultancy; market information consultancy and investigation (being prohibited from engaging in social investigation,
social survey, public opinion survey, public opinion poll); conference service. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been
obtained]
|
|
Business Term
|
From June 5, 2019 to June 4, 2049
|
|
Name of Partner
|
Category of
Partner
|
Contribution
Proportion
|
Subscribed Capital Contributions
(RMB 10,000 Yuan)
|
Position
|
|
XUFENG MENG
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
ZHENMING CHU
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
YUN SUN
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
WEI ZHANG
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
XIAOHUI ZHANG
|
Limited Partner
|
2.64%
|
20.00
|
Core Management Personnel
|
|
RONG CAO
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
SHILIANG CHEN
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
LAN XI
|
Limited Partner
|
2.64%
|
20.00
|
Core Management Personnel
|
|
YINGWEI DAI
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
JUAN LI
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
LEI WU
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
HAIBO HU
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
YU NIE
|
Limited Partner
|
2.64%
|
20.00
|
Core Management Personnel
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
DING XU
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
YI SHI
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
DANYING WANG
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
MINLI GU
|
Limited Partner
|
2.64%
|
20.00
|
Core Management Personnel
|
|
WEIZHAN CAI
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
ZHENJIANG QIN
|
Limited Partner
|
2.64%
|
20.00
|
Core Business Personnel
|
|
XIAOCHENG GU
|
Limited Partner
|
2.38%
|
18.00
|
Core Business Personnel
|
|
CHUNYANG HAN
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
YANPING WANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
YANJUN QIAN
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
HONGXIN ZHANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
HE WANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
SHU YANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
SONG WANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
QI LI
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
YANG XIANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
SHAOSHUAI ZHANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
ZERAN LI
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
LI SUN
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
BO XIONG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
YuanYuan XU
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
GUANGXU ZHOU
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
ZHAOMING ZHONG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
YING WANG
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
XINXIN JIAO
|
Limited Partner
|
1.98%
|
15.00
|
Core Business Personnel
|
|
JIAN CHEN
|
Limited Partner
|
1.72%
|
13.00
|
Core Business Personnel
|
|
BAIGANG ZHUANG
|
Limited Partner
|
1.32%
|
10.00
|
Core Business Personnel
|
|
YANG HAN
|
Limited Partner
|
1.32%
|
10.00
|
Core Business Personnel
|
|
YUNCHEN YU
|
Limited Partner
|
1.32%
|
10.00
|
Core Business Personnel
|
|
YANYAN WANG
|
Limited Partner
|
1.32%
|
10.00
|
Core Management Personnel
|
|
CHUNYING LIU
|
Limited Partner
|
1.32%
|
10.00
|
Core Business Personnel
|
|
XINPING DENG
|
Limited Partner
|
1.32%
|
10.00
|
Core Business Personnel
|
|
HUA CHEN
|
Limited Partner
|
0.93%
|
7.00
|
Core Business Personnel
|
|
CHENG CHENG
|
Limited Partner
|
0.66%
|
5.00
|
Core Business Personnel
|
|
CHENHUA LU
|
Limited Partner
|
0.40%
|
3.00
|
Core Business Personnel
|
|
Xindai Management
Consulting (Shanghai) Ltd.
|
General Partner
|
0.03%
|
0.20
|
-
|
|
Total
|
-
|
100.00%
|
756.20
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
③
|
Basic Information of the General Partner
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Integrated Circuit Industry Fund Co., Ltd.
|
|
Domicile
|
Unit A, Room 1201, No.289 Chunxiao Road, China (Shanghai) Pilot Free Trade Zone
|
|
Unified Social Credit Code
|
91310000MA1FL3AW02
|
|
Executive Partner
|
HONGYAN FU
|
|
Registered Capital
|
RMB28.5 billion Yuan
|
|
Type of Enterprise
|
Joint Stock Company Limited
|
|
Business Scope
|
Equity investment; venture investment. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
Business Term
|
From December 7, 2016 to December 6, 2024
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name of Shareholder
|
Number of Shares (Ten
thousand)
|
Percentage of Shares
|
|
Shanghai Science and Technology Venture Capital (Group) Co., Ltd.
|
875,000
|
30.70
|
|
SAIC Group Equity Investment Co., Ltd.
|
600,000
|
21.05
|
|
Shanghai International Trust Corp., Ltd.
|
180,000
|
6.32
|
|
National Integrated Circuit Industry Investment Fund Co., Ltd.
|
300,000
|
10.53
|
|
Shanghai International Group
|
262,500
|
9.21
|
|
Shanghai Pudong High-tech Investment Co., Ltd.
|
200,000
|
7.02
|
|
Shanghai Guosheng Group Co., Ltd.
|
262,500
|
9.21
|
|
Shanghai Jiading Venture Capital Co., Ltd.
|
50,000
|
1.75
|
|
PICC Qixin (Jiaxing) Integrated Circuit Industry Investment Co., Ltd.
|
120,000
|
4.21
|
|
Total
|
2,850,000
|
100.00
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Pudong High-tech Investment Co., Ltd.
|
|
Domicile
|
4/F, No.416 Zhoushi Road, Pudong New District, Shanghai
|
|
Unified Social Credit Code
|
91310115320776596T
|
|
Legal Representative
|
YUN ZHU
|
|
Capital Contributions
|
RMB1,832.81 million Yuan
|
|
Type of Enterprise
|
Limited Company
|
|
Business Scope
|
Equity investment; industrial investment; investment management; investment consultancy; enterprise management consultancy; enterprise M&A consultancy (brokerage services not included in the above
consultancy services). [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
Business Term
|
From October 24, 2014 to no fixed term
|
|
Name of Shareholder
|
Capital Contributions (RMB 10,000 Yuan)
|
Percentage of Shareholding (%)
|
|
Shanghai Pudong Technology Innovation Group Co., Ltd.
|
183.281
|
100
|
|
Total
|
183.281
|
100
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Shangrong Innovation (Ningbo) Equity Investment Center (L.P.)
|
|
Domicile
|
A0006, Zone C, Room 401, Building 1, No.88 Meishanqixing Road, Beilun District, Ningbo City, Zhejiang Province
|
|
Unified Social Credit Code
|
91330206MA2AHTFM7E
|
|
Executive Partner
|
Beijing Shang Finance Corporation
|
|
Registered Capital
|
RMB 1 billion Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Equity investment and related consultancy services. (being prohibited from engaging in financial businesses such as deposit taking, financing guarantee, financial management for clients, raising capital
(financing) from the public without the approval of financial regulators) [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been
obtained]
|
|
Business Term
|
From March 29, 2018 to March 28, 2028
|
|
Name of Partner
|
Partner
|
Capital
Contributions
(RMB 10,000
Yuan)
|
Contribution
Proportion (%)
|
|
Ningbo HeYuan Holding Co., Ltd.
|
Limited Partner
|
91,000
|
91.00
|
|
Ningbo HeYuan Holding Co., Ltd.
|
Limited Partner
|
7,000
|
7.00
|
|
RUIHUA ZHENG
|
Limited Partner
|
1,000
|
1.00
|
|
Beijing Shang Finance Corporation
|
General Partner
|
1,000
|
1.00
|
|
Total
|
100,000
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Beijing Shang Finance Corporation
|
|
Domicile
|
A0002, Zone C, Room 401, Building 1, No.88 Meishanqixing Road, Beilun District, Ningbo City, Zhejiang Province
|
|
Date of Establishment
|
July 17, 2015
|
|
Unified Social Credit Code
|
9133020634047013XJ
|
|
Legal Representative
|
HONGJIAN XIAO
|
|
Registered Capital
|
RMB100 million Yuan
|
|
Business Scope
|
Asset management; investment management; investment consultancy, industrial investment; equity investment (being prohibited from engaging in financial businesses such as deposit taking, financing guarantee,
financial management for clients, raising capital (financing) from the public without the approval of financial regulators) [For projects subject to any approval in accordance with laws, business activities may be carried out only after such
approval of relevant authorities has been obtained]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Yongkong Business Information Consulting Partnership (L.P.)
|
|
Domicile
|
Room 402, No.2, Lane 180, Zhangheng Road, China (Shanghai) Pilot Free Trade Zone
|
|
Unified Social Credit Code
|
91310115MA1K4EMM7R
|
|
Executive Partner
|
Shanghai Jiuyou Chuangu Investment Management Co., Ltd.
|
|
Registered Capital
|
RMB23.2323 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Commercial information consultancy; enterprise management consultancy; marketing planning; enterprise image planning; exhibition services; etiquette services; graphic design; computer technology; technology
development, technology consultancy, technology services, technology transfer and information technology consultancy services within the field of internet technology. [For projects subject to any approval in accordance with laws, business
activities may be carried out only after such approval of relevant authorities has been obtained]
|
|
Business Term
|
From September 25, 2019 to September 24, 2049
|
|
Name of Partner
|
Category of
Partner
|
Capital
Contributions
(RMB 10,000
Yuan)
|
Capital Proportion
(%)
|
|
Shanghai Shangguo Investment Asset Management Co., Ltd.
|
Limited Partner
|
1,400
|
60.26
|
|
Shanghai Jiushen Equity Investment Fund Partnership Enterprise (L.P.)
|
Limited Partner
|
800
|
34.43
|
|
FAN LIU
|
Limited Partner
|
100
|
4.30
|
|
Shanghai Jiuyou Chuangu Investment Management Co., Ltd.
|
General Partner
|
23.23
|
1.00
|
|
Total
|
2,323.23
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Shanghai Jiuyou Chuangu Investment Management Co., Ltd.
|
|
Domicile
|
Room 08, 5/F, No.2 Office Building, Lane 180, Zhangheng Road, China (Shanghai) Pilot Free Trade Zone
|
|
Date of Establishment
|
January 16, 2013
|
|
Unified Social Credit Code
|
91310115060900342P
|
|
Legal Representative
|
XIAOLONG LIU
|
|
Registered Capital
|
RMB10 million Yuan
|
|
Business Scope
|
Industrial investment; investment management; investment consultancy; business consultancy, enterprise management consultancy (brokerage services are not included in the above consultancy services); asset
management (For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained)
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Hefei Runguang Equity Investment Partnership (L.P.)
|
|
Domicile
|
Room 560, Fund Tower, Building E1, Innovation Industrial Park Phase II, No.2800 Innovation Avenue, High-tech Zone, Hefei City
|
|
Unified Social Credit Code
|
91340100MA2TER55XC
|
|
Executive Partner
|
Huaxin Yuanchuang (Qingdao) Capital Management Co., Ltd.
|
|
Registered Capital
|
RMB100 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Using self-owned funds to make equity investment; enterprise management consultancy services. (being prohibited from engaging in financial businesses such as deposit taking, financing guarantee, financial
management for clients without the approval of financial regulators) (For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained)
|
|
Business Term
|
From January 23, 2019 to January 22, 2026
|
|
Name of Partner
|
Category of Partner
|
Capital Contributions (RMB 10,000 Yuan)
|
Contribution Proportion (%)
|
|
Shenzhen Xiaoyezitan Investment Partnership (L.P.)
|
Limited Partner
|
5,772
|
59.94
|
|
Hefei Huadeng Integrated Circuit Industry Investment Fund Co., Ltd.
|
Limited Partner
|
3,848
|
39.96
|
|
Huaxin Yuanchuang (Qingdao) Capital Management Co., Ltd.
|
General Partner
|
9.53
|
0.10
|
|
Total
|
10,000
|
100.00
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
③
|
Basic Information of the General Partner
|
|
Name
|
Huaxin Yuanchuang (Qingdao) Capital Management Co., Ltd.
|
|
Domicile
|
Room 2004, No.658, Jinggangshan Road, Huangdao District, Qingdao City, Shandong Province
|
|
Date of Establishment
|
September 20, 2016
|
|
Unified Social Credit Code
|
91370211MA3CH4UD45
|
|
Legal Representative
|
Hing Wong
|
|
Registered Capital
|
RMB 100 million Yuan
|
|
Business Scope
|
Entrusted to manage the investment business of investment enterprises; providing investment consultancy and investment management consultancy services; enterprise management consultancy.
(The above services do not involve fund business; being prohibited from engaging in financial services such as deposit taking, financing guarantee, financial management for clients without the approval of financial regulators) (The above
business scope does not include any project restricted, prohibited and ousted by state laws and regulations, and projects subject to approval according to law shall be approved by the relevant departments before carrying out business
activities) (Projects subject to approval according to law shall be approved by the relevant departments before carrying out business activities)
|
|
④
|
Recordation of privately offered investment fund
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Zhangjiang Science and Technology Venture Capital Co., Ltd.
|
|
Domicile
|
Room 209, Building 1 Complex, No.3000 Longdong Avenue, China (Shanghai) Pilot Free Trade Zone
|
|
Unified Social Credit Code
|
913100007679066259
|
|
Legal Representative
|
HONGLIANG YU
|
|
Registered Capital
|
RMB1 billion Yuan
|
|
Type of Enterprise
|
Limited Company
|
|
Business Scope
|
Venture capital investment; providing agency services for other venture capital investment enterprises and other institutions or individuals as to their venture capital investment, venture capital investment
consultancy businesses; providing venture capital management service business for venture capital enterprises; participating in the set up of venture capital investment enterprises and venture capital management consultancy institutions. (For
projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant authorities has been obtained)
|
|
Business Term
|
From October 9, 2004 to October 8, 2054
|
|
Name of Shareholder
|
Capital Contributions (RMB 10,000 Yuan)
|
Percentage of Shareholding (%)
|
|
Zhangjiang Group
|
100,000
|
100
|
|
Total
|
100,000
|
100
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Shanyi Enterprise Management Center (L.P.)
|
|
Domicile
|
Room 601-31, No.198 Wudong Road, Yangpu District, Shanghai
|
|
Unified Social Credit Code
|
91310110MA1G92DE5Y
|
|
Executive Partner
|
WEIWEI XU
|
|
Registered Capital
|
RMB15.17 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Enterprise management and consultancy; commercial information consultancy; financial consultancy. (For projects subject to any approval in accordance with laws, business activities may be carried out only after
such approval of relevant authorities has been obtained)
|
|
Business Term
|
From September 19, 2019 to September 18, 2029
|
|
Name of Partner
|
Category of Partner
|
Capital Contributions (RMB 10,000 Yuan)
|
Contribution Proportion (%)
|
|
WEIWEI XU
|
General Partner
|
1,316.756
|
86.80
|
|
JUN JIANG
|
Limited Partner
|
100.122
|
6.60
|
|
XU LU
|
Limited Partner
|
100.122
|
6.60
|
|
Total
|
-
|
1,517.000
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
Basic Information
|
|
Name
|
Shanghai Shangrong JuYuan Equity Investment Center (L.P.)
|
|
Domicile
|
Room 1206, 12/F, No.407-1 Yishan Road, Xuhui District, Shanghai
|
|
Unified Social Credit Code
|
91310000MA1FL3X64K
|
|
Executive Partner
|
Beijing Shang Finance Corporation
|
|
Registered Capital
|
RMB 460 million Yuan
|
|
Type of Enterprise
|
Limited Partnership
|
|
Business Scope
|
Equity investment; industrial investment; investment management; asset management. (For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval
of relevant authorities has been obtained)
|
|
Business Term
|
From May 8, 2017 to May 7, 2027
|
|
Name of Partner
|
Category of Partner
|
Capital Contributions (RMB 10,000 Yuan)
|
Contribution Proportion (%)
|
|
Gongqingcheng Shangrong Investment Management Partnership (L.P.)
|
Limited Partner
|
45,100
|
98.04
|
|
Beijing Shang Finance Corporation
|
General Partner
|
450
|
0.98
|
|
Ningbo Ronghui Investment Center (L.P.)
|
Limited Partner
|
450
|
0.98
|
|
Total
|
46,000
|
100.00
|
|
③
|
Basic Information of the General Partner
|
|
④
|
Recordation of privately offered investment fund
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Shareholder
|
Date of capital increase
|
Price for capital increase (RMB/Share)
|
Pricing basis
|
|
1
|
Xinwei Consulting
|
August 20, 2019
|
13.00
|
The parties to capital increase confirm after negotiation based on Company’s performance and future development
|
|
2
|
[***]
|
August 20, 2019
|
13.00
|
|
|
3
|
Taihu Guolian
|
August 20, 2019
|
13.00
|
|
|
4
|
Jinpu Investment
|
August 20, 2019
|
13.00
|
|
|
5
|
Haifeng Investment
|
August 20, 2019
|
13.00
|
|
|
6
|
Xinshi Consulting
|
August 20, 2019
|
10.40
|
The parties to capital increase confirm after negotiation by reference with prices of other external investors in the same capital increase for purpose of allowing the Issuer’s employees to hold its shares
|
|
7
|
Xingang Consulting
|
August 20, 2019
|
10.40
|
|
|
8
|
SICIF
|
December 13, 2019
|
13.00
|
The parties to capital increase confirm after negotiation based on overall assets evaluation value of the Issuer as well as Company’s performance and future development
|
|
9
|
PDHTI
|
December 13, 2019
|
13.00
|
|
|
10
|
Shangrong Innovation
|
December 13, 2019
|
13.00
|
|
|
11
|
Yongkong Consulting
|
December 13, 2019
|
13.00
|
|
|
12
|
Runguang Investment
|
December 13, 2019
|
13.00
|
|
|
13
|
ZJTVC
|
December 13, 2019
|
13.00
|
|
|
14
|
SYEM
|
December 13, 2019
|
13.00
|
|
|
15
|
SRJY
|
December 13, 2019
|
13.00
|
|
1.
|
Xinshi Consulting and Xingang Consulting
|
|
2.
|
SICIF and PDHTI
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(I)
|
Members of the board of directors
|
|
No.
|
Name
|
Position
|
Nominator
|
Term of Office
|
|
1
|
HUI WANG
|
Chairman
|
ACMR
|
Nov. 14, 2019 - Nov.13, 2022
|
|
2
|
HAIPING DUN
|
Director
|
ACMR
|
Nov. 14, 2019 - Nov.13, 2022
|
|
3
|
STEPHEN SUN-HAI CHIAO
|
Director
|
ACMR
|
Nov. 14, 2019 - Nov.13, 2022
|
|
4
|
JIAN WANG
|
Director
|
ACMR
|
Jul. 8, 2020 - Nov. 13, 2022
|
|
5
|
Charles Law
|
Director
|
ACMR
|
Nov. 14, 2019 - Nov. 13, 2022
|
|
6
|
JIANG LI
|
Director
|
SICIF
|
Mar. 30, 2020 - Nov. 13, 2020
|
|
7
|
CHEN HUANG
|
Director
|
PDHTI
|
Mar. 30, 2020 - Nov. 13, 2020
|
|
8
|
DI ZHANG
|
Independent Director
|
Board of Directors
|
Nov. 14, 2019 - Nov. 13, 2022
|
|
9
|
MINGXIU PENG
|
Independent Director
|
Board of Directors
|
Nov. 14, 2019 - Nov. 13, 2022
|
|
10
|
ZHANBING REN
|
Independent Director
|
Board of Directors
|
Nov. 14, 2019 - Nov. 13, 2022
|
|
11
|
SUTONG ZHANG
|
Independent Director
|
Board of Directors
|
Jul. 8, 2020 - Nov. 13, 2022
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name
|
Position
|
Nominator
|
Term of Office
|
|
1
|
TRACY DONG LIU
|
Supervisor
|
ACMR
|
Nov.14,2019 -Nov.13,2022
|
|
2
|
QIAN DONG
|
Supervisor
|
ACMR
|
Mar 30, 2020 -Nov.13,2020
|
|
3
|
QIAN LI
|
Employee Representative Supervisor
|
General Meeting of Employee Representative
|
Nov.14,2019 -Nov.13,2022
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name
|
Position
|
|
1
|
JIAN WANG
|
General Manager
|
|
2
|
FUPING CHEN
|
Deputy General Manager
|
|
3
|
SOTHEARA CHEAV
|
Deputy General Manager
|
|
4
|
LISA YI LU FENG
|
Person in Charge of Financial Matters
|
|
5
|
MINGZHU LUO
|
Secretary of Board of Directors
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name
|
Position
|
|
1
|
HUI WANG
|
Chairman
|
|
2
|
JIAN WANG
|
Director, General Manager
|
|
3
|
FUPING CHEN
|
Deputy General Manager
|
|
4
|
SOTHEARA CHEAV
|
Deputy General Manager
|
|
5
|
JUN WANG
|
Vice President of Electrical Engineering
|
|
6
|
XUEJUN LI
|
Vice President of After-sale Services
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Position in the Company
|
Name of Employer
|
Position
|
Relationship
with the
Issuer
|
|
HUI WANG
|
Chairman
|
ACMR
|
Chairman, CEO
|
Controlling Shareholder
|
|
ACM Research(Cayman)
|
Director
|
Related party
|
||
|
ACM RESEARCH (SINGAPORE) PTE. LTD.
|
Director
|
Related party
|
||
|
NINEBELL
|
Director
|
Related party
|
||
|
HAIPING DUN
|
Director
|
ACMR
|
Director
|
Controlling Shareholder
|
|
STEPHEN SUN-HAI CHIAO
|
Director
|
Sycamore Management Corporation
|
Managing Partner
|
Related party
|
|
Silicon Technology Investment (Cayman) Corp.
|
Director
|
Related party
|
||
|
Green Expedition LLC
|
Director
|
Related party
|
||
|
Charles Law
|
Director
|
Law and Law
|
Managing Partner
|
Related party
|
|
Sycamore Management Corporation
|
Partner
|
Related party
|
||
|
Nanjing Shuige Investment and Management Consultancy Co., Ltd.
|
Supervisor
|
None
|
||
|
CHEN HUANG
|
Director
|
Shanghai Pudong Technology Innovation Group Co., Ltd.
|
Investment I Department
Deputy General Manager
|
None
|
|
ASR Microelectronics (Shanghai) Co., Ltd.
|
Director
|
Related party
|
||
|
Ideal Energy (Shanghai) Sunflower Thin Film Equipment Ltd.
|
Director
|
Related party
|
||
|
RSIC Scientific Instrument (Shanghai) Co., Ltd.
|
Director
|
Related party
|
||
|
Advanced Micro-Fabrication Equipment Inc. China
|
Supervisor
|
None
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
JIANG LI
|
Director
|
Shanghai Integrated Circuit Industry Investment Fund Management Co., Ltd.
|
Investment Director
|
None
|
|
Shanghai Integrated Circuit Industry Investment Fund (Phase II) Co., Ltd.
|
Director
|
None
|
||
|
SMIC Southern Integrated Circuit Manufacturing Co., Ltd.
|
Supervisor
|
None
|
||
|
Shanghai Jita Semiconductor Co, Ltd.
|
Director
|
Related party
|
||
|
EverDisplay Optronics (Shanghai) Limited
|
Director
|
Related party
|
||
|
Shanghai Qiyuji Sports Technology Development Co., Ltd.
|
Supervisor
|
None
|
||
|
DI ZHANG
|
Independent Director
|
School of Materials Science and Engineering, Shanghai Jiao Tong University
|
Professor
|
None
|
|
MINGXIU PENG
|
Independent Director
|
Haihua Investment Co., Ltd.
|
Chairman
|
None
|
|
Qifa Electronics Co., Ltd.
|
Director
|
None
|
||
|
Mars Semiconductor Corp.
|
Independent Director
|
None
|
||
|
ZHANBING REN
|
Independent Director
|
Shanghai Mengtebao International Trading Co., Ltd.
|
Executive Director
|
None
|
|
Shanghai Ruizhong International Trading Co., Ltd.
|
Executive Director
|
None
|
||
|
Black Peony (Group) Co., Ltd.
|
Independent Director
|
None
|
||
|
Sutong Zhang
|
Independent Director
|
Finance and Accounting Department, Business School, China University of Political Science and Law
|
Professor
|
None
|
|
Chang’an Bank Co., Ltd.
|
Independent Director
|
None
|
||
|
Baoying Fund Management Co., Ltd.
|
Independent Director
|
None
|
||
|
Beijing Huili Tongda Technology Co., Ltd.
|
Supervisor
|
None
|
||
|
TRACY DONG LIU
|
Supervisor
|
ACMR
|
Director
|
Controlling Shareholder
|
|
H&M Int’l CPAs, LLP
|
Managing Partner
|
Related party
|
||
|
QIAN DONG
|
Supervisor
|
Yunnan Energy Investment Ruizhang Internet of Things Technology Ltd.
|
Director and General Manager
|
Related party
|
|
Shanghai Viewnoon Information Technology Co., Ltd.
|
Director
|
Related party
|
||
|
Shanghai Zhaonengkun Information Technology Co., Ltd.
|
Director
|
Related party
|
||
|
Nanjing Oraro Technology Co., Ltd.
|
Director
|
Related party
|
||
|
Shanghai Zhimeng Internet of Things Technology Co., Ltd.
|
Executive Director and General Manager
|
Related party
|
||
|
MINGZHU LUO
|
Secretary of Board of Directors
|
Shengyi Technology
|
Director
|
Shareholding Subsidiary
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Position in the Company
|
Name of Investee
|
Shareholding Percentage
|
Relationship with the Issuer
|
|
STEPHEN SUN-HAI CHIAO
|
Director
|
Green Expedition LLC
|
100%
|
Related party
|
|
ZHANBING REN
|
Independent Director
|
Shanghai Mengtebao International Trading Co., Ltd.
|
50%
|
Related party
|
|
Shanghai Ruizhong International Trading Co., Ltd.
|
30%
|
Related party
|
||
|
QIAN DONG
|
Supervisor
|
Shanghai Zhimeng Internet of Things Technology Co., Ltd.
|
60%
|
Related party
|
|
Shanghai Lianwan Investment Management Center (Limited Partnership)
|
50%
|
Related party
|
||
|
Shanghai Zhaonengkun Information Technology Co., Ltd.
|
11.29%
|
Related party
|
||
|
Xinwei Consulting
|
3.23%
|
Shareholder
|
||
|
FUPING CHEN
|
Deputy General Manager
|
Shengxin Shanghai
|
2.94%
|
Related party
|
|
MINGZHU LUO
|
Secretary of Board of Directors
|
1.55%
|
|
Company
holding the
shares of the Company
|
Relationship with
the Issuer
|
Name
|
Position/Family
Relation
|
Information on Shareholding
|
|
ACMR
|
Holding 91.67% of shares in the Company
|
HUI WANG
|
Chairman
|
Holding 168,006 shares of Class A stock and 1,146,934 shares of Class B stock in ACMR
|
|
JING CHEN
|
Spouse of HUI WANG
|
Holding 33,334 shares of Class A stock in ACMR, indirectly holding 206,667 shares of Class A stock and 60,000 shares of Class A stock in ACMR through David Hui Wang & Jing Chen Family
Living Trust and David Hui Wang & Jing Chen Irrevocable Trust respectively, and indirectly holding 7,334 shares of Class B stock in ACMR through David Hui Wang & Jing Chen Irrevocable Trust
|
||
|
BRIAN WANG
|
Son of HUI WANG
|
Holding 117,334 shares of Class B stock in ACMR
|
||
|
SOPHIA WANG
|
Daughter of HUI WANG
|
Holding 15,279 Class A shares and 117,334 shares of Class B stock in ACMR
|
||
|
HAIPING DUN
|
Director
|
Hoding 285,030 Class A shares and 100,000 shares of Class B stock in ACMR
|
||
|
STEPHEN SUN-HAI CHIAO
|
Director
|
Holding 69,815 shares of Class B stock in ACMR, indirectly holding 23,334 shares of Class A stock in ACMR through Green Expedition LLC, and indirectly holding 30,000 shares of Class B
stock in ACMR through Stephen Sun-Hai And Mary Wu-Chun Chiao Revocable Trust
|
||
|
Charles Law
|
Director
|
Holding 30,112 shares of Class A stock in ACMR
|
||
|
ZHANBING REN
|
Independent Director
|
Holding 3,334 shares of Class B stock in ACMR
|
||
|
TRACY DONG LIU
|
Supervisor
|
Holding 257 shares of Class A stock in ACMR
|
||
|
JIAN WANG
|
Director, General Manager
|
Holding 84,386 shares of Class A stock and 50,001 shares of Class B stock in ACMR
|
||
|
QIAN DONG
|
Supervisor
|
Holding 34,000 shares of Class A stock in ACMR
|
||
|
SOTHEARA CHEAV
|
Deputy General Manager
|
Holding 43,334 shares of Class A stock in ACMR
|
||
|
LISA YI LU FENG
|
Person in Charge of Financial Matters
|
Holding 6,943 shares of Class A stock in ACMR
|
||
|
CHEN HUANG
|
Director
|
Holding 609 shares of Class A stock in ACMR
|
||
|
JUN WANG
|
Key Technician
|
Holding 800 shares of Class A stock in ACMR
|
||
|
XUEJUN LI
|
Key Technician
|
Holding 800 shares of Class A stock in ACMR
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Xinwei Consulting
|
Holding 1.22% of shares in the Company
|
QIAN DONG
|
Supervisor
|
Holding 3.23% of shares in Xinwei Consulting
|
|
Xinshi Consulting
|
Holding 0.46% of shares in the Company
|
JUN WANG
|
Key Technician
|
Holding 5.40% of shares in Xinshi Consulting
|
|
XUEJUN LI
|
Key Technician
|
Holding 5.40% of shares in Xinshi Consulting
|
||
|
Shengxin Shanghai
|
Holding 242,681 shares of common stock in ACMR
|
FUPING CHEN
|
Deputy General Manager
|
Holding 2.94% of the capital contribution of Shengxin Shanghai
|
|
MINGZHU LUO
|
Board Secretary
|
Holding 1.55% of the capital contribution of Shengxin Shanghai
|
||
|
JUN WANG
|
Key Technician
|
Holding 0.77% of the capital contribution of Shengxin Shanghai
|
||
|
XUEJUN LI
|
Key Technician
|
Holding 0.77% of the capital contribution of Shengxin Shanghai
|
||
|
LINLI YU
|
Wife of the Director and General Manager JIAN WANG
|
Holding 10.97% of the capital contribution of Shengxin Shanghai
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Name
|
Position
|
Remuneration in 2020
|
|
1
|
HUI WANG
|
Chairman
|
145.23
|
|
2
|
HAIPING DUN
|
Director
|
-
|
|
3
|
STEPHEN SUN-HAI CHIAO
|
Director
|
-
|
|
4
|
JIAN WANG
|
Director, General Manager
|
92.80
|
|
5
|
Charles Law
|
Director
|
-
|
|
6
|
CHEN HUANG
|
Director
|
-
|
|
7
|
JIANG LI
|
Director
|
-
|
|
8
|
DI ZHANG
|
Independent Director
|
15.14
|
|
9
|
MINGXIU PENG
|
Independent Director
|
11.30
|
|
10
|
ZHANBING REN
|
Independent Director
|
11.30
|
|
11
|
SUTONG ZHANG
|
Independent Director
|
4.82
|
|
12
|
TRACY DONG LIU
|
Supervisor
|
6.78
|
|
13
|
QIAN DONG
|
Supervisor
|
4.50
|
|
14
|
QIAN LI
|
Employee Representative Supervisor
|
14.45
|
|
15
|
FUPING CHEN
|
Deputy General Manager
|
110.88
|
|
16
|
SOTHEARA CHEAV
|
Deputy General Manager
|
91.43
|
|
17
|
LISA YI LU FENG
|
Person in Charge of Financial Matters
|
129.87
|
|
18
|
MINGZHU LUO
|
Secretary of Board of Directors
|
68.25
|
|
19
|
JUN WANG
|
Key Technician
|
87.44
|
|
20
|
XUEJUN LI
|
Key Technician
|
81.78
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
2019
|
2018
|
|
|
Exercise price of the stock option
|
152.23-588.16
|
94.10-115.96
|
35.14-91.65
|
|
Fair value on the grant date
|
152.23-588.16
|
94.10-115.96
|
35.14-91.65
|
|
Expected life of the option
|
5.50-6.25
|
6.25
|
6.25
|
|
Expected volatility of ACMR stocks
|
42.17%-48.15%
|
39.91%-40.35%
|
39.14%-43.00%
|
|
Risk-free interest rate over the expected life of the option
|
0.44%-0.82%
|
1.69%-2.46%
|
2.55%-2.96%
|
|
Expected dividend yield of ACMR
|
0%
|
0%
|
0%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Professional Structure of
Employees
|
Percentage of Total Number
of Employees
|
|
|
Management Personnel
|
61
|
8.69%
|
|
Marketing Sales Personnel
|
14
|
1.99%
|
|
After-sales Service Personnel
|
163
|
23.22%
|
|
Production Personnel
|
153
|
21.79%
|
|
Finance Personnel
|
16
|
2.28%
|
|
Technology Research and Development Personnel
|
295
|
42.02%
|
|
Total
|
702
|
100.00%
|
|
Educational Level of Employees
|
Headcount
|
Percentage of Total Number of Employees
|
|
Master degree and above
|
124
|
17.66%
|
|
Bachelor degree
|
287
|
40.88%
|
|
College degree and below
|
291
|
41.45%
|
|
Total
|
702
|
100.00%
|
|
Age Distribution of Employees
|
Headcount
|
Percentage of Total Number of Employees
|
|
50 and above
|
15
|
2.14%
|
|
40-49
|
43
|
6.13%
|
|
30-39
|
241
|
34.33%
|
|
30 and below
|
403
|
57.41%
|
|
Total
|
702
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Time
|
Number of employees (person)
|
Number of employees with payment (person)
|
|||||
|
Pension insurance
|
Medical insurance
|
Unemployment insurance
|
Maternity insurance
|
Employment injury insurance
|
Housing provident fund
|
||
|
End of 2018
|
253
|
214
|
214
|
214
|
214
|
214
|
213
|
|
End of 2019
|
328
|
270
|
270
|
270
|
270
|
270
|
270
|
|
End of 2020
|
483
|
436
|
436
|
436
|
436
|
436
|
436
|
|
End of June 2020
|
633
|
561
|
561
|
561
|
561
|
561
|
561
|
|
Time
|
Category
|
Difference number
(person)
|
Reasons for the difference between the number of employees with payment and the number of employees
|
||
|
Foreign employees
|
Third-party withholding
|
Outstanding or other
|
|||
|
End of 2018
|
Social insurance premium
|
39
|
8
|
31
|
-
|
|
Housing provident fund
|
40
|
8
|
31
|
1
|
|
|
End of 2019
|
Social insurance premium
|
58
|
9
|
49
|
-
|
|
Housing provident fund
|
58
|
9
|
49
|
-
|
|
|
End of 2020
|
Social insurance premium
|
47
|
6
|
34
|
7
|
|
Housing provident fund
|
47
|
6
|
34
|
7
|
|
|
End of June 2021
|
Social insurance premium
|
72
|
6
|
52
|
14
|
|
Housing provident fund
|
72
|
6
|
52
|
14
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Number
|
Field of Customer
|
Name of Customer
|
|
1
|
Wafer manufacturing
|
Hynix, Huahong Group, Yangtze Memory, SMIC, Hefei Changxin
|
|
2
|
Advanced Packaging
|
JCET, TFME, SJsemi, Nepes
|
|
3
|
Manufacturing and recycling of semiconductor silicon wafer
|
ZING SEMI, Wafer Works, Wafer Works, PSI
|
|
4
|
Research institutes
|
Institute of Microelectronics of Chinese Academy of Sciences, Shanghai Integrated Circuit, NCAP
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Main products
|
Technical characteristics
|
Application field
|
|
Semiconductor cleaning equipment
|
||
![]() Single-chip cleaning equipment
|
The equipment can simultaneously clean the front and back of the wafer. Each equipment can be equipped with a variety of chemical liquids, which can be applied to single-chip wet cleaning and single-chip wet
etching technology.
|
The equipment can be used for front and back cleaning of film deposition in chip manufacturing, cleaning after dry etching, cleaning after ion implantation ashing, cleaning after chemical mechanical grinding,
cleaning after polishing and epitaxy, cleaning for chemical wet etching and other process.
|
![]() SAPS single-chip cleaning equipment
|
On the basis of the traditional single-chip cleaning equipment configuration, the equipment is equipped with the megasonic cleaning technology (SAPS) independently developed by the Company. The equipment is
mainly aimed at the cleaning process of flat wafer surfaces and deep holes, focusing on the removal of small particles. In the process below 45nm, it effectively solves the cleaning problem of organic contamination and particles after
etching, which greatly improves the cleaning efficiency.
|
The equipment can be used for front and back cleaning of film deposition in chip manufacturing, cleaning after dry etching, cleaning after ion implantation ashing, cleaning after chemical mechanical grinding,
cleaning after polishing and epitaxy process and other process.
|
![]() TEBO single-chip cleaning equipment
|
On the basis of the configuration of the traditional single-chip cleaning equipment, the equipment is equipped with the megasonic cleaning technology of Timely Energized Bubble Oscillation (TEBO), which is
independently developed by the Company, to provide efficient cleaning of 3D structure wafers. In the case where the high aspect ratio of 3D chip is gradually improved, TEBO technology can stabilize the bubble’s oscillation to achieve low
damage or even zero damage.
|
The equipment can be used for front cleaning of film deposition in chip manufacturing, cleaning after dry etching, cleaning after ion implantation ashing and other process.
|
![]() Single-chip slot-type combined cleaning equipment
|
Its integrated single-cavity cleaning module and slot-type cleaning module integrate the slot-type degumming process with the single-chip cleaning process. Compared with the traditional single-chip cleaning
equipment, it can greatly save the amount of sulfuric acid, and the cleaning ability is comparable to the single-chip cleaning equipment.
|
The equipment can be used in photoresist stripping and cleaning of chip manufacturing, cleaning after dry etching, cleaning after ion implantation, cleaning after chemical mechanical grinding, metal film
removal and other process.
|
![]() Single-chip back cleaning equipment
|
The equipment uses non-contact clamping method of Bernoulli suspension, which can effectively protect the surface of wafer device and perform the cleaning or wet etching for the spray chemical liquid on the
back of the wafer. It can be used for ultra-thin wafers with large warping degree or bonded wafers with carriers.
|
It can be used for the cleaning and wet etching process of the wafer backside in chip manufacturing.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
![]() Scrubbing equipment for front end
|
The equipment adapts a single-chip cavity to clean the front and back of the wafer according to the working procedure. It can perform cleaning process including wafer backside scrubbing, wafer edge scrubbing,
front and back cleaning for two-phase fluid, etc .; the equipment occupies a small area with high productivity and strong stability. There are various cleaning methods to be flexibly selected.
|
It can be used in the scrubbing process from the front end to the last end in chip manufacturing.
|
![]() Slot-type cleaning equipment
|
The equipment uses pure water, alkaline and acidic liquids as cleaning agents, and is combined with cleaning methods such as spray, hot dip, overflow and bubbling, and is equipped with advanced IPA drying
method to clean the wafers in batches.
|
It can be used for cleaning, wet etching, film stripping, photoresist removal and other processes in the field of chip manufacturing.
|
|
Semiconductor electroplating equipment
|
||
![]() Copper interconnection electroplating equipment for the front end
|
Aiming at Ultra ECP map of the copper interconnection electroplating technology for the front end, which is the 55nn, 40nm, 28nm and below 20-14 nm technology nodes, the equipment mainly acts on the wafer to
deposit a layer of dense and uniformly distributed copper without holes, gaps and other defects.
|
It can be used in the dual damascene electro-coppering process in logical circuits and memory circuits.
|
![]() Advanced packaging electroplating equipment for the back end
|
The equipment is developed in a differentiated manner to meet the needs of advanced packaging electroplating and can be used for high-current and high-speed electroplating applications. It adopts a modular
design, which is convenient for maintenance and control, can shorten the maintenance time of equipment and improve the utilization rate of equipment.
|
It can be used in the advanced packaging Pillar Bump, RDL, HD Fan-out and TSV, and the electroplating processes, such as copper, nickel, tin, silver, gold, etc.
|
|
Advanced packaging wet equipment
|
||
![]() Advanced packaging wet equipment
|
The equipment uses a single-chip cavity to perform wet etching on the wafer surface. It integrates all the chemical liquid, pure water and gas lines for drying in a complete process into a cavity. The
equipment occupies a small area, consumes less chemicals and pure water with high flexibility in process adjustment.
|
It can be used for wet silicon etching of 12-inch and 8-inch wafers and UBM metal wet etching processes in advanced packaging, such as copper, titanium, nickel, tin, gold, etc.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
![]() Gumming equipment
|
The equipment uses a single-chip cavity to perform the photoresist spin coating on the surface of the wafer, and completes the subsequent roasting and cooling working procedure in the hot and the cold plate.
The equipment pioneers the self-cleaning function of the cavity, which replaces the traditional manual disassembly of the cavity for cleaning, avoiding the damage to the machine caused by frequent manual disassembly of the precision gumming
machine. At the same time, the cleaning efficiency is greatly improved, the maintenance cost of the machine is reduced, and the service life of the machine is increased.
|
It can be used for the coating process of positive and negative glue and thin and thick glue for 12-inch and 8-inch wafers in advanced packaging.
|
![]() Developing equipment
|
The equipment uses a single-chip cavity to spray the developing solution on the surface of the wafer, and cleans and dries the wafer after spraying the developing solution. The equipment combines the
developing technology of Spray and puddle.
|
It can be used for the developing process of 12-inch and 8-inch wafers in advanced packaging.
|
![]() Degumming machine
|
The equipment integrates slot-type degumming with single-chip degumming, completes the soaking process in the slot, softens and removes most of the thick glue. The single-chip degumming can complete the
subsequent removal of residual glue, contaminants and particles and make up for the shortcomings of insufficient capacity of single-chip equipment.
|
It can be used for the degumming process of 12-inch and 8-inch wafers in advanced packaging.
|
![]() Advanced packaging scrubbing equipment
|
The equipment uses a single-chip cavity to spray chemical liquid or deionized water on the front and back of the wafer to achieve the cleaning, and use the physical brush to clean the wafer.
|
It can be used for the scrubbing and cleaning process of 12-inch and 8-inch wafers in advanced packaging.
|
![]() Stress-free polishing equipment
|
Stress-free polishing machine (Ultra SFP) is based on the principle of electro-chemistry and integrates stress-free polishing, chemical mechanical polishing, and wet etching processes. In advanced packaging
applications, it can greatly reduce the consumption of polishing solution and reduce chemical emissions.
|
It can be used for 3D TSV, 2.5D silicon interposer, RDL, HD Fan-out, and others in advanced packaging.
|
|
Other equipment
|
||
![]() Vertical furnace tube equipment
|
The equipment can handle wafers process in batches to complete the deposition process of different types of non-metal thin films on the surface of wafers. It is mainly used for polycrystalline silicon,
silicon nitride, silicon oxide and other thin films.
|
It can be used for the film deposition of polycrystalline silicon, silicon nitride, and silicon oxide in front end process of logical circuits and memory circuits.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Semiconductor cleaning equipment
|
48,900.39
|
83.16%
|
81,627.25
|
83.69%
|
62,522.30
|
84.10%
|
50,135.96
|
92.91%
|
|
Including: Single-wafer cleaning equipment
|
43,884.74
|
74.63%
|
71,610.80
|
73.42%
|
55,099.52
|
74.12%
|
50,135.96
|
92.91%
|
|
Wet bench cleaning equipment
|
5,015.65
|
8.53%
|
3,310.85
|
3.39%
|
4,801.36
|
6.46%
|
-
|
-
|
|
Single wafer wet bench combined cleaning equipment
|
-
|
-
|
6,705.60
|
6.88%
|
2,621.43
|
3.53%
|
-
|
-
|
|
Semiconductor electroplating equipment
|
3,591.85
|
6.11%
|
5,290.13
|
5.42%
|
7,857.39
|
10.57%
|
1,191.13
|
2.21%
|
|
Advanced packaging wet equipment
|
6,312.54
|
10.73%
|
9,856.51
|
10.11%
|
3,961.12
|
5.33%
|
2,634.07
|
4.88%
|
|
Vertical furnace tube equipment
|
-
|
-
|
758.90
|
0.78%
|
-
|
-
|
-
|
-
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
|
Sales revenue realized through agents
|
58,783.10
|
93,373.55
|
69,002.21
|
50,364.93
|
|
Revenue
|
62,528.08
|
100,747.18
|
75,673.30
|
55,026.91
|
|
Proportion
|
94.01%
|
92.68%
|
91.18%
|
91.53%
|
|
Agent
|
Agency Commission Rate
|
|
TJM PARTNERS LTD.
|
3%, 5%
|
|
LIDA TECHNOLOGY CO., LIMITED
|
2.5%, 4%, 5%
|
|
MOTION ELECTRONICS CO., LTD
|
3%, 5%
|
|
ZAIN TECHNOLOGY CO., LTD
|
3%
|
|
HANWOOL SCIENTIFIC CO., LTD.
|
0.5%, 3%, 3.5%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Company Name
|
Item
|
2020
|
2019
|
2018
|
|
NSIG
|
Sales commission
|
829.82
|
837.74
|
382.39
|
|
Proportion in revenue
|
0.46%
|
0.56%
|
0.38%
|
|
|
Montage Technology
|
Sales commission
|
293.70
|
542.24
|
7,268.71
|
|
Proportion in revenue
|
0.16%
|
0.31%
|
4.14%
|
|
|
ACMSH
|
Sales commission
|
4,046.99
|
2,761.73
|
1,931.14
|
|
Proportion in revenue
|
4.02%
|
3.65%
|
3.51%
|
|
②
|
The Company will continue to rely on agents to a certain extent in terms of new market development
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
③
|
Sales realized without reliance on agents
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Jan. - Jun.
2021
|
2020
|
2019
|
2018
|
|
Amount of sales through Charter Base International
|
-
|
-
|
-
|
6,935.04
|
|
Revenue
|
62,528.08
|
100,747.18
|
75,673.30
|
55,026.91
|
|
Proportion
|
-
|
-
|
-
|
12.60%
|
|
Item
|
Amount of Export in a Year
|
Charging Standard
|
|
Level 1
|
US$ 1-4,000,000
|
Calculated at 0.5% of the value of goods exported
|
|
Level 2
|
US$ 4,000,001-8,000,000
|
Calculated at 0.45% of the value of goods exported
|
|
Level 3
|
US$ 8,000,001-12,000,000
|
Calculated at 0.40% of the value of goods exported
|
|
Level 4
|
Over US$ 12,000,001
|
Calculated at 0.35% of the value of goods exported
|
|
ACM Research (Shanghai), Inc.
|
[***]
|

|
ACM Research (Shanghai), Inc.
|
[***]
|

|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|

|
ACM Research (Shanghai), Inc.
|
[***]
|

|
Country/Region
|
2019 (E)
|
2018
|
2017
|
|||
|
Sales
Percentage
|
Growth
|
Sales Percentage
|
Growth
|
Sales Percentage
|
Growth
|
|
|
US
|
21.90%
|
1.44%
|
22.14%
|
19.58%
|
21.47%
|
35.03%
|
|
Europe
|
9.02%
|
1.95%
|
9.08%
|
13.25%
|
9.29%
|
17.13%
|
|
Japan
|
8.39%
|
2.52%
|
8.39%
|
9.58%
|
8.88%
|
13.33%
|
|
Asia-Pacific
|
60.69%
|
3.06%
|
60.39%
|
16.00%
|
60.36%
|
19.40%
|
|
Including: Mainland China
|
32.37%
|
3.50%
|
32.08%
|
16.60%
|
31.90%
|
22.10%
|
|
Total
|
100.00%
|
2.55%
|
100.00%
|
15.94%
|
100.00%
|
21.62%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|

|
Item
|
2019
|
2018
|
2017
|
2016
|
2015
|
2014
|
2014-
2019
Compound Growth
|
|
|
Chip design
|
Sales
|
3,063.50
|
2,519.3
|
2,073.5
|
1,644.3
|
1,325.0
|
1,047.4
|
23.94%
|
|
Growth
|
21.60%
|
21.5%
|
26.1%
|
24.1%
|
26.5%
|
29.5%
|
||
|
Wafer manufacturing
|
Sales
|
2,149.10
|
1,818.2
|
1,448.1
|
1,126.9
|
900.8
|
712.1
|
24.72%
|
|
Growth
|
18.20%
|
25.6%
|
28.5%
|
25.1%
|
26.5%
|
18.5%
|
||
|
Packaging & testing
|
Sales
|
2,349.70
|
2,193.9
|
1,889.7
|
1,564.3
|
1,384.0
|
1,255.9
|
13.35%
|
|
Growth
|
7.10%
|
16.1%
|
20.8%
|
13.0%
|
10.2%
|
14.3%
|
||
|
Total
|
Sales
|
7,562.30
|
6,531.4
|
5,411.3
|
4,335.5
|
3,609.8
|
3,015.4
|
20.19%
|
|
Growth
|
15.78%
|
20.7%
|
24.8%
|
20.1%
|
19.7%
|
20.2%
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|

|
①
|
A. Semiconductor special equipment plays an important role in the semiconductor industry chain
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
②
|
The technical barriers for semiconductor special equipment are high, and it is hard to pass customer verification
|
|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Ranking
|
Manufacturer
|
Main Product Fields
|
Sales
|
|
1
|
Applied Material
|
Deposition, etching, ion implantation, grinding, etc.
|
140.16
|
|
2
|
ASML
|
Photolithography equipment
|
127.72
|
|
3
|
TEL
|
Deposition, etching, developing, cleaning, etc.
|
109.15
|
|
4
|
LAM
|
Etching, deposition, cleaning, etc.
|
108.71
|
|
5
|
KLA
|
Detecting and measurement equipment
|
42.10
|
|
Total
|
527.84
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|

|
ACM Research (Shanghai), Inc.
|
[***]
|

|
SN
|
Equipment
|
Localization Rate
|
Major Domestic Manufacturers
|
|
1
|
Film stripping equipment
|
Above 90%
|
Beijing E-Town Semiconductor Technology Co., Ltd.
|
|
2
|
Cleaning equipment
|
About 20%
|
ACMSH, NAURA
|
|
3
|
Etching equipment
|
About 20%
|
AMEC, NAURA, Beijing E-Town Semiconductor Technology Co., Ltd.
|
|
4
|
Heat processing equipment
|
About 20%
|
NAURA, Beijing E-Town Semiconductor Technology Co., Ltd.
|
|
5
|
PVD equipment
|
About 10%
|
NAURA
|
|
6
|
CMP equipment
|
About 10%
|
Tianjin Hwatsing Electromechanical Technology Co., Ltd.
|
|
7
|
Film lamination and developing equipment
|
Breakthrough of zero
|
KINGSEMI
|
|
8
|
Photolithography equipment
|
Breakthrough of zero expected
|
Shanghai Micro Electronics Equipment (Group) Co., Ltd. (“SMEE”)
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
A. Semiconductor special equipment will develop towards high precision and high integration
|

|
②
|
Coexistence and joint development of equipment of different technical grades
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Pollutant
|
Source
|
Main Harm
|
|
Particles
|
Environment and other engineering processes
|
Affect the subsequent photolithography and dry etching processes, causing device short circuit.
|
|
Natural oxidation layer
|
Environment
|
Affect the subsequent oxidation and deposition processes, causing the electrical property to fail.
|
|
Metal pollution
|
Environment and other engineering processes
|
Affect the subsequent oxidation process, causing the electrical property to fail.
|
|
Organic matters
|
Dry etching byproducts and environment
|
Affect the subsequent deposition process, causing the electrical property to fail.
|
|
Sacrificial layer
|
Oxidation/deposition process
|
Affect specific subsequent processes, causing the electrical property to fail.
|
|
Polishing residues
|
Grinding fluid
|
Affect specific subsequent processes, causing the electrical property to fail.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Category
|
Cleaning
Method
|
Cleaning
Medium
|
Process Introduction
|
Application Characteristics
|
|
Wet cleaning
|
Solution immersion
|
Chemical solution
|
It is mainly used for tank cleaning equipment. The wafer to be cleaned is put into the solution to be soaked. Through the chemical reaction between the solution and the surface of the
wafer and impurities, the pollutant can be removed.
|
This method is widely used. Different chemical solutions can be selected for different impurities; its productivity is high, and multiple wafers can be immersed at the same time; the cost
is low, and the chemical consumption allocated to each wafer is small; it can easily cause cross-contamination between wafers, though.
|
|
Mechanical scrubbing
|
Deionized water
|
The main configuration includes a special brush. With deionized water, this method utilizes the friction between the brush head and the wafer surface to achieve the effect of cleaning and
particle removal.
|
Its advantages are low cost, simple process and good removal effect for micron sized particles. The cleaning medium is generally water, so its application is limited. It can easily damage
the wafer, though. It’s generally used for the removal of large particles and back particles after mechanical polishing.
|
|
|
Double-fluid cleaning
|
SC-1 solution, deionized water, etc.
|
A refined water-gas double-fluid atomizing nozzle is used. On both ends of the nozzle, liquid medium and high-purity nitrogen are respectively injected; the high-purity nitrogen is used
as the power to assist micro-atomization of the liquid into extremely fine liquid particles which are sprayed to the surface of the wafer, so as to achieve the effect of particle removal.
|
This highly efficient method is widely used to assist particle-removal cleaning. There are risks of damage to the exquisite graphic structure of wafers, and the effect of removing
small-sized particles may not be sufficient.
|
|
|
Ultrasonic cleaning
|
Chemical solution + ultrasonic assistance
|
During cleaning under 20-40kHz ultrasonic waves, cavity bubbles are formed inside, and when the bubbles disappear, the impurities on the surface will be desorbed.
|
It can remove the big pollutants and particles on the surface of the wafer, but it is easy to damage the graphic structure of the wafer.
|
|
|
Megasonic cleaning
|
Chemical solution + megasonic assistance
|
This method is similar to ultrasonic cleaning, but it uses megasonic wave with 1-3MHz process frequency.
|
The removal effect of small particles is great, and it has obvious advantages in high-aspect-ratio structure cleaning. After the cavity bubbles are accurately controlled, the megasonic
wave can also be applied to the cleaning of exquisite graphic structures of wafers; the cost is high, though.
|
|
|
Batch rotary spray cleaning
|
High-pressure spray deionized water or cleaning solution
|
The cleaning chamber is equipped with a rotary table, which can load at least two wafer boxes at a time. During the rotation process, the liquid spray spout continuously sprays liquid to the surface of the
wafer to remove the impurities on the surface of the wafer.
|
Compared with the traditional tank cleaning, this method uses less chemical solution; the area occupied by the machine is small; however, there is the risk of cross-contamination between chemical solutions,
if a single wafer generates debris, all wafers in the entire cleaning chamber are at risk of being scrapped.
|
|
|
Dry cleaning
|
Plasma cleaning
|
Oxygen plasma
|
Under the action of strong electric fields, oxygen generates plasma, which makes photoresist vaporize rapidly and become volatile gas substance to be extracted.
|
The process is simple, the operation is convenient and environment-friendly, and the surface will be clean without scratches. It is difficult to control such process and the cost is high.
|
|
Gas phase cleaning
|
Gas equivalents of chemical reagents
|
The vapor equivalent of the corresponding substance in the liquid process is used to interact with the contaminating substance on the surface of the wafer.
|
Its chemical consumption is small, and its cleaning efficiency is high. But it cannot effectively remove metal contaminants. It is difficult to control such process and the cost is high.
|
|
|
Beam cleaning
|
High-energy beam-like material
|
The impurities on the wafer surface can be removed through their interaction with the high-energy beam-like material flow.
|
This technology is relatively novel, and it consumes less cleaning solution. It can also prevent secondary pollution. It is difficult to control such process and the cost is high.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Equipment
Type
|
Cleaning Mode
|
Application Characteristics
|
Advancement
|
Comparison with Foreign
Leading Competitors
|
|
Single-wafer cleaning equipment
|
Rotary spray, megasonic cleaning, double-fluid cleaning, mechanical scrubbing, etc.
|
It has extremely high process environment control ability and particle removal ability and can effectively solve the problem of cross-contamination between wafers; each cleaning chamber can only clean a
single wafer at a time, and the equipment capacity is low
|
Very high
|
There is no obvious difference in the level of technology of the SAPS/TEBO megasonic wave cleaning equipment; other single-wafer cleaning equipment is inferior to foreign leading competitors in terms of the
level of technology
|
|
Wet bench cleaning equipment
|
Solution immersion, megasonic cleaning, etc.
|
The cleaning capacity is high, so the equipment is suitable for batch production, but the control of particles and wet etching speed is poor, and the risk of cross-contamination is high
|
High
|
Inferior to foreign leading competitors in terms of the level of technology
|
|
Combined cleaning equipment
|
Solution immersion + rotary spray combined cleaning
|
Its capacity is relatively high; so is the cleaning precision. It can greatly reduce the consumption of concentrated sulfuric acid; The product price is relatively high, though
|
Very high
|
Foreign competitors do not have such products
|
|
Batch rotary spray cleaning equipment
|
Rotary spray
|
Compared with the traditional wet bench cleaning equipment, the batch rotary equipment can achieve the process requirements of sulfuric acid with a temperature of 120ºC or even 200ºC; the control of various
process parameters is difficult, and all the wafers in the whole cleaning chamber are at risk of being scrapped after wafer fragmentation
|
High
|
The Company does not have such products
|

|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|

|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|

|
ACM Research (Shanghai), Inc.
|
[***]
|


|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
SAPS megasonic cleaning equipment is mainly used to clean flat wafer surfaces and high-aspect-ratio throughhole internal structures
|
|
②
|
TEBO megasonic equipment is mainly applied to the cleaning of graphic wafers, including advanced 3D wafer structures
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
①
|
Advanced packaging scrubbing equipment
|
|
②
|
Single-wafer film lamination equipment
|
|
③
|
Single-wafer developing equipment
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
④
|
Single-wafer & tank combined film stripping equipment
|
|
⑤
|
Single-wafer wet etching equipment
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Ranking
|
Enterprise
|
|
1
|
AMEC
|
|
2
|
NAURA
|
|
3
|
CETC Electronics Equipment Group Co., Ltd.
|
|
4
|
ACMSH
|
|
5
|
Kingsemi
|
|
①
|
Applied Materials (Applied Materials, Inc.)
|
|
②
|
ASML (ASML Holding N.V.)
|
|
③
|
KLA (KLA CORPORATION)
|
|
④
|
DNS (SCREEN Holdings Co., Ltd.)
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
⑤
|
TEL (TOKYO ELECTRON LTD.)
|
|
⑥
|
LAM (LAM RESEARCH CORPORATION)
|
|
①
|
AMEC (Advanced Micro-Fabrication Equipment Inc. China)
|
|
②
|
NAURA (NAURA Technology Group Co., Ltd.)
|
|
③
|
Kingsemi (Shenyang XinYuan Microelectronic Equipment Co., Ltd.)
|
|
④
|
Changchuan Technology (Hangzhou Changchuan Technology Co., Ltd.)
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
ACMSH
|
Chinese
Enterprises in the
Industry
|
International
Players
|
|
Megasonic wave single-wafer cleaning equipment
|
|||
|
Technology characteristics
|
Control the half-wavelength relative movement between the megasonic wave generator and the wafer to achieve uniform distribution of megasonic energy on the wafer surface, which solves the
problem of uneven megasonic cleaning caused by wafer warpage during conventional megasonic cleaning; precisely control the output mode of megasonic waves so that bubbles oscillate at certain sizes and shapes under controlled temperatures,
in which the bubble oscillation is controlled in a stable cavitation state to prevent imploding or collapse, which solves the problem of pattern damages caused by bubble imploding during conventional megasonic cleaning.
|
Mostly second-class fluid cleaning technology
|
Mostly cleaning with chemical fluid together with physical cleaning using nitrogen atomizing water
|
|
Technology node and downstream industries covered
|
The SAPS technology has been applied in logic 28 nm technology node and DRAM 19 nm technology node, and may be expanded to logic chip 14 nm, DRAM 17/16 nm technology nodes,
32/64/128-layer 3D NAND, high-aspect ratio power devices, and TSV deep hole cleaning applications. It may be applied in over 70 steps for DRAM and closely 20 steps for cleaning of logic circuit FinFET structures. The TEBO technology is
mainly applied in damage-free cleaning of 45 nm and below pattern wafers. It has been applied to logic chip 28 nm technology nodes, is under assessment for cleaning of 16-19 nm DRAM process pattern wafers, and may be expanded to 14 nm logic
chip and nm-level 3D FinFET structure, high-aspect ratio DRAM products, multiple-layer 3D NAND products. It may be applied in over 70 steps for DRAM and over 10 steps for cleaning logic circuit FinFET structures.
|
Compared with the Issuer, their cleaning equipment lags behind in technology nodes and has a narrower scope of application
|
Compared with the the Issuer, the cleaning equipment they sold is applied to 5 nm and below production lines with a broader scope of application
|
|
Wafer size
|
Mostly 12-inch; also available for deep-trench cleaning of 8-inch power devices
|
No obvious difference
|
No obvious difference
|
|
Market Share
|
High on Chinese market but low on the international market
|
Relatively low on Chinese market
|
High on Chinese market and dominating the international market
|
|
Single wafer wet bench combined cleaning equipment
|
|||
|
Technology characteristics
|
Compared with current mainstream single wafer equipment, the consumption of sulphuric acid may be reduced greatly; wafers may be transported to the single wafer cleaning module with the
humidity and certain water film retained; wafers are finally cleaned in the single-wafer cleaning equipment with superior cleaning capability over conventional wet bench cleaning equipment and comparable with single-wafer cleaning
equipment.
|
-
|
-
|
|
Technology node and downstream industries covered
|
It is applicable for removing polymer and residue glue after previous dry etching, removing residue mill liquid after polishing, removing photoresist after ion injection, and removing
organic residues prior to through holes. By now, the technology has been verified for production lines of logic chip 40 nm and 28 nm technology nodes; it may be expanded to 14 nm logic chip, 20 nm and below DRAM technology nodes, and
60-layer and above 3D NAND. It may be applied in over 20 steps for high-temperature sulphuric acid and high-temperature phosphoric acid cleaning.
|
No such product
|
No such product
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Wafer size
|
Mainly 12-inch
|
No such product
|
No such product
|
|
Market Share
|
Relatively low on Chinese market
|
No such product
|
No such product
|
|
Copper interconnection electroplating process equipment
|
|||
|
Technology characteristics
|
Make use of the multi-anode partial plating technology, in which millisecond-level controllable power source is used to power on each anode, hence achieving partial plating. This
technology is applicable for ultra-thin seed-layer holes and cavity-free plating filling for trench structures; an independent plating fluid flow field control system separately controls the plating fluid provided to each anode, hence
precisely controlling the fluid field in each plating chamber; the plating jig sealing technology protects contact electrodes with a fully sealed ring, which improves the process performance, extends the service life of contact electrodes,
and reduces the cost of process consumables. modular designing is applied for process chambers to improve the effective operating time of the equipment.
|
-
|
The virtual cathode plating technology is applied to overcome the edge effects on wafers, hence improving the plating uniformity within wafers; work together with the constant-potential
water injection function to reduce the defect of plating deposit caused by water injection.
|
|
Technology node and downstream industries covered
|
Dual damascene copper interconnection plating chemical deposition process; applicable to 55 nm to 14 nm and below technology nodes; advanced packaging for bumping, re-wiring, silicon
through holes, fanout process for copper, nickel, tin, silver, and gold electroplating.
|
No such product
|
Dual damascene copper interconnection plating chemical deposition process; applicable to 55 nm to 7 nm and below technology nodes; supporting electroplating deposition of copper on other
materials for 5 nm and below technology nodes.
|
|
Wafer size
|
Mostly 12-inch; also available for 8-inch copper process applications
|
No such product
|
No obvious difference
|
|
Market Share
|
Low on Chinese market
|
No such product
|
Market monopoly
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Product Category
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
|
Semiconductor cleaning equipment
|
Output
|
37
|
45
|
28
|
22
|
|
Sales
|
24
|
35
|
26
|
21
|
|
|
Output/sales ratio
|
64.86%
|
77.78%
|
92.86%
|
95.45%
|
|
|
Semiconductor electroplating equipment
|
Output
|
5
|
8
|
4
|
-
|
|
Sales
|
2
|
4
|
4
|
1
|
|
|
Output/sales ratio
|
40.00%
|
50.00%
|
100.00%
|
-
|
|
|
Advanced packaging wet equipment
|
Output
|
27
|
21
|
9
|
13
|
|
Sales
|
14
|
20
|
7
|
6
|
|
|
Output/sales ratio
|
51.85%
|
95.24%
|
77.78%
|
46.15%
|
|
|
Vertical furnace tube equipment
|
Output
|
2
|
2
|
-
|
-
|
|
Sales
|
-
|
1
|
-
|
-
|
|
|
Output/sales ratio
|
-
|
50.00%
|
-
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Semiconductor cleaning equipment
|
48,900.39
|
83.16%
|
81,627.25
|
83.69%
|
62,522.30
|
84.10%
|
50,135.96
|
92.91%
|
|
Including: Single-wafer cleaning equipment
|
43,884.74
|
74.63%
|
71,610.80
|
73.42%
|
55,099.52
|
74.12%
|
50,135.96
|
92.91%
|
|
Wet bench cleaning equipment
|
5,015.65
|
8.53%
|
3,310.85
|
3.39%
|
4,801.36
|
6.46%
|
-
|
-
|
|
Single wafer wet bench combined cleaning equipment
|
-
|
-
|
6,705.60
|
6.88%
|
2,621.43
|
3.53%
|
-
|
-
|
|
Semiconductor electroplating equipment
|
3,591.85
|
6.11%
|
5,290.13
|
5.42%
|
7,857.39
|
10.57%
|
1,191.13
|
2.21%
|
|
Advanced packaging wet equipment
|
6,312.54
|
10.73%
|
9,856.51
|
10.11%
|
3,961.12
|
5.33%
|
2,634.07
|
4.88%
|
|
Vertical furnace tube equipment
|
-
|
-
|
758.90
|
0.78%
|
-
|
-
|
-
|
-
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
SN
|
Customer’s Field
|
Customer Name
|
|
1
|
Wafer manufacturing
|
Hynix, Huahong Group, Yangtze Memory, SMIC, Hefei Innotron
|
|
2
|
Advanced packaging
|
JCET, Fujitsu, SMIC Long Power, Nepes
|
|
3
|
Semiconductor silicon wafer manufacturing and recycling
|
Shanghai ZINGSEMI, JRH, Taiwan Wafer Works Corporation, Taiwan Phoenix Silicon
|
|
4
|
Scientific research institutes
|
Institute of Microelectronics of the Chinese Academy of Sciences, Shanghai IC, NCAP China
|
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
|||
|
Average Price
|
Growth
|
Average Price
|
Growth
|
Average Price
|
Growth
|
Average Price
|
|
|
Semiconductor cleaning equipment:
|
|||||||
|
Single-wafer cleaning equipment
|
2,089.75
|
-9.54%
|
2,310.03
|
-7.77%
|
2,504.52
|
4.90%
|
2,387.43
|
|
Wet bench cleaning equipment
|
1,671.88
|
0.99%
|
1,655.43
|
3.43%
|
1,600.45
|
-
|
-
|
|
Single wafer wet bench combined cleaning equipment
|
-
|
-
|
3,352.8
|
27.90%
|
2,621.43
|
-
|
-
|
|
Semiconductor electroplating equipment
|
1,795.93
|
35.80%
|
1,322.53
|
-32.67%
|
1,964.35
|
64.91%
|
1,191.13
|
|
Advanced packaging wet equipment
|
450.90
|
-8.51%
|
492.83
|
-12.91%
|
565.87
|
28.90%
|
439.01
|
|
Vertical furnace tube equipment
|
-
|
-
|
758.90
|
-
|
|||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Jan. - Jun. 2021
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Yangtze Memory
|
22,748.37
|
36.38%
|
Single-wafer cleaning equipment
|
|
2
|
Huahong Group
|
14,869.12
|
23.78%
|
Single-wafer cleaning equipment, wet bench cleaning equipment, advanced packaging wet equipment
|
|
3
|
Hynix
|
6,321.85
|
10.11%
|
Single-wafer cleaning equipment
|
|
4
|
JCET Semiconductor Integration (Shaoxing) Co., Ltd.
|
2,896.37
|
4.63%
|
Semiconductor electroplating equipment, advanced packaging wet equipment
|
|
5
|
Beijing E-Town Technology Co., Ltd.
|
2,536.75
|
4.06%
|
Single-wafer cleaning equipment
|
|
Total
|
49,372.47
|
78.96%
|
||
|
2020
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Huahong Group
|
33,708.94
|
33.46%
|
Single-wafer cleaning equipment, wet bench cleaning equipment, single wafer wet bench combined cleaning equipment, advanced packaging wet equipment, vertical furnace tube equipment
|
|
2
|
Yangtze Memory
|
22,302.58
|
22.14%
|
Single-wafer cleaning equipment
|
|
3
|
SMIC
|
12,749.31
|
12.65%
|
Single-wafer cleaning equipment, advanced packaging wet equipment
|
|
4
|
Hynix
|
9,992.88
|
9.92%
|
Single-wafer cleaning equipment
|
|
5
|
JCET
|
5,230.64
|
5.19%
|
Semiconductor electroplating equipment, advanced packaging wet equipment
|
|
Total
|
83,984.34
|
83.36%
|
-
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2019
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Yangtze Memory
|
21,888.34
|
28.92%
|
Single-wafer cleaning equipment
|
|
2
|
Huahong Group
|
20,734.59
|
27.40%
|
Single-wafer cleaning equipment, wet bench cleaning equipment, single wafer wet bench combined cleaning equipment, semiconductor electroplating equipment
|
|
3
|
Hynix
|
15,193.35
|
20.08%
|
Single-wafer cleaning equipment
|
|
4
|
JCET
|
5,620.56
|
7.43%
|
Semiconductor electroplating equipment, advanced packaging wet equipment
|
|
5
|
SMIC
|
2,649.74
|
3.50%
|
Single-wafer cleaning equipment, advanced packaging wet equipment
|
|
Total
|
66,086.58
|
87.33%
|
-
|
|
|
2018
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Huahong Group
|
12,667.23
|
23.02%
|
Single-wafer cleaning equipment
|
|
2
|
Yangtze Memory
|
12,653.88
|
23.00%
|
Single-wafer cleaning equipment
|
|
3
|
Hynix
|
12,117.32
|
22.02%
|
Single-wafer cleaning equipment
|
|
4
|
Charter Base International
|
6,935.04
|
12.60%
|
Single-wafer cleaning equipment, semiconductor electroplating equipment
|
|
5
|
ACMR
|
6,081.94
|
11.05%
|
Single-wafer cleaning equipment
|
|
Total
|
50,455.41
|
91.69%
|
-
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Jan. - Jun. 2021
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Yangtze Memory
|
22,748.37
|
36.38%
|
Single-wafer cleaning equipment
|
|
2
|
Huahong Group
|
14,869.12
|
23.78%
|
Single-wafer cleaning equipment, wet bench cleaning equipment, advanced packaging wet equipment
|
|
3
|
Hynix
|
6,321.85
|
10.11%
|
Single-wafer cleaning equipment
|
|
4
|
JCET Semiconductor Integration (Shaoxing) Co., Ltd.
|
2,896.37
|
4.63%
|
Semiconductor electroplating equipment, advanced packaging wet equipment
|
|
5
|
Beijing E-Town Technology Co., Ltd.
|
2,536.75
|
4.06%
|
Single-wafer cleaning equipment
|
|
Total
|
49,372.47
|
78.96%
|
||
|
2020
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Huahong Group
|
33,708.94
|
33.46%
|
Single-wafer cleaning equipment, wet bench cleaning equipment, single wafer wet bench combined cleaning equipment, advanced packaging wet equipment, vertical furnace tube equipment
|
|
2
|
Yangtze Memory
|
22,302.58
|
22.14%
|
Single-wafer cleaning equipment
|
|
3
|
SMIC
|
12,749.31
|
12.65%
|
Single-wafer cleaning equipment, advanced packaging wet equipment
|
|
4
|
Hynix
|
9,992.88
|
9.92%
|
Single-wafer cleaning equipment
|
|
5
|
JCET
|
5,230.64
|
5.19%
|
Semiconductor electroplating equipment, advanced packaging wet equipment
|
|
Total
|
83,984.34
|
83.36%
|
-
|
|
|
2019
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Yangtze Memory
|
21,888.34
|
28.92%
|
Single-wafer cleaning equipment
|
|
2
|
Huahong Group
|
20,734.59
|
27.40%
|
Single-wafer cleaning equipment, wet bench cleaning equipment, single wafer wet bench combined cleaning equipment, semiconductor electroplating equipment
|
|
3
|
Hynix
|
15,193.35
|
20.08%
|
Single-wafer cleaning equipment
|
|
4
|
JCET
|
5,620.56
|
7.43%
|
Semiconductor electroplating equipment, advanced packaging wet equipment
|
|
5
|
SMIC
|
2,649.74
|
3.50%
|
Single-wafer cleaning equipment, advanced packaging wet equipment
|
|
Total
|
66,086.58
|
87.33%
|
-
|
|
|
2018
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Equipment Name
|
|
1
|
Yangtze Memory
|
18,735.81
|
34.05%
|
Single-wafer cleaning equipment
|
|
2
|
Huahong Group
|
15,314.19
|
27.83%
|
Single-wafer cleaning equipment
|
|
3
|
Hynix
|
12,117.32
|
22.02%
|
Single-wafer cleaning equipment
|
|
4
|
JCET
|
2,536.22
|
4.61%
|
Advanced packaging wet equipment, semiconductor electroplating equipment
|
|
5
|
SMIC
|
2,188.16
|
3.98%
|
Single-wafer cleaning equipment
|
|
Total
|
50,891.71
|
92.49%
|
-
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Jan. - Jun. 2021
|
|||
|
Need Trial Run
|
Product Category
|
Revenue (RMB 10,000 Yuan)
|
Corresponding Customer
|
|
No
|
Single-wafer cleaning equipment
|
41,470.76
|
Huahong Group, Yangtze Memory, Beijing U-PRECISION TECH CO., LTD., Hynix, JRH, Sino ICT (Shaoxing) Co., Ltd., Beijing E-Town Technology Co., Ltd.
|
|
Wet bench cleaning equipment
|
5,015.65
|
Huahong Group
|
|
|
Semiconductor electroplating equipment
|
3,591.85
|
JCET, JCET Semiconductor Integration (Shaoxing) Co., Ltd.
|
|
|
Advanced packaging wet equipment
|
6,312.54
|
Xiamen Tongfu, Huahong Group, JCET Semiconductor Integration (Shaoxing) Co., Ltd., Jiangsu Silicon Integrity Semiconductor Technology Co., Ltd.
|
|
|
Subtotal
|
56,390.80
|
-
|
|
|
Yes
|
Single-wafer cleaning equipment
|
2,413.98
|
Xiamen Silan Microchip Manufacturing Co., Ltd., Shanghai Xinsheng Semiconductor Technology Co., Ltd.
|
|
Subtotal
|
2,413.98
|
-
|
|
|
Total
|
58,804.78
|
-
|
|
|
2020
|
|||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Need Trial Run
|
Product Category
|
Revenue (RMB 10,000 Yuan)
|
Corresponding Customer
|
|
No
|
Single-wafer cleaning equipment
|
68,891.08
|
Huahong Group, Yangtze Memory, Semiconductor Manufacturing North China (Beijing) Corporation, Semiconductor Manufacturing South China Corporation, Taiwan Wafer Works Corporation, Beijing
U-PRECISION TECH CO., LTD., Anji Microelectronics (Shanghai) Co., Ltd., Hynix, Xiamen Silan Microchip Manufacturing Co., Ltd., ACMR
|
|
Wet bench cleaning equipment
|
3,310.85
|
Huahong Group
|
|
|
Single wafer wet bench combined cleaning equipment
|
6,705.60
|
Huahong Group
|
|
|
Semiconductor electroplating equipment
|
5,290.13
|
JCET, JCET Semiconductor Integration (Shaoxing) Co., Ltd., Shenzhen Institute of Advanced Technology of China Academy of Sciences
|
|
|
Advanced packaging wet equipment
|
9,856.51
|
SJ Semiconductor (Jiangyin) Co., Ltd., Semiconductor Manufacturing Electronics (Shaoxing) Corporation, Xiamen Tongfu, Jiangsu Zhongke Intelligence Chips Integrated Technology Co., Ltd.,
Huahong Group, JCET, Nepes Hayyim Corporation, Raytron Technology Co., Ltd., Xiamen Silan Microchip Manufacturing Co., Ltd.
|
|
|
Vertical furnace tube equipment
|
758.9
|
Huahong Group
|
|
|
Subtotal
|
94,813.07
|
-
|
|
|
Yes
|
Single-wafer cleaning equipment
|
2,719.72
|
Innotron Memory Co., Ltd.
|
|
Subtotal
|
2,719.72
|
-
|
|
|
Total
|
97,532.79
|
-
|
|
|
2019
|
|||
|
Need Trial Run
|
Product Category
|
Revenue (RMB 10,000 Yuan)
|
Corresponding Customer
|
|
No
|
Single-wafer cleaning equipment
|
55,099.52
|
Huahong Group, Yangtze Memory, JRH, Taiwan Phoenix Silicon, Hynix, Semiconductor Manufacturing South China Corporation, Taiwan Wafer Works Corporation, Fujian Jinhua Integrated Circuit
Co., Ltd.
|
|
Wet bench cleaning equipment
|
4,801.36
|
Huahong Group
|
|
|
Single wafer wet bench combined cleaning equipment
|
2,621.43
|
Huahong Group
|
|
|
Semiconductor electroplating equipment
|
7,857.39
|
Huahong Group, JCET
|
|
|
Advanced packaging wet equipment
|
3,016.02
|
JCET, SJ Semiconductor (Jiangyin) Co., Ltd., Ningbo Semiconductor International Corporation
|
|
|
Subtotal
|
73,395.72
|
-
|
|
|
Yes
|
Advanced packaging wet equipment
|
945.09
|
TFME, Xiamen Tongfu
|
|
Subtotal
|
945.09
|
-
|
|
|
Total
|
74,340.81
|
-
|
|
|
2018
|
|||
|
Need Trial Run
|
Product Category
|
Revenue (RMB 10,000 Yuan)
|
Corresponding Customer
|
|
No
|
Single-wafer cleaning equipment
|
48,064.72
|
Huahong Group, JRH, Hynix, Taiwan Wafer Works Corporation, Yangtze Memory
|
|
Semiconductor electroplating equipment
|
1,191.13
|
JCET
|
|
|
Advanced packaging wet equipment
|
2,634.07
|
Nepes, JCET, Xiamen Tongfu
|
|
|
Subtotal
|
51,889.92
|
-
|
|
|
Yes
|
Single-wafer cleaning equipment
|
2,071.25
|
Semiconductor Manufacturing North China (Beijing) Corporation
|
|
Subtotal
|
2,071.25
|
-
|
|
|
Total
|
53,961.17
|
-
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SN
|
Category
|
Content
|
|
1
|
Gas circuit
|
Valve, contact, filter, pump, flowmeter, gas control module pneumatic components, cylinder, sensor, etc.
|
|
2
|
Material transport
|
Robot arm, wafer transport platform, etc.
|
|
3
|
Machinery
|
Cavity parts, cavity cabinet, rack, etc.
|
|
4
|
Electric components
|
Electronic components, sensor, programmable control module, DC power supply, circuit breaker, etc.
|
|
5
|
Special apparatus
|
Heater, functional water, ozone generator, CO2 mixing generator, cooler, hydrogen generator, megasonic
generator, etc.
|
|
6
|
Drives
|
Motor and driver, guide rail, etc.
|
|
7
|
Others
|
Software, trunking, chemicals, procurement fees, etc.
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
||
|
I. Gas circuit products
|
|||||||||
|
1
|
Valve
|
8,533.50
|
10.16%
|
4,275.84
|
5.36%
|
3,538.90
|
7.85%
|
3,541.02
|
8.13%
|
|
2
|
Connector
|
7,465.36
|
8.89%
|
1,467.07
|
1.84%
|
1,932.78
|
4.29%
|
2,311.47
|
5.31%
|
|
3
|
Filter
|
3,741.79
|
4.45%
|
3,554.41
|
4.46%
|
1,790.03
|
3.97%
|
1,528.20
|
3.51%
|
|
4
|
Pump
|
3,389.89
|
4.04%
|
3,866.70
|
4.85%
|
1,578.02
|
3.50%
|
1,741.01
|
4.00%
|
|
5
|
Flowmeter
|
1,988.27
|
2.37%
|
3,040.52
|
3.81%
|
1,366.91
|
3.03%
|
1,429.32
|
3.28%
|
|
6
|
Others
|
4,560.39
|
5.42%
|
5,550.37
|
6.96%
|
2,668.42
|
5.92%
|
1,762.56
|
4.05%
|
|
Subtotal
|
29,679.20
|
35.33%
|
21,754.92
|
27.27%
|
12,875.05
|
28.55%
|
12,313.58
|
||
|
II. Mechanical products
|
|||||||||
|
1
|
Chamber parts
|
10,081.33
|
12.00%
|
12,635.22
|
15.84%
|
5,801.98
|
12.87%
|
4,647.12
|
10.67%
|
|
2
|
Chamber cabinet
|
3,686.13
|
4.39%
|
4,599.46
|
5.77%
|
2,306.51
|
5.12%
|
1,902.72
|
4.37%
|
|
3
|
Rack
|
3,971.59
|
4.73%
|
4,755.05
|
5.96%
|
1,356.39
|
3.01%
|
923.24
|
2.12%
|
|
4
|
Others
|
195.80
|
0.23%
|
308.11
|
0.39%
|
303.26
|
0.67%
|
7.30
|
0.02%
|
|
Subtotal
|
17,934.85
|
21.35%
|
22,297.83
|
27.95%
|
9,768.14
|
21.66%
|
7,480.38
|
||
|
III. Material transfer products
|
|||||||||
|
1
|
Robot arm
|
16,074.18
|
19.13%
|
12,219.40
|
15.32%
|
7,280.47
|
16.15%
|
5,951.56
|
13.67%
|
|
2
|
Others
|
514.37
|
0.61%
|
70.03
|
0.09%
|
415.73
|
0.92%
|
110.03
|
0.25%
|
|
Subtotal
|
16,588.54
|
19.75%
|
12,289.43
|
15.41%
|
7,696.20
|
17.07%
|
6,061.59
|
||
|
IV. Electrical products
|
|||||||||
|
1
|
Electronic parts and components
|
3,053.27
|
3.63%
|
3,049.33
|
3.82%
|
2,089.10
|
4.63%
|
660.90
|
1.52%
|
|
2
|
Sensor
|
3,368.58
|
4.01%
|
2,930.92
|
3.67%
|
1,944.46
|
4.31%
|
2,547.59
|
5.85%
|
|
3
|
Programmable control module
|
1,612.80
|
1.92%
|
2,522.98
|
3.16%
|
1,179.77
|
2.62%
|
2,465.20
|
5.66%
|
|
4
|
Others
|
1,781.37
|
2.12%
|
1,889.81
|
2.37%
|
855.83
|
1.90%
|
2,611.14
|
6.00%
|
|
Subtotal
|
9,816.01
|
11.68%
|
10,393.03
|
13.03%
|
6,069.17
|
13.46%
|
8,284.83
|
||
|
V. Special device products
|
|||||||||
|
1
|
Heater
|
2,259.55
|
2.69%
|
3,231.22
|
4.05%
|
2,086.26
|
4.63%
|
1,097.89
|
2.52%
|
|
2
|
Functional water
|
451.87
|
0.54%
|
449.35
|
0.56%
|
1,002.58
|
2.22%
|
993.18
|
2.28%
|
|
3
|
Generator
|
3,548.61
|
4.22%
|
3,731.56
|
4.68%
|
2,805.47
|
6.22%
|
4,945.97
|
11.36%
|
|
4
|
Others
|
776.44
|
0.92%
|
1,510.24
|
1.89%
|
578.93
|
1.28%
|
212.74
|
0.49%
|
|
Subtotal
|
7,036.47
|
8.38%
|
8,922.37
|
11.19%
|
6,473.24
|
14.36%
|
7,249.78
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
VI. Drive products
|
|||||||||
|
1
|
Motor and driver
|
1,983.09
|
2.36%
|
3,159.10
|
3.96%
|
977.53
|
2.17%
|
497.65
|
1.14%
|
|
2
|
Others
|
160.22
|
0.19%
|
163.98
|
0.21%
|
98.47
|
0.22%
|
51.29
|
0.12%
|
|
Subtotal
|
2,143.32
|
2.55%
|
3,323.08
|
4.17%
|
1,076.00
|
2.39%
|
548.94
|
||
|
VII. Other products
|
|||||||||
|
Subtotal
|
810.24
|
0.96%
|
787.83
|
0.99%
|
1,135.28
|
2.52%
|
1,598.08
|
3.67%
|
|
|
Total
|
84,008.63
|
100.00%
|
79,768.50
|
100.00%
|
45,093.08
|
100.00%
|
43,537.19
|
100.00%
|
|
|
Raw Material Category and Model
|
Price Index
|
|||
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
|
|
Robot arm (8-chamber)
|
87.85
|
93.36
|
95.94
|
95.94
|
|
Robot arm (12-chamber)
|
94.18
|
94.77
|
95.79
|
95.79
|
|
Valve (402-1231)
|
95.00
|
96.74
|
100.00
|
100.00
|
|
Valve (402-1210)
|
91.08
|
95.28
|
100.00
|
100.00
|
|
Connector (400-1048)
|
104.35
|
103.02
|
103.02
|
102.89
|
|
Connector (400-1449)
|
105.15
|
102.99
|
102.99
|
102.65
|
|
Electronic parts and components (413-1165)
|
93.97
|
96.55
|
97.05
|
99.50
|
|
Megasonic generator (319-1073)
|
94.66
|
93.72
|
94.94
|
87.81
|
|
Megasonic generator (319-1047)
|
96.26
|
94.36
|
97.97
|
88.14
|
|
Chamber parts (110-6519)
|
89.59
|
91.46
|
93.69
|
96.28
|
|
Chamber cabinet - pipe cabinet
|
229.29
|
228.10
|
197.40
|
187.10
|
|
Chamber cabinet - chemical fluid cabinet
|
139.86
|
146.57
|
147.69
|
130.36
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Energy
|
Item
|
Jan. - Jun. 2021
|
2020
|
2019
|
2018
|
|
Water
|
Amount (RMB 10,000)
|
13.09
|
31.61
|
17.16
|
10.78
|
|
Unit price (RMB Yuan/ton)
|
5.06
|
4.95
|
4.95
|
4.92
|
|
|
Electricity
|
Amount (RMB 10,000)
|
102.66
|
177.85
|
161.91
|
150.15
|
|
Unit price (RMB Yuan/kWh)
|
0.69
|
1.08
|
1.02
|
1.03
|
|
Jan. - Jun. 2021
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
NINEBELL
|
9,321.12
|
11.10%
|
Robot arms, etc.
|
|
2
|
Advance Electric America Co., Inc.
|
3,416.08
|
4.07%
|
Values, etc.
|
|
3
|
Nippon Pillar Corporation of America
|
2,587.53
|
3.08%
|
Connectors, etc.
|
|
4
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
2,118.60
|
2.52%
|
Chamber parts, etc.
|
|
5
|
HORIBA (China) Trading Co., Ltd.
|
2,057.73
|
2.45%
|
Flowmeters, concentration meters, sensors, etc.
|
|
Total
|
19,501.06
|
23.21%
|
||
|
2020
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
NINEBELL
|
10,546.98
|
13.22%
|
Robot arms, etc.
|
|
2
|
DOUBLE MERITS HOLDINGS LIMITED
|
3,429.92
|
4.30%
|
Heaters, etc.
|
|
3
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
3,382.09
|
4.24%
|
Chamber parts, etc.
|
|
4
|
Shanghai Molan Electromechanical Equipment Co., Ltd.
|
3,004.15
|
3.77%
|
Programmable control modules, etc.
|
|
5
|
Wuxi PSK Technology Co., Ltd.
|
2,708.31
|
3.40%
|
Chamber cabinets, etc.
|
|
Total
|
23,071.45
|
28.92%
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2019
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
ACMR
|
7,354.82
|
16.31%
|
Serving as an agent to procure valves, connectors, etc.
|
|
2
|
NINEBELL
|
5,955.30
|
13.21%
|
Robot arm
|
|
3
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
1,718.10
|
3.81%
|
Chamber parts, etc.
|
|
4
|
Shanghai Molan Electromechanical Equipment Co., Ltd.
|
1,419.04
|
3.15%
|
Programmable control modules, etc.
|
|
5
|
Wuxi PSK Technology Co., Ltd.
|
1,235.90
|
2.74%
|
Chamber cabinets, etc.
|
|
Total
|
17,683.16
|
39.22%
|
||
|
2018
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
ACMR
|
10,393.20
|
23.87%
|
Serving as an agent to procure valves, connectors, etc.
|
|
2
|
NINEBELL
|
5,201.20
|
11.95%
|
Robot arms, etc.
|
|
3
|
MKS Instruments (HK) Company Ltd.
|
1,849.24
|
4.25%
|
Ozone generator, etc.
|
|
4
|
Shanghai Molan Electromechanical Equipment Co., Ltd.
|
1,648.57
|
3.79%
|
Programmable control modules, etc.
|
|
5
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
1,392.46
|
3.20%
|
Chamber parts, etc.
|
|
Total
|
20,484.67
|
47.05%
|
||
|
Jan. - Jun. 2021
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
NINEBELL
|
9,321.12
|
11.10%
|
Robot arms, etc.
|
|
2
|
Advance Electric America Co., Inc.
|
3,416.08
|
4.07%
|
Values, etc.
|
|
3
|
Nippon Pillar Corporation of America
|
2,587.53
|
3.08%
|
Connectors, etc.
|
|
4
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
2,118.60
|
2.52%
|
Chamber parts, etc.
|
|
5
|
HORIBA (China) Trading Co., Ltd.
|
2,057.73
|
2.45%
|
Flowmeters, concentration meters, sensors, etc.
|
|
Total
|
19,501.06
|
23.21%
|
||
|
2020
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
NINEBELL
|
10,546.98
|
13.22%
|
Robot arms, etc.
|
|
2
|
DOUBLE MERITS HOLDINGS LIMITED
|
3,429.92
|
4.30%
|
Heaters, etc.
|
|
3
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
3,382.09
|
4.24%
|
Chamber parts, etc.
|
|
4
|
Shanghai Molan Electromechanical Equipment Co., Ltd.
|
3,004.15
|
3.77%
|
Programmable control modules, etc.
|
|
5
|
Wuxi PSK Technology Co., Ltd.
|
2,708.31
|
3.40%
|
Chamber cabinets, etc.
|
|
Total
|
23,071.45
|
28.92%
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2019
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
NINEBELL
|
5,955.30
|
13.21%
|
Robot arms, etc.
|
|
2
|
Advance Electric America Co., Inc.
|
2,442.60
|
5.42%
|
Valves, flow meters, etc.
|
|
3
|
Goodwill Precision Machinery (SuZhou) Co., Ltd.
|
1,718.10
|
3.81%
|
Chamber parts, etc.
|
|
4
|
Harrington Industrial Plastics
|
1,438.74
|
3.19%
|
Connectors, etc.
|
|
5
|
Shanghai Molan Electromechanical Equipment Co., Ltd.
|
1,419.04
|
3.15%
|
Programmable control modules, etc.
|
|
Total
|
12,973.78
|
28.77%
|
||
|
2018
|
||||
|
No.
|
Name
|
Amount
|
Proportion
|
Procured Items
|
|
1
|
NINEBELL
|
5,201.20
|
11.95%
|
Robot arms, etc.
|
|
2
|
Advance Electric America Co., Inc.
|
2,579.86
|
5.93%
|
Valves, flow meters, etc.
|
|
3
|
Product Systems Inc
|
2,520.36
|
5.79%
|
Megasonic wave generator, etc.
|
|
4
|
MKS Instruments (HK) Company Ltd.
|
1,849.24
|
4.25%
|
Ozone generator, etc.
|
|
5
|
Harrington Industrial Plastics
|
1,783.41
|
4.10%
|
Connectors, etc.
|
|
Total
|
13,934.07
|
32.00%
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Category
|
Original Value
|
Book Value
|
Newness Rate
|
|
Machines and equipment
|
4,124.75
|
2,321.62
|
56.29%
|
|
Means of transport
|
139.69
|
62.35
|
44.63%
|
|
Computers and electronic devices
|
614.67
|
358.78
|
58.37%
|
|
Office equipment
|
242.12
|
174.37
|
72.02%
|
|
Total
|
5,121.22
|
2,917.12
|
56.96%
|
|
No.
|
Equipment Name
|
Original Value
|
Book Value
|
Newness Rate
|
|
1
|
Ultra-pure water system in the clean room, IDS01 R&D system
|
978.01
|
861.83
|
88.12%
|
|
2
|
Double-beam system electron microscope FEI
|
726.13
|
290.16
|
39.96%
|
|
3
|
PO-36963 coating developer (clean track)
|
351.81
|
312.90
|
88.94%
|
|
4
|
Wafer surface particle scanning device
|
300.53
|
86.95
|
28.93%
|
|
5
|
Bench prototype Module (300mm Wet station (SPM+HQDR Module)
|
246.26
|
182.06
|
73.93%
|
|
6
|
Silicon wafer stress and thickness measuring instrument FSM
|
125.07
|
54.92
|
43.91%
|
|
7
|
Hitachi Ion Milling Equipment
|
72.90
|
46.41
|
63.66%
|
|
8
|
POGD-0220 shape measuring instrument
|
67.19
|
52.33
|
77.88%
|
|
9
|
Scanning electron microscope, 2 sets
|
65.75
|
3.29
|
5.00%
|
|
10
|
ECI Qualilab QL-10EZ copper plating solution analyzer
|
58.94
|
31.94
|
54.19%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Lessee
|
Lessor
|
Location
|
Leased
Area
(m2)
|
Term of Lease
|
Rent
|
Use
|
|
1
|
Issuer
|
Zhangjiang Group
|
Floors 1-5, Building 4, No. 1690, Cailun Road, Zhangjiang Hi-Tech Park, Shanghai
|
5,900.28
|
2018.1.1-
2024.12.31
|
RMB 2 Yuan per day per building square meter (Jan. 1, 2018 to Dec. 31, 2022); RMB 2.7 Yuan per day per building square meter (Jan. 1, 2023 to Dec. 31, 2024)
|
Production and operation
|
|
2
|
Issuer
|
Shanghai Shengyu Culture Development Co., Ltd.
|
Whole building of Building 2, No. 365, Chuanhong Road, Shanghai
|
9,629.87
|
2019.9.26-
2023.1.15
|
RMB 389,824 Yuan per month (Since Jan. 16, 2020, the rent has increased by 5% every year on the basis of the previous year)
|
Assembly, warehousing, and office
|
|
3
|
Issuer
|
Wu *
|
Room 302, Building 15, Hailan Famous Garden, No. 35, Yanling Road, Jiangyin City, Jiangsu Province
|
179.5
|
2021.4.25-
2022.4.24
|
RMB 3,800 Yuan per month
|
Residence
|
|
4
|
Issuer
|
Xiang **
|
Room 403, Building 26, Xinhua Third Village, Jiangyin City, Jiangsu Province
|
132.61
|
2020.12.22-
2021.12.21
|
RMB 3,650 Yuan per month
|
Residence
|
|
5
|
Issuer
|
Shen **
|
Room 406, Building 29, Xinhua Third Village, Jiangyin City, Jiangsu Province
|
111.73
|
2021.9.23-
2022.9.22
|
RMB 3,800 Yuan per month
|
Residence
|
|
6
|
Issuer
|
Cheng **
|
Room 2602, Building 45, Shangdong YaYuan, Xincheng District, Xinwu District, Jiangsu Province
|
82
|
2020.12.01-
2021.11.30
|
RMB 3,675 Yuan per month
|
Residence
|
|
7
|
Issuer
|
Cui **
|
12-1-301, Tianbao Sili, Beijing Economic and Technological Development District, Beijing
|
137.1
|
2021.4.15-
2022.4.14
|
RMB 7,000 Yuan per month
|
Residence
|
|
8
|
Issuer
|
Yan **
|
Room 2204, Unit 1, Building 3, Baihu Community, Zuoling New Town, East Lake High-tech District, Wuhan
|
100
|
2021.5.4-
2022.5.4
|
RMB 42,000 Yuan per month
|
Residence
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
9
|
Issuer
|
Luo *
|
No. 2601, Unit 2, Building 13, Community 3, Zuoling New Town, East Lake High-tech District, Wuhan
|
100
|
2020.11.12-
2021.11.11
|
RMB 35,400 Yuan per month
|
Residence
|
|
10
|
Issuer
|
Hu **
|
Room 804, Unit 1, Building 13, Yuquan Community, Huangbeiling Community, Zuoling New Town, East Lake High-tech District, Wuhan
|
100
|
2021.01.06-
2022.01.05
|
RMB 3,000 Yuan per month
|
Residence
|
|
11
|
Issuer
|
Wang *
|
No. 01, Floor 1, Unit 2, Building 3, District 8, Modern International Garden, 106 Guanggu Avenue, East Lake New Technology Development District, Wuhan
|
145.7
|
2021.9.10-
2022.9.10
|
RMB 6,500 Yuan per month
|
Residence
|
|
12
|
Issuer
|
Wang **
|
Room 604, No. 6, Alley 346, Hejie Road, Pudong New District, Shanghai
|
90
|
2021.6.6-
2022.6.5
|
RMB 4,300 Yuan per month
|
Residence
|
|
13
|
Issuer
|
Wang **
|
Room 502, No. 25, Alley 346, Hejie Road, Pudong New District, Shanghai
|
90
|
2021.6.6-
2022.6.5
|
RMB 4,000 Yuan per month
|
Residence
|
|
14
|
Issuer
|
Wang **
|
Room 401, No. 35, Alley 346, Hejie Road, Pudong New District, Shanghai
|
90
|
2021.6.12-
2022.6.11
|
RMB 4,300 Yuan per month
|
Residence
|
|
15
|
Issuer
|
Li **
|
Room 506, No. 282 Dangui Road, Shanghai
|
108.35
|
2020.12.16-
2021.12.15
|
RMB 6,500 Yuan per month
|
Residence
|
|
16
|
Issuer
|
Guo **
|
Parking Spaces 7 and B3F, No. 27, 5th Floor, No. 27, Guanxin Road, Hsinchu City, Taiwan (No. 281, No. 282)
|
79.88
|
2019.10.1-
2021.9.30
|
NTD 42,000 per month
|
Office, warehousing
|
|
17
|
ACM Wuxi
|
Wuxi Xingzhou Industrial Park Development Co., Ltd.
|
33-1-601-04-01 & 02 (IC Design Building B604-1 & 2), Xinda Road, Xinwu District, Wuxi
|
148.55
|
2020.4.1-
2022.3.31
|
RMB 33 Yuan per month per square meter
|
Office
|
|
18
|
ACM California
|
ACMR
|
42307 Osgood Road, Room B, Suite #I, Fremont CA 94539
|
1,500 square feet (about 139.35 square meters)
|
2021.4.1-2023.03.31
|
US$ 3,600 per month
|
Office, warehouse
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
19
|
ACM South Korea
|
Jeong **
|
Room 402, Floor 4, Modern City Plaza, Outer Section 3, 726-9 Ami-ri Bubal-up, Icheon-si, Gyeonggi-do
|
164.55
|
2019.12.1-
2021.12.1
|
KRW 1,280,000 per month
|
Business facilities
|
|
20
|
ACM South Korea
|
Kim **
|
Rooms 101, 102, and 103, Floor 1, Sicox Tower, Sangdaewon-dong 517-14, Jungwon-gu, Seongnam-si, Gyeonggi-do
|
448.47
|
2019.3.31-
2024.3.30
|
KRW 5,000,000 per month
|
Factory
|
|
21
|
ACM South Korea
|
Aggregate Corporation of Seongnam Industry Park Management Community
|
Rooms 1204&1205, Sicox Tower, No. 484 Dunchon-daero (Sangdaewon-dong 517-14), Jungwon-gu, Seongnam-si, Gyeonggi-do
|
342.97
|
2021.5.1-
2023.4.30
|
KRW 2,600,000 per month
|
Research institute
|
|
22
|
ACM South Korea
|
Aggregate Corporation of Seongnam Industry Park Management Community
|
Room 1206, Sicox Tower, No.484 Dunchon-daero (Sangdaewon-dong 513-14), Jungwon-gu, Seongnam-si, Gyeonggi-do
|
188.78
|
2021.5.1-
2023.4.30
|
KRW 1,200,000 per month
|
Research institute
|
|
23
|
Issuer
|
Huang **
|
Room 102, No. 15, Lane 848, Chiyue Road, Nicheng Town, Pudong New District, Shanghai
|
101
|
2021.06.20-
2022.06.19
|
RMB 3,600 Yuan per month
|
Residence
|
|
24
|
Issuer
|
Liu **
|
Room 1001, Unit 1, Building A5, Zhongjian Guanggu Star, Wuhan
|
166.9
|
2021.06.10-
2022.06.09
|
RMB 5,000 Yuan per month
|
Residence
|
|
25
|
Issuer
|
Wuhan Institute of Geological Resources and Environmental Industry Technology Co., Ltd.
|
Room 601, Building 1, IGE Industry Incubation Base Phase I, East to the Weilai Third Road and South to the Keji Fifth Road, Wuhan East Lake New Technology Development Zone
|
448
|
2020.08.01-
2025.07.31
|
RMB 48 Yuan per month per square meter
|
Office
|
|
26
|
Issuer
|
Shanghai Shengyu Culture Development Co., Ltd.
|
Whole building of Building 4, No. 365, Chuanhong Road, Shanghai
|
9,854.76
|
2021.02.01-
2023.01.15
|
RMB 1.5 Yuan per day per building square meter, RMB 449,623 Yuan per month
|
Semiconductor equipment assembly, warehousing, and office
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
27
|
Issuer
|
Jiangyin Tian’an Cyber City Real Estate Co., Ltd.
|
Tian’an Cyber City Industrial Office Building, No. 55 Changshan Avenue, Jiangyin City
|
711.32
|
2021.04.01-
2024.03.31
|
RMB 8,807 Yuan per month
|
Office
|
|
28
|
Issuer
|
AVIC Yifa Investment Co., Ltd.
|
Unit 905, 9/F, D East, AVIC Plaza
|
240
|
2020.12.18-
2022.12.17
|
RMB 26,280 Yuan per month
|
Office
|
|
29
|
Issuer
|
Zhang **
|
Room 201, Building 30, Xinhua Third Village, Jiangyin City, Jiangsu Province
|
147.45
|
2021.10.16-
2022.10.15
|
RMB 3,800 Yuan per month
|
Residence
|
|
30
|
Issuer
|
Yu *
|
Room 901, Building 17, Ruicheng Garden, Xinwu District, Wuxi City, Jiangsu Province
|
115
|
2021.09.26-
2022.09.26
|
RMB 3,650 Yuan per month
|
Residence
|
|
31
|
Issuer
|
Xia **
|
Room 1102, Building 49, Ruicheng Garden, Xinwu District, Wuxi City, Jiangsu Province
|
100
|
2021.09.26-
2022.09.26
|
RMB 3,600 Yuan per month
|
Residence
|
|
32
|
Issuer
|
Chen **
|
Room 3301, Building 21, International Garden, Xinwu District, Wuxi City, Jiangsu Province
|
144.93
|
2020.11.29-
2021.11.28
|
RMB 3,800 Yuan per month
|
Residence
|
|
33
|
Issuer
|
Zhang **
|
Unit 402, 4/F, Unit A, Building 43, Tianbao Sixth Lane, Beijing Economic and Technological Development Area
|
134.52
|
2020.12.01-
2021.11.30
|
RMB 8,600 Yuan per month
|
Residence
|
|
34
|
Issuer
|
Wu **
|
Unit 301, Unit 3, Building 712, Tianbaoyuan Third Lane, Beijing Economic and Technological Development Area
|
138.55
|
2020.11.22-
2021.11.21
|
RMB 9,000 Yuan per month
|
Residence
|
|
35
|
Issuer
|
Zhangjiang Hi-Tech Park Development Co., Ltd.
|
Room 1001, Building 15, Lane 1433, Cailun Road, Pudong New District, Shanghai
|
63.14
|
2021.08.19-
2022.08.18
|
RMB 5,200 Yuan per month
|
Residence
|
|
36
|
Issuer
|
Yang *
|
Room 01, 24/F, Unit 2, Building A3, Zhongjian Guanggu Star, Wuhan
|
140.86
|
2021.01.22-
2022.01.21
|
RMB 5,000 Yuan per month
|
Residence
|
|
37
|
Issuer
|
Tang *
|
Room 1401, No. 31, Binhu First Lane, Haicang District, Xiamen
|
112.87
|
2021.09.20-
2022.09.19
|
RMB 3,850 Yuan per month
|
Residence
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
38
|
Issuer
|
Zhang **
|
Room 301, No. 118, Jianmei Lane, Haicang District, Xiamen
|
128.13
|
2020.12.01-
2021.11.30
|
RMB 3,300 Yuan per month
|
Residence
|
|
39
|
Issuer
|
Liu *
|
Room 301, Unit 1, Building A6, Phase II, Guanggu International Community 188, Wuhan
|
126.56
|
2021.3.13-
2022.3.12
|
RMB 4,100 Yuan per month
|
Residence
|
|
40
|
ACM South Korea
|
Han **
|
163-2 Mok-dong, Gwangju, Gyeonggi-do (204 Gwangnam-an-ro (Mok-dong), Gwangju, Gyeonggi-do)
|
559.43
|
2020.10.08-
2022.10.08
|
KRW 4,500,000 per month
|
Factory
|
|
41
|
ACM South Korea
|
Zhang **
|
163-8, 162-3 Mok-dong, Gwangju, Gyeonggi-do (198 Gwangnam-an-ro (Mok-dong), Gwangju, Gyeonggi-do)
|
541.45
|
2021.04.12-
2023.04.11
|
KRW 3,500,000 per month
|
Factory
|
|
42
|
Issuer
|
He **
|
Room 2217, No. 315, West Renmin Road, Jiangyin City, Jiangsu Province
|
53.19
|
2021/6/25-2022/6/24
|
RMB 2,000 Yuan per month
|
Residence
|
|
43
|
Issuer
|
Zheng **
|
Room 402, Yujinxiang Building 7, Tianbaoyuan Sixth Lane, Beijing Economic and Technological Development Area
|
156.6
|
2021/7/5-2022/7/4
|
RMB 9,300 Yuan per month
|
Residence
|
|
44
|
Issuer
|
Yang **
|
Unit 202, Unit A, Building 25, Tianbaoyuan Sixth Lane, Beijing Economic and Technological Development Area
|
132.56
|
2021/8/11-2022/8/10
|
RMB 9,200 Yuan per month
|
Residence
|
|
45
|
Issuer
|
Yang **
|
Unit 302, 3/F, Unit 3, Building 4, Tianbaoyuan Second Lane Area 2, Beijing Economic and Technological Development Area
|
153.74
|
2021/8/15-2022/8/14
|
RMB 9,300 Yuan per month
|
Residence
|
|
46
|
Issuer
|
Yu *
|
Room 2202, Unit 2, Building 16, Guanggu International Community 188, Wuhan
|
109.9
|
2021/9/2-2022/9/1
|
RMB 4,000 Yuan per month
|
Residence
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
47
|
Issuer
|
Zhao
|
Room 2702, No. 45, Lane 99, Jinhe Road, Pudong New District, Shanghai
|
143
|
2021/5/16-2024/5/15
|
RMB 16,000 Yuan per month
|
Residence
|
|
48
|
Issuer
|
Wang **
|
Room 1001, No. 53, Lane 389, Hangrui Road, Hangtou Town, Pudong New District, Shanghai
|
95
|
2021/2/27-2022/2/26
|
RMB 4,300 Yuan per month
|
Residence
|
|
49
|
Issuer
|
Wang **
|
Room 601, No. 11, Heshahangcheng Hemeiyuan, Shanghai
|
92
|
2021/7/12-2022/7/11
|
RMB 4,600 Yuan per month
|
Residence
|
|
50
|
Issuer
|
Shanghai Di’ai Hotel Management Co., Ltd.
|
Room 401 and 421, Building 33, No. 300, Chuantu Road, Pudong New District, Shanghai
|
56
|
2021/4/6-2022/4/5
|
RMB 1,800 Yuan/room/month
|
Residence
|
|
51
|
Issuer
|
Pei **
|
Room 126, 228, 230, 232, 238, 328, 330, 336, 528, 532, Building 6, No. 300, Chuantu Road, Pudong New District, Shanghai
|
300
|
2021/7/22-2022/7/21
|
RMB 20,000 Yuan per month
|
Residence
|
|
52
|
Issuer
|
Shi *
|
Room 401, No. 62, Lane 3885, Huyi Highway, Jiading District, Shanghai
|
129.3
|
2021/8/15-2022/8/14
|
RMB 5,300 Yuan per month
|
Residence
|
|
53
|
Issuer
|
Cai **
|
Room 505, No. 24, Binhu First Lane, Haicang District, Xiamen
|
124.83
|
2021/5/20-2022/5/19
|
RMB 3,800 Yuan per month
|
Residence
|
|
54
|
Issuer
|
Zheng **
|
Room 1001, No. 27, Binhu First Lane, Haicang District, Xiamen
|
134.38
|
2021/8/14-2022/8/13
|
RMB 4,280 Yuan per month
|
Residence
|
|
55
|
Issuer
|
Liu **
|
Room 401, Building 27, Qihang North Area, Gaoliu Community, Hefei
|
125
|
2020/11/08-2021/11/07
|
RMB 3,000 Yuan per month
|
Residence
|
|
56
|
Issuer
|
Ye **
|
Room 406, Building 3, Lianhuan New Village, Gaoliu Community, Hefei
|
115
|
2020/11/08-2021/11/07
|
RMB 2,500 Yuan per month
|
Residence
|
|
57
|
Issuer
|
Han *
|
Room 1803, Building 15, Nanzhuang Area, Gaoliu Community, Hefei
|
105
|
2020/12/5-2021/12/4
|
RMB 2,800 Yuan per month
|
Residence
|
|
58
|
Issuer
|
Wu **
|
Room 606, Building 38, Wenyi Taochong Lake City Plaza, Xinzhan District, Hefei
|
98.23
|
2021/5/25-2022/5/24
|
RMB 2,400 Yuan per month
|
Residence
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
59
|
Issuer
|
Fan *
|
Room 302, Unit 2, Building 8, No. 67, Taibaishan Road, Huangdao District, Qingdao
|
154.1
|
2021/6/1-2022/5/31
|
RMB 4,000 Yuan per month
|
Residence
|
|
60
|
Issuer
|
Guo **
|
Room 403, Unit 2, Building 10, Inner No. 27 Taibaishan, Qingdao Development Zone
|
108.85
|
2021/8/5-2022/8/4
|
RMB 3,100 Yuan per month
|
Residence
|
|
61
|
Issuer
|
Zheng **
|
7B, Building 10, Lanfeng City Garden, Jinjiang City
|
132.34
|
2021/7/1-2022/6/30
|
RMB 3,000 Yuan per month
|
Residence
|
|
62
|
Issuer
|
Hong **
|
7B, Building 11, Phase IV, Lanfeng City Garden, Jinjiang City
|
129.43
|
2021/7/6-2022/7/5
|
RMB 3,000 Yuan per month
|
Residence
|
|
63
|
Issuer
|
Chen **
|
Room 704, Unit 2, Building 14, Lanqiaoyaju, No. 19 Dangui Road, Pukou District, Nanjing
|
116.45
|
2021/8/4-2022/8/3
|
RMB 3,500 Yuan per month
|
Residence
|
|
64
|
Issuer
|
Tan **
|
Room 601, Unit 1, Building 12, Poly East Bay, Hangzhou
|
138.75
|
2021/9/5-2022/9/4
|
RMB 5,800 Yuan per month
|
Residence
|
|
65
|
Issuer
|
Wang **
|
Room 202, Unit 1, Building 4, Junchen Mansion, Qujiang District, Quzhou
|
114.93
|
2021/10/4-2022/10/3
|
RMB 3,400 Yuan per month
|
Residence
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
No.
|
Right Holder
|
Real Estate Certificate No.
|
Co-ownership
|
Location
|
Nature of Right
|
Use
|
Area
(m2)
|
Term of Use
|
|
1
|
Shengwei Shanghai
|
Hu [2020] Bu Dong Zhan Quan No. 000721
|
Sole ownership
|
Mound 16/65, Street Place 9, Luchaogang Town
|
Granted
|
Land for scientific research and designing, industrial land
|
42,786.30
|
2020/7/9-
2070/7/8
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SN
|
Patentee
|
Patent Name
|
Patent
Type
|
Application
No./Patent No.
|
Application
Date
|
Registration Place
|
|
1
|
ACMR
|
Electropolishing components and methods of electropolishing conductive layers
|
Invention
|
028225864
|
2002.11.13
|
China
|
|
2
|
ACMR
|
ADAPTIVE ELECTROPOLISHING USING THICKNESS
MEASUREMENTSAND REMOVAL OF BARRIER AND SACRIFICIAL LAYERS
|
Invention
|
1020057001191
|
2003.7.22
|
South Korea
|
|
3
|
ACMR
|
Controlling the uniformity of removal rate of electropolishing in IC manufacturing
|
Invention
|
094105429
|
2005.2.23
|
Taiwan (China)
|
|
4
|
ACMR
|
The method and system of monitoring electropolishing process of metal layers, the system and monitoring methods and system of metal layers formed by electropolishing on wafers
|
Invention
|
093136793
|
2004.11.26
|
Taiwan (China)
|
|
5
|
ACMR
|
Electropolishing metal layers on wafers having trenches or vias with dummy structures
|
Invention
|
10/108614
|
2002.3.27
|
US
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Core Technology Name
|
Source of
Technology
|
Patented or
Protected by
Other
Measures
|
Technology
Advancement
|
Technology
Maturity
|
|
|
Cleaning equipment
|
SAPS Megasonic Cleaning Technology
|
Self-developed
|
Patented
|
International Advanced
|
Mass production
|
|
SAPS Hydrogen-Functional Water Technology
|
Self-developed
|
Patented
|
International Advanced
|
Mass production
|
|
|
Separate Discharge and Recovery System of Chemical Solution
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
||
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
||
|
Intelligent Exhaust Device with Automatic Cleaning
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
|
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
||
|
TEBO and Gas Atomizing Two-Fluid Integrated Cleaning Device
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Wet bench Tahoe combined high temperature sulfuric acid cleaning technology for single wafer
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Wafer Moisturizing System for Interaction Zone of wet bench and single wafer Based on Tahoe Equipment
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Fully automatic wet bench cleaning equipment
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Single wafer Backside Cleaning Technology
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Design of Double-gas Bernoulli Chuck and Labyrinth Bearing Based on single wafer Backside Cleaning Equipment
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Semiconductor electroplating equipment
|
Multi-anode Electroplating Technology
|
Self-developed
|
Patented
|
International Advanced
|
Mass production
|
|
Sealing Technology of Electroplating Fixture
|
Self-developed
|
Patented
|
International Advanced
|
Mass production
|
|
|
Multi-anode Flow Field Distribution Control Technology
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Gas Flow Distribution Technology in Annealing Cavity
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Modular layout of electroplating equipment
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Automatic rotation spray head technology for edge cleaning
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Advanced packaging equipment
|
SFP Technology
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
SFP Liquid Electrode Technology
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
SFP Fixture Technology
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Application Technology of SFP Double Damascus Process
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Application Technology of SFP Advanced Packaging Process
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Hot gas phase etching technology
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Gluing cavity with automatic cleaning function
|
Self-developed
|
Patented
|
International leading
|
Mass production
|
|
|
Nitrogen assisted heat treatment unit
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
|
|
Optimized secondary rotation gluing process for thick glue
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
|
|
Compact and high yield structure of wet process equipment
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
|
|
Wet bench single wafer combined equipment based on degluing process of packaging equipment
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
|
Wet cleaning equipment suitable for TSV process
|
Self-developed
|
Published Paper of the International Conference
|
Domestic leading
|
Mass production
|
|
|
Wet TSV backside outcrop process and device
|
Self-developed
|
Patented
|
Domestic advanced
|
Mass production
|
|
|
Wet Etching Equipment with Automatic Coating Thickness Adjustment Function
|
Self-developed
|
Patented
|
Domestic leading
|
Mass production
|
|
Name of Core Technology
|
Technology
Advancement
|
|
|
Cleaning equipment
|
I. SAPS Megasonic Cleaning Technology
|
Internationally advanced
|
|
II. TEBO Megasonic Cleaning Technology
|
Internationally leading
|
|
|
III. Single wafer wet bench combined Tahoe high-temperature sulphuric acid cleaning technology
|
Internationally leading
|
|
|
Polishing equipment
|
IV. SFP polishing technology
|
Internationally leading
|
|
Copper-plating equipment
|
V. Multi-anode plating technology
|
Internationally advanced
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Project
|
Jan.-Jun. 2021
|
2020
|
2019
|
2018
|
|
Income from core technology products
|
58,804.77
|
97,532.78
|
74, 340.81
|
53, 961.17
|
|
Operating income
|
62,528.08
|
100,747.18
|
75,673.30
|
55,026.91
|
|
Proportion of income from core technology products
|
94.05%
|
96.81%
|
98.24%
|
98.06%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SN
|
Name of Award
|
Awarding time
|
Awarding body
|
|
1
|
“SAPS (Space Alternated Phase Shift) megasonic cleaning technology” won the first award of Shanghai Science and Technology Awards
|
December 2020
|
Shanghai Municipal Government
|
|
2
|
Shanghai Key Laboratory of Advanced Wet Process Equipment for Integrated Circuits
|
January 2020
|
Shanghai Municipal Commission of Science and Technology
|
|
3
|
China’s Top Five Semiconductor Equipment Enterprises in 2018
|
May 2019
|
China Semiconductor Industry Association
|
|
4
|
Top 10 Units in China Semiconductor Equipment Industry in 2017
|
May 2018
|
China Electronics Special Equipment Industry Association
|
|
5
|
The TEBO megasonic wave non-damage cleaning technology won the twelfth (2017) China semiconductor innovative products and technologies award
|
April 2018
|
China Semiconductor Industry Association, China Electronics Materials Industry Association, China Electronics Special Equipment Industry Association, China Electronics Daily
|
|
6
|
Advanced packaging electroplating equipment Ultra ECP ap Tool won the 12th China Semiconductor Innovation Product and Technology Award (2017)
|
April 2018
|
China Semiconductor Industry Association, China Electronics Materials Industry Association, China Electronics Special Equipment Industry Association, China Electronics Daily
|
|
7
|
March 2018
|
Strategic Alliance of Technology Innovation in Integrated Circuit Industry
|
|
|
8
|
Shanghai Patent Work Pilot Enterprise
|
September 2017
|
Shanghai Intellectual Property Office
|
|
9
|
Top 10 Units in China’s Semiconductor Equipment Industry in 2016
|
May 2017
|
China Electronics Special Equipment Industry Association
|
|
10
|
The development and application of single wafer gluing equipment won the third prize of Shanghai Pudong New Area Science and Technology Award
|
January 2017
|
Shanghai Pudong New Area People’s Government
|
|
11
|
China’s Top 10 Semiconductor Equipment Units in 2015
|
May 2016
|
China Electronics Special Equipment Industry Association
|
|
12
|
Ultra C SAPS Megasonic single wafer Cleaning Equipment won the Bronze Medal of the Fifteenth China International Industrial Expo:
|
November 2013
|
Organizing Committee of China International Industrial Expo
|
|
13
|
The development and application of 45nm-22nm single wafer wafer cleaning equipment won the second prize of Pudong New Area Science and Technology Award
|
October 2013
|
Shanghai Pudong New Area People’s Government
|
|
14
|
The Superior Winning Enterprise of start-up group in second China Innovation and Entrepreneurship Competition (Shanghai Competition Region) in 2013
|
September 2013
|
|
|
15
|
March 2010
|
China Semiconductor Industry Association, China Electronics Materials Industry Association, China Electronics Special Equipment Industry Association, China Electronics Daily
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SN
|
Name of Award
|
Awarding time
|
Awarding body
|
|
16
|
The 12-inch 65-nm single wafer cleaning equipment won the 2008 China International Industrial Expo Innovation Award
|
November 2008
|
Organizing Committee of China International Industrial Expo
|
|
Serial
Number
|
Project name
|
Department
|
Project
Category
|
Implementation
cycle
|
Budget
(RMB10,000
Yuan)
|
Progress
|
Field of
Technology
|
|||||||||
|
1
|
Development and Industrialization of Copper electroplating Equipment (Ultra ECPTM) and SFP Equipment (Ultra SFPTM) in Semiconductor Copper Manufacturing Process
|
The promotion office of Shanghai leading group of prospering the city with science and education
|
Key Industry Science and Technology Tackling Project in prospering the city with science and education plan in 2005
|
From January 2006 to August 2009
|
22,000.00
|
Post-assessment
Completed, and the project has been finalized
|
Copper electroplating, SFP, cleaning
|
|||||||||
|
2
|
Development of 65-45nm SFP Equipment for Copper Interconnect
|
Development of SFP Subsystem and Process for SFP
|
Ministry of Science and Technology
|
China 02 Major Science and Technology Special Project
|
October 2008 to September 2016
|
34,538.00
|
Inspected and accepted; project completed
|
SFP, copper electroplating
|
||||||||
|
Integrated Alpha-Tool and Process Development
|
||||||||||||||||
|
Integrated Beta-Tool and Process Optimization
|
||||||||||||||||
|
industrialization
|
||||||||||||||||
|
3
|
Development and Application of 20-14nm Copper Interconnect Copper Electroplating Equipment
|
Development and Application of 45-14nm Copper Interconnect Copper Electroplating Equipment
|
Ministry of Science and Technology
|
China 02 Major Science and Technology Special Project
|
January 2014 to December 2019
|
18,444.50
|
Electroplating
|
|||||||||
|
4
|
ACM Research (Shanghai), Inc.
|
Shanghai Municipal Commission of Science and Technology
|
Small Giant Project of Science and Technology
|
From January 1, 2017 to December 31, 2018
|
5,967.00
|
Inspection and acceptance completed
|
Wet-process equipment
|
|||||||||
|
5
|
Topic 1: A Study of PTFE Molding and Sintering Technology of Development and Industrialization of Polytetrafluoroethylene Cavity Manufacturing Technology for Semiconductor Equipment
|
Shanghai Municipal Commission of Science and Technology
|
Action Plan for Scientific and Technological Innovation
|
From July 1, 2018 to June 30, 2020
|
450.00
|
Application for inspection and acceptance has been submitted
|
Verify PTFE material
|
|||||||||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Serial Number
|
Project name
|
Department
|
Project Category
|
Implementation cycle
|
Budget (RMB10,000 Yuan)
|
Progress
|
Field of Technology
|
||||||||
|
6
|
Shanghai Intellectual Property Office
|
Pilot Enterprise of Patent Work
|
September 2017 to August 2019
|
80.00
|
Inspection and acceptance completed
|
Wet-process equipment
|
|||||||||
|
7
|
R & D and Industrialization of Single wafer wet bench Combined Cleaning equipment
|
Shanghai Development and Reform Commission, Shanghai Economic and Credit Commission
|
Major Project of Strategic Emerging Industry in Shanghai
|
May 2019 to December 2021
|
11,276.00
|
In implementation
|
Wet-process equipment
|
||||||||
|
8
|
Shanghai enterprise and public institution patent work model unit project
|
Shanghai Intellectual Property Office
|
Model Enterprise of Patent Work
|
August 2020 to July 2022
|
120.00
|
Under implementation
|
-
|
|
Serial Number
|
Project name
|
Research content and objectives to be achieved
|
Corresponding personnel
|
The stage and progress of the project
|
Comparison with the technology level in the industry
|
||
|
1
|
SAPS Megasonic Cleaning Technology
|
Develop cleaning processes for flat wafer surface and deep hole, such as cleaning before and after thin coating deposition, cleaning after dry etching, cleaning after ion implantation ashing, cleaning after
chemical mechanical polishing, etc. Focusing on the removal of small particles, the process below 45 nm effectively solves the organic contamination and cleaning of the particles after etching, and the cleaning efficiency is greatly
improved; and develop the cleaning process applied to the polishing and epitaxial processes of the wafer manufacturing process.
|
Independent research and development
|
Process Verification Stage
|
Having reached the international advanced level
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2
|
ECP Electrochemical Electroplating Technology
|
Application 1: Logic and storage products: ECP map developed by the Company can be applied to 12-inch wafer fabrication at 28 nm and above nodes, as well as more advanced technology nodes; in terms of
application breadth, The ECP map device can be applied to products with 3D structure such as FinFET, DRAM and 3D NAND, as well as metal line interconnections of new nano devices and quantum devices in the future.
Application 2: Wafer-level advanced packaging: The advanced package plating equipment ECPap developed by the Company can be mainly applied to copper, nickel, tin, silver and gold plating processes in
advanced Pillar Bump, RDL, HD Fan-Out and TSV packaging.
Application 3: 3D stacking: The 3D stacking plating equipment ECP 3d developed by the Company can be applied to high-aspect ratio deep hole copper plating in the 3D TSV and 2.5D Inteposer process.
Application 4: third-generation semiconductor plating process and equipment. It can be applied to SiC and GaN third-generation semiconductor and other chemical semiconductor metal deposition, and advanced
packaging for gold plating, deep hole gold plating, and plating of Cu,Ni, Sn, Ag, and other metals.
|
Independent research and development
|
Process Verification Stage
|
Having reached the international advanced level
|
||
|
3
|
Wet Bench Slot-type Cleaning Technology
|
Through the study of wet bench treatment process, we master the influence of wet bench cleaning process on relevant parts, the performance of parts at high temperature, and the optimization of parameters of
the process.
|
Independent research and development
|
Process Verification Stage
|
Having reached the domestic leading level
|
||
|
4
|
Backside cleaning technology
|
Develop the technology of removing back surface coating, etching of polysilicon on back surface of wafer and coating reduction on back surface of wafer, and the main performance indexes are up to the
international advanced level, which is suitable for 55nm and above, 40nm and 28nm technology nodes
|
Independent research and development
|
Process Verification Stage
|
Having reached the domestic leading level
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
5
|
TEBO Megasonic Cleaning Technology
|
Aiming at the difficulties of future cleaning technologies, such as micro-fragile structure cleaning, high aspect ratio structure cleaning, micro-particle removal and material loss control, based on the
current TEBO megasonic cleaning technology, Develop applications to extend to smaller size and higher aspect ratio structures, as well as acoustic wave control models for different sizes and different structures, in conjunction with TEBO
cleaning processes for extremely dilute liquids, to control less material loss.
|
Independent research and development
|
Process Verification Stage
|
Having reached the international advanced level
|
||
|
6
|
Research & Development and Industrialization of Tahoe Single wafer wet bench Combined Cleaning Equipment
|
The equipment includes modules such as wet bench cleaning and single wafer cleaning cavities, which can be used in front end and back end processes of 12-inch wafer production line: (1) Reduce operating
costs: compared to current single wafer high-temperature sulfuric acid cleaning equipment it largely reduces the amount of high-temperature sulfuric acid used; (2) reduce the emission, which is beneficial to environmental protection; (3)
integrate the wet bench and single wafer cleaning process, reduce the process steps, improve the process performance, and shorten the product production cycle..
|
Independent research and development
|
Process validation of 40 nm and 28 nm
|
First innovation in the world, preliminary data show that cleaning efficiency is equivalent to single wafer high-temperature sulfuric acid cleaning equipment, which can greatly save the amount of sulfuric
acid
|
||
|
7
|
SFP Copper Polishing Technology
|
Application 1: Front end interconnects planarization: Integrated SFP copper polishing Ruk process and wet etching process, applicable for Copper interconnects structure ruthenium barrier layer removal of
5 nm process of 12 inch wafer production line: (1) solve the problem of low rate of removal of ruthenium barrier layer by chemical mechanical grinding; (2) reduce environmental pollution, The electrochemical polishing solution and wet
etching solution can be recycled to reduce emission and process cost.
Application 2: Advanced packaging metal layer planarization: SFP ap copper polishing equipment process combined with wet etching process, which can be used in RDL, HD Fan-Out, TSV structure metal copper
layer and its barrier layer planarization process: (1) Process no stress (2) reduces the amount of CMP used, reduces the emission, reduces the process cost, and protects the environment.
|
Independent research and development
|
Process verification of 5 nm below progress
|
The innovation technology line is waiting to be verified; meet the same level of international industry enterprises
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
8
|
Fully Automatic wet bench phosphoric acid cleaning technology
|
The apparatus can be used in the front end hot phosphate nitride thin coating wet etching process of 12-inch wafer production line: (1) the phosphoric acid temperature is generally above 160 centigrade,
Select appropriate equipment materials and exhaust capacity; (2) ensure the heating capacity of phosphoric acid and the stability of hot phosphoric acid temperature during the process; (3) increase of phosphoric acid concentration at high
temperature will lead to decrease of silicon nitride etching rate, How to maintain the concentration of water in the hot phosphoric acid solution is the key to maintain a stable etch rate of silicon nitride; (4) How to control the Si
content of the hot phosphoric acid solution.
|
Independent research and development
|
Engineering design phase
|
Meeting the same level of international industry enterprises
|
||
|
9
|
Vertical Furnace Tube Technology
|
The apparatus can be used in a 12-inch wafer production line to mainly implement different types of thin coating deposition processes on the wafer surface: (1) wafer automatic transfer module; (2) process
cavity module, including a vacuum chamber, a heating furnace, (3) a reaction gas path control and distribution module, (4) a temperature control module, (5) an exhaust gas treatment module, and (6) a software control module, and the field
of application will be developed to oxidation and diffusion furnaces, and finally to ALD applications.
|
Independent research and development
|
The device has entered the client and is being installed
|
Waiting for process and reliability results
|
||
|
10
|
Research & Development and Industrialization of Polytetrafluoroethylene Cavity Manufacturing Technology for Semiconductor Equipment
|
By developing and optimizing the molding, sintering and machining process, realize the PTFE material production process which can be applied to the products and parts of the Company.
|
Co-developed with Shanghai Sanaifu New Materials Technology Co., Ltd and Yixun Automobile Equipment (Shanghai) Co., Ltd
|
Process validation
|
Having reached the advanced level of the industry
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
11
|
Vertical Furnace Tube ALD Film Deposition Equipment and Technology
|
This equipment may be used in 12-inch wafer production lines. It mainly achieves atomic-layer deposition of SiO2 and SiN film on wafer surfaces to meet the ultra-high requirements on the film quality in
advanced chip production process. (1) wafer automatic transfer module; (2) process cavity module, including a vacuum chamber, a heating furnace; (3) a reaction gas path control and distribution module; (4) a temperature control module;
(5) an exhaust gas treatment module; and (6) software control module. Eventually, various ALD dielectric and metal deposition may be achieved.
|
Independent research and development
|
Engineering design phase
|
meet the same level of international industry enterprises
|
||
|
12
|
Research and Development of Edge Cleaning and Etching Equipment and System
|
This equipment may be used in 12-inch wafer production lines to remove edge photoresist film, edge pollutant, and edge oxide: (1) wafer automatic transfer module; (2) process chamber module, including an
aligned nozzle at a controllable position; (3) fluid pipe control and distribution module; (4) a gas control module; (5) a software control module. (6) edge width removal monitoring module.
|
Independent research and development
|
The device has entered the client and is being installed
|
Waiting for process and reliability results
|
||
|
13
|
Research and Development of Single Wafer High-temperature SPM Cleaning Equipment
|
This equipment may be used in 12-inch wafer production lines to remove organic matters, like photoresist and metal residues: (1) wafer automatic transfer module; (2) Brush chamber module, including the
wafer clamping and rotating mechanism, and a brush arm scan mechanism; (3) fluid pipe control and distribution module; (4) a gas control module; (5) a software control module.
(6) cleaning chamber module.
|
Independent research and development
|
Process validation
|
meet the same level of international industry enterprises
|
||
|
14
|
Research and Development of Supercritical CO2 Drying Equipment and System
|
This equipment may be used in 12-inch wafer DRAM or advanced logic production lines for the cleaning and dry processes of high-aspect ratio pattern: (1) wafer automatic transfer module; (2) supercritical
drying chamber module; (3) fluid pipe control and distribution module; (4) a gas control module; (5) a software control module. (6) cleaning chamber module.
|
Independent research and development
|
Design phase
|
meet the same level of international industry enterprises
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Project
|
Jan.-Jun. 2021
|
2020
|
2019
|
2018
|
|
R & D input
|
11,460.28
|
14,079.11
|
9,926.80
|
7,941.50
|
|
Operating income
|
62,528.08
|
100,747.18
|
75,673.30
|
55,026.91
|
|
Ratio
|
18.33%
|
13.97%
|
13.12%
|
14.43%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Serial
Number
|
Reference Number of Meeting
|
Time of Holding
|
Attendees
|
|
1
|
Establishment Meeting
|
November 14, 2019
|
All shareholders or shareholder representatives
|
|
2
|
First-session Extraordinary General Meeting of Shareholders in 2019
|
November 29, 2019
|
All shareholders or shareholder representatives
|
|
3
|
First-session Extraordinary General Meeting of Shareholders in 2020
|
March 30, 2020
|
All shareholders or shareholder representatives
|
|
4
|
Second-session Extraordinary General Meeting of Shareholders in 2020
|
May 15, 2020
|
All shareholders or shareholder representatives
|
|
5
|
Annual General Meeting of Shareholders in 2019
|
June 29, 2020
|
All shareholders or shareholder representatives
|
|
6
|
Third-session Extraordinary General Meeting of Shareholders in 2020
|
July 8, 2020
|
All shareholders or shareholder representatives
|
|
7
|
Fourth-session Extraordinary General Meeting of Shareholders in 2020
|
July 31, 2020
|
All shareholders or shareholder representatives
|
|
8
|
Fifth-session Extraordinary General Meeting of Shareholders in 2020
|
November 19, 2020
|
All shareholders or shareholder representatives
|
|
9
|
Annual General Meeting of Shareholders in 2020
|
June 9, 2021
|
All shareholders or shareholder representatives
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Serial
Number
|
Sequence Number of Meeting of Board of
Directors
|
Time of Holding
|
Attendees
|
|
1
|
First Session of the First Board of Directors
|
November 14, 2019
|
All directors
|
|
2
|
Second Session of the First Board of Directors
|
December 31, 2019
|
All directors
|
|
3
|
Third Session of the First Board of Directors
|
March 13, 2020
|
All directors
|
|
4
|
Fourth Session of the First Board of Directors
|
April 30, 2020
|
All directors
|
|
5
|
Fifth Session of the First Board of Directors
|
June 9, 2020
|
All directors
|
|
6
|
Sixth Session of the First Board of Directors
|
June 23, 2020
|
All directors
|
|
7
|
Seventh Session of the First Board of Directors
|
July 16, 2020
|
All directors
|
|
8
|
Eighth Session of the First Board of Directors
|
October 9, 2020
|
All directors
|
|
9
|
Ninth Session of the First Board of Directors
|
November 4, 2020
|
All directors
|
|
10
|
Tenth Session of the First Board of Directors
|
April 13, 2021
|
All directors
|
|
11
|
Eleventh Session of the First Board of Directors
|
May 20, 2021
|
All directors
|
|
12
|
Twelfth Session of the First Board of Directors
|
August 27, 2021
|
All directors
|
|
13
|
Thirteenth Session of the First Board of Directors
|
October 26, 2021
|
All directors
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Serial Number
|
Sequence Number of Supervisory Board
|
Time of Holding
|
Attendees
|
|
1
|
First Session of the First Supervisory Board
|
November 14, 2019
|
All supervisors
|
|
2
|
Second Session of the First Supervisory Board
|
November 25, 2019
|
All supervisors
|
|
3
|
Third Session of the First Supervisory Board
|
December 31, 2019
|
All supervisors
|
|
4
|
Fourth Session of the First Supervisory Board
|
March 13, 2020
|
All supervisors
|
|
5
|
Fifth Session of the First Supervisory Board
|
April 30, 2020
|
All supervisors
|
|
6
|
Sixth Session of the First Supervisory Board
|
June 9, 2020
|
All supervisors
|
|
7
|
Seventh Session of the First Supervisory Board
|
October 9, 2020
|
All supervisors
|
|
8
|
Eighth Session of the First Supervisory Board
|
November 4, 2020
|
All supervisors
|
|
9
|
Ninth Session of the First Supervisory Board
|
April 13, 2021
|
All supervisors
|
|
10
|
Tenth Session of the First Supervisory Board
|
May 20, 2021
|
All supervisors
|
|
11
|
Eleventh Session of the First Supervisory Board
|
August 27, 2021
|
All supervisors
|
|
12
|
Twelfth Session of the First Supervisory Board
|
October 26, 2021
|
All supervisors
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Committee
|
Convener
|
Members
|
|
Strategy Committee
|
HUI WANG
|
HUI WANG, HAIPING DUN, STEPHEN SUN-HAI CHIAO
|
|
Audit Committee
|
SUTONG ZHANG
|
SUTONG ZHANG, MINGXIU PENG, ZHANBING REN
|
|
Nomination Committee
|
DI ZHANG
|
DI ZHANG, MINGXIU PENG, CHARLES LAW
|
|
Compensation and Appraisal Committee
|
ZHANBING REN
|
ZHANBING REN, DI ZHANG, HAIPING DUN
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Relationship
|
Entity in which the Position is Held/Controlled
Entity
|
Information on the
Position/Control
|
||
|
PING-HAI CHIAO
|
Brother of STEPHEN SUN-HAI CHIAO, a director
|
Zhengzhou Xingjingwang Enterprise Management Consulting Partnership (Limited Partnership)
|
Holding 76.69% of interest shares
|
||
|
Shanghai Jingmeng Silicon Materials Co., Ltd.
|
Director
|
||||
|
Shanghai Wafer Works Materials Co., Ltd.
|
Director
|
||||
|
Taiwan Wafer Works
|
Chairman, General Manager
|
||||
|
Silicon Technology Investment (Cayman) Corp.
|
Director
|
||||
|
Grand Sea Investments Limited
|
Holding 100% of shares
|
||||
|
Jingcai Technology Co., Ltd.
|
Chairman
|
||||
|
Helitek Company Ltd
|
Executive Officer
|
||||
|
Wafer Works Investment Corp.
|
Director
|
||||
|
Ruizheng Co., Ltd
|
Director
|
||||
|
Wafermaster Investment Corp.
|
Director
|
||||
|
Weihai Investment Co., Ltd.
|
Chairman, holding 100% if shares
|
||||
|
Ren Du Xiaochun
|
Sister of ZHANBING REN, a director
|
Shanghai Ruizhong International Trading Co., Ltd.
|
Holding 70% of equity interests
|
||
|
SinoGroupe Sàrl
|
CEO
|
||||
|
ZHONGRUI XIA
|
Spouse of QIAN DONG, a supervisor
|
Ruizhang Technology Co., Ltd.
|
Chairman
|
||
|
Shanghai Lianwan Investment Management Center (Limited Partnership)
|
Executive Partner
|
||||
|
Amlogic Holding Ltd
|
Director
|
||||
|
Shanghai Ruizhang Internet of Things Technology Co., Ltd.
|
Director
|
||||
|
Shanghai Yuezhang Investment Co., Ltd.
|
Executive Director
|
||||
|
Shanghai Ruizhang Investment Co., Ltd.
|
Director, General Manager
|
||||
|
Shanghai Wearlinks Technology Inc.
|
Chairman
|
||||
|
Shanghai Datatist Information Technology Inc.
|
Director
|
||||
|
Chongqing Ruizhang Technology Co., Ltd.
|
Executive Director
|
||||
|
Aliaen Technology, LLC
|
Chairman
|
||||
|
YIFU ZHANG
|
Son of SUTONG ZHANG, a director
|
Chuangxiang Xingkong (Tianjin) Technology Co., Ltd.
|
Executive Director and General Manager, holding 99.00% of shares
|
||
|
Minglue Chuangxin (Beijing) Technology Co., Ltd.
|
Chairman and General Manager, holding 40.35% of shares
|
||||
|
Shanghai Maiyunxinhe Enterprise Management Center (L.P.)
|
Executive Partner, holding 33.40% of share
|
||||
|
Beijing Huili Tongda Technology Co., Ltd.
|
Executive Director and General Manager, holding 100% of shares
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Position in
ACMR
|
Entity in which the Part-time Position is
Held/Controlled Entity
|
Information on the
Part-time
Position/Control
|
|
|
CHENMING HU
|
Director
|
Ambarella Inc.
|
Director
|
|
|
Duntai Electronics Co., Ltd
|
Director
|
|||
|
University of California, Berkeley
(Department of Electrical Engineering and Computer Sciences)
|
Professor
|
|||
|
Inphi Corporation.
|
Director
|
|||
|
YINAN XIANG
|
Director
|
Shanghai Science and Technology Venture Capital (Group) Co., Ltd.
|
Deputy General Manager
|
|
|
Shanghai Venture Capital Consultant Co., Ltd.
|
Executive Director
|
|||
|
Ensense Biomedical Technologies (Shanghai) Co., Ltd
|
Director
|
|||
|
Shanghai International Wine Exchange Center Co., Ltd.
|
Director
|
|||
|
Shanghai Sand Information Technology System Co., Ltd
|
Director
|
|||
|
CETC Shanghai Microwave Communication CO., LTD
|
Director
|
|||
|
Shanghai COSUNET Technology Co., Ltd.
|
Director
|
|||
|
Shanghai Radk-Tech Hydraulic System Co., Ltd.
|
Director
|
|||
|
RolandBerger Yunsai (Shanghai) Enterprise Service Co., Ltd.
|
Director
|
|||
|
Shanghai Rail Transit Inspection and Certification (Group) Co., Ltd.
|
Director
|
|||
|
Shanghai Huaxiang Computer Communication Engineering Co., Ltd.
|
Director
|
|||
|
Shanghai Zhongheng Information Industry Co., LTD.
|
Director
|
|||
|
Shanghai Science & Technology Park of ECUST Co., Ltd.
|
Director
|
|||
|
Shanghai Caohejing Venture Capital Co., Ltd.
|
Chairman
|
|||
|
Shanghai Tissue Engineering Life Science Co., Ltd.
|
Chairman
|
|||
|
Shanghai Zhongxin Technology Venture Capital Co., Ltd.
|
Executive Director
|
|||
|
Shanghai PEIVY Huixin Venture Capital Co., Ltd.
|
Chairman
|
|||
|
Shanghai Zhaofeng Chuangye Investment Co., Ltd.
|
Chairman
|
|||
|
Shanghai Fudan Venture Investment Co., Ltd.
|
Chairman
|
|||
|
Shanghai Shenteng Information Technology Co., Ltd.
|
Director
|
|||
|
SICIF
|
Director
|
|||
|
Shanghai Foremost Group CO., LTD.
|
Director
|
|||
|
Shanghai Qianji Biomedical Venture Capital Co., Ltd.
|
Director
|
|||
|
Shanghai Qianji Venture Capital Management Co., Ltd.
|
Director
|
|||
|
Shanghai Masteck Environment Co., Ltd.
|
Director
|
|||
|
Shanghai Shangchuang Junqiang Investment Management Co., Ltd.
|
Director
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Serial Number
|
Name of Related Party
|
Information on Related Relationship
|
|
|
1
|
NINEBELL
|
HUI WANG, a director of the Company, serves as a director of this company
|
|
|
2
|
Shanghai Jingmeng Silicon Materials Co., Ltd.
|
PAT PING-HAI CHIAO, a brother of STEPHEN SUN-HAI CHIAO who is a director of the Company, served as a director of this company
|
|
|
Shanghai Wafer Works Materials Co., Ltd.
|
PAT PING-HAI CHIAO, a brother of STEPHEN SUN-HAI CHIAO who is a director of the Company, served as a director of this company
|
||
|
3
|
Taiwan Wafer Works
|
PAT PING-HAI CHIAO, a brother of STEPHEN SUN-HAI CHIAO who is a director of the Company, served as the Chairman and CEO of this company
|
|
|
4
|
AMEC
|
ZHENGFAN YANG, a former director of ACMR, serves as a director of this company
|
|
|
5
|
Shanghai Sand Information Technology System Co.
|
YINAN XIANG, a director of ACMR, serves as a director of this company
|
|
|
6
|
Charles Law, a director of ACMR, serves as the managing partner of this firm
|
|
Serial Number
|
Name of Related Party
|
Information on Related Relationship
|
|
1
|
Shengxin Shanghai
|
JIAN WANG, the director and general manager of the Issuer, holds 100% of equity interest in ShengYuan Management Consulting (Shanghai) Co., Ltd. which was the general partner of Shengxin
Shanghai
|
|
2
|
Shanghai Integrated Circuit
|
LING LIN and ZHIDE Yuan served as directors of the Company during the Reporting Period, who serves or served directors of Shanghai Integrated Circuit
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Name
|
Shengxin (Shanghai) Management Consulting Partnership (L.P.)
|
||
|
Unified Social Credit Code
|
91310115MA1K3BAU2L
|
||
|
Principal Place of Business
|
Room 210-32, 2nd Floor, Building 1, No.38 Debao Road, China (Shanghai) Pilot Free Trade Zone
|
||
|
Executive Partner
|
Xinrun Management Consulting (Shanghai) Co., Ltd.
|
||
|
Category of Company
|
Limited Partnership
|
||
|
Scope of Business
|
Enterprise management consultancy; enterprise marketing planning; commercial information consultancy; market information consultancy and investigation (being prohibited from engaging in social
investigation, social survey, public opinion survey, public opinion poll); conference services. [For projects subject to any approval in accordance with laws, business activities may be carried out only after such approval of relevant
authorities has been obtained]
|
||
|
Date of Establishment
|
May 4, 2016
|
|
Name of Partner
|
Category of
Partner
|
Capital
Contribution
(RMB 10,000
Yuan)
|
Proportion of
Contribution (%)
|
Position of the Partner
|
|
YIQUN HU
|
Limited Partner
|
325
|
15.50
|
Friend of HUI WANG, the de facto controller of the Issuer
|
|
LINLI YU
|
Limited Partner
|
230
|
10.97
|
Wife of JIAN WANG, the general manager of the Issuer
|
|
XIAOHONG WANG
|
Limited Partner
|
200
|
9.54
|
Cousin of HUI WANG, the de facto controller of the Issuer
|
|
YUN MA
|
Limited Partner
|
200
|
9.54
|
Wife of a cousin of HUI WANG, the de facto controller of the Issuer
|
|
YITONG TANG
|
Limited Partner
|
162.5
|
7.75
|
External investor
|
|
GANG HUANG
|
Limited Partner
|
97.5
|
4.65
|
Partner of the Issuer
|
|
WEI CAO
|
Limited Partner
|
70
|
3.34
|
Schoolmate of HUI WANG, the de facto controller of the Issuer
|
|
FUPING CHEN
|
Limited Partner
|
61.75
|
2.94
|
Deputy General Manager of the Issuer
|
|
LIN LIU
|
Limited Partner
|
50
|
2.38
|
Friend of HUI WANG, the de facto controller of the Issuer
|
|
BEIYI WANG
|
Limited Partner
|
48.75
|
2.32
|
Partner of the Issuer
|
|
QIN LI
|
Limited Partner
|
43.875
|
2.09
|
Friend of HUI WANG, the de facto controller of the Issuer
|
|
HONGCHAO YANG
|
Limited Partner
|
32.5
|
1.55
|
Core Business Personnel of the Issuer
|
|
HUI SHEN
|
Limited Partner
|
32.5
|
1.55
|
Core Manager of the Issuer
|
|
MINGZHU LUO
|
Limited Partner
|
32.5
|
1.55
|
Board Secretary of the Issuer
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
YAN LI
|
Limited Partner
|
32.5
|
1.55
|
Core Manager of the Issuer
|
|
BAOMING LI
|
Limited Partner
|
32.5
|
1.55
|
Partner of the Issuer
|
|
HONG ZHOU
|
Limited Partner
|
32.5
|
1.55
|
Friend of HUI WANG, the de facto
controller of the Issuer
|
|
SHENA JIA
|
Limited Partner
|
32.5
|
1.55
|
Core Manager of the Issuer
|
|
ZHAOWEI JIA
|
Limited Partner
|
30.875
|
1.47
|
Core Manager of the Issuer
|
|
YULU HU
|
Limited Partner
|
24.375
|
1.16
|
Core Business Personnel of the Issuer
|
|
XIAOFENG TAO
|
Limited Partner
|
24.375
|
1.16
|
Core Business Personnel of the Issuer
|
|
YU HOU
|
Limited Partner
|
24
|
1.14
|
Younger brother of the wife of an elder brother of HUI WANG, the de facto controller of the Issuer
|
|
WEN SUN
|
Limited Partner
|
16.25
|
0.77
|
Friend of HUI WANG, the de facto
controller of the Issuer
|
|
JUN WU
|
Limited Partner
|
16.25
|
0.77
|
Core Manager of the Issuer
|
|
HU ZHAO
|
Limited Partner
|
16.25
|
0.77
|
Core Business Personnel of the Issuer
|
|
JINGWEN HE
|
Limited Partner
|
16.25
|
0.77
|
Friend of FUPING CHEN, a senior executive of the Issuer
|
|
DEYUN WANG
|
Limited Partner
|
16.25
|
0.77
|
Core Manager of the Issuer
|
|
JUN WANG
|
Limited Partner
|
16.25
|
0.77
|
Core Technician of the Issuer
|
|
XIAYUN YANG
|
Limited Partner
|
16.25
|
0.77
|
Core Manager of the Issuer
|
|
XI WANG
|
Limited Partner
|
16.25
|
0.77
|
Core Manager of the Issuer
|
|
XIAOYAN ZHANG
|
Limited Partner
|
16.25
|
0.77
|
Core Manager of the Issuer
|
|
QIANG WANG
|
Limited Partner
|
16.25
|
0.77
|
Core Business Personnel of the Issuer
|
|
WENQING JI
|
Limited Partner
|
16.25
|
0.77
|
Core Manager of the Issuer
|
|
XUEJUN LI
|
Limited Partner
|
16.25
|
0.77
|
Core Technician of the Issuer
|
|
ANYUN BI
|
Limited Partner
|
13
|
0.62
|
Core Manager of the Issuer
|
|
XIAOWEI DI
|
Limited Partner
|
13
|
0.62
|
Core Business Personnel of the Issuer
|
|
YANLI HU
|
Limited Partner
|
13
|
0.62
|
Core Business Personnel of the Issuer
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
MINLI GU
|
Limited Partner
|
8.125
|
0.39
|
Core Manager of the Issuer
|
|
YU WANG
|
Limited Partner
|
8.125
|
0.39
|
Core Business Personnel of the Issuer
|
|
YUFENG HUANG
|
Limited Partner
|
6.5
|
0.31
|
Former employee of the Issuer
|
|
TAO TAO
|
Limited Partner
|
4.875
|
0.23
|
Core Business Personnel of the Issuer
|
|
GUANGYU XIA
|
Limited Partner
|
4.875
|
0.23
|
Core Business Personnel of the Issuer
|
|
FANGYONG ZHEN
|
Limited Partner
|
4.875
|
0.23
|
Core Business Personnel of the Issuer
|
|
WENJUN WANG
|
Limited Partner
|
4.875
|
0.23
|
Core Business Personnel of the Issuer
|
|
Xinrun Management Consulting (Shanghai) Co., Ltd.
|
General Partner
|
0.5
|
0.02
|
-
|
|
Total
|
-
|
2,097.25
|
100.00
|
-
|
|
Related
Party
|
Content of
Transaction
|
Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Percentage
of
Operating Costs
|
Amount
|
Percentage
of
Operating Costs
|
Amount
|
Percentage
of
Operating
Costs
|
Amount
|
Percentage
of
Operating
Costs
|
||
|
ACMR
|
Valves, sensors, connectors, pumps, procurement service fees, etc.
|
-
|
-
|
373.03
|
0.66%
|
7,354.82
|
17.72%
|
10,393.20
|
33.84%
|
|
NINEBELL
|
Robot arms, etc.
|
9,321.12
|
25.86%
|
10,546.98
|
18.62%
|
5,955.30
|
14.34%
|
5,201.20
|
16.94%
|
|
Shengyi Technology
|
Filters, etc., installation service charge
|
585.19
|
1.62%
|
1,808.10
|
3.19%
|
590.24
|
1.42%
|
-
|
-
|
|
AMEC
|
Testing service fees
|
-
|
-
|
11.46
|
0.02%
|
14.57
|
0.04%
|
9.71
|
0.03%
|
|
Shanghai Integrated Circuit
|
Testing service fees
|
-
|
-
|
-
|
-
|
-
|
-
|
615.75
|
2.01%
|
|
Total
|
9,906.31
|
27.49%
|
12,739.56
|
22.49%
|
13,914.93
|
33.52%
|
16,219.86
|
52.82%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2020
|
|||
|
Supplier Name
|
Product Name
|
Amount
|
|
|
Product Systems Inc. USA
|
Megasonic wave generator, etc.
|
316.62
|
|
|
Advance Electric America Co., Inc.
|
Valves, flow meters, etc.
|
41.82
|
|
|
Ion Power, Inc.
|
Ion films
|
13.77
|
|
|
TECO Pneumatic, Inc.
|
Sensors
|
0.50
|
|
|
The Olander Company
|
Caster
|
0.32
|
|
|
Total
|
373.03
|
||
|
2019
|
|||
|
Supplier Name
|
Product Name
|
Amount
|
|
|
Advance Electric America Co., Inc.
|
Valves, flow meters, etc.
|
2,302.68
|
|
|
Harrington Industrial Plastics
|
Connectors, etc.
|
1,354.28
|
|
|
Product Systems Inc. USA
|
Megasonic wave generator, etc.
|
1,167.62
|
|
|
Horiba Instruments Inc.
|
Sensors, etc.
|
636.56
|
|
|
Daitron Inc.
|
Heaters, etc.
|
572.56
|
|
|
Others
|
Pumps, sensors, valves, etc.
|
1,321.12
|
|
|
Total
|
7,354.82
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2018
|
|||
|
Supplier Name
|
Product Name
|
Amount
|
|
|
Advance Electric America Co., Inc.
|
Valves, flow meters, etc.
|
2,579.86
|
|
|
Product Systems Inc. USA
|
Megasonic wave generator, etc.
|
2,520.36
|
|
|
Harrington Industrial Plastics
|
Connectors, etc.
|
1,783.41
|
|
|
Horiba Instruments Inc.
|
Sensors, etc.
|
1,323.49
|
|
|
Daitron Inc.
|
Heaters, etc.
|
460.15
|
|
|
Others
|
Pumps, sensors, valves, etc.
|
1,725.93
|
|
|
Total
|
10,393.20
|
||
|
Item
|
2020
|
2019
|
2018
|
|
|
Gross margin on sales of materials
|
1.21%
|
0.08%
|
0.21%
|
|
|
Item
|
2020
|
2019
|
2018
|
|
|
Service fees paid by the Company
|
-
|
571.76
|
824.17
|
|
|
Costs and expenses incurred by ACMR for purchasing the raw materials
|
-
|
559.17
|
771.13
|
|
|
Rate of deviation
|
-
|
2.25%
|
6.88%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Product Model
|
Average Procurement
Price Prior to
Investment
|
Average
Procurement
Price After
Investment
|
Rate of Deviation
|
Cause of Deviation
|
||
|
Robot arm (8 chambers)
|
100.00
|
95.94
|
-4.06%
|
The unit procurement prices decrease along with the increase in the procurement volume.
|
||
|
Robot arm (12 chambers)
|
100.00
|
95.79
|
-4.21%
|
|
From Jan. To Jun. 2021
|
|||||
|
Type of Raw Materials
|
Purchased from Shengyi
Technology
|
Other Suppliers
|
Average Unit Price Difference Rate
|
||
|
Quantity
|
Average Unit Price
Index
|
Average Unit Price
Index
|
|||
|
Filter
|
217.00
|
37.67
|
100.00
|
-62.30%
|
|
|
Cooler
|
3.00
|
50.34
|
100.00
|
-49.66%
|
|
|
2020
|
|||||
|
Type of Raw Materials
|
Purchased from Shengyi
Technology
|
Other Suppliers
|
Average Unit Price Difference Rate
|
||
|
Quantity
|
Average Unit Price
Index
|
Average Unit Price
Index
|
|||
|
Filter
|
402.00
|
41.26
|
100.00
|
-58.74%
|
|
|
Cooler
|
15.00
|
51.67
|
100.00
|
-48.33%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2019
|
|||||
|
Type of Raw Materials
|
Purchased from Shengyi
Technology
|
Other Suppliers
|
Average Unit Price Difference Rate
|
||
|
Quantity
|
Average Unit Price
Index
|
Average Unit Price
Index
|
|||
|
Filter
|
51.00
|
38.21
|
100.00
|
-61.79%
|
|
|
Wafer handling bench
|
8.00
|
80.23
|
100.00
|
-19.77%
|
|
|
Cooler
|
3.00
|
51.57
|
100.00
|
-48.43%
|
|
|
CO2 hybrid generator
|
1.00
|
73.07
|
100.00
|
-26.93%
|
|
|
From Jan. to Jun. 2021
|
|||||
|
Item
|
Actual Data
|
Simulation Data
|
Amount Deviation
|
Rate of Deviation
|
|
|
Operating costs
|
36,042.40
|
36,575.70
|
533.31
|
1.48%
|
|
|
Total profits
|
9,325.23
|
8,791.92
|
-533.31
|
-5.72%
|
|
|
Net profits
|
8,967.60
|
8,500.95
|
-466.64
|
-5.20%
|
|
|
2020
|
|||||
|
Item
|
Actual Data
|
Simulation Data
|
Amount Deviation
|
Rate of Deviation
|
|
|
Operating costs
|
56,642.24
|
58,286.55
|
1,644.32
|
2.90%
|
|
|
Total profits
|
22,302.41
|
20,658.09
|
-1,644.32
|
-7.37%
|
|
|
Net profits
|
19,676.99
|
18,279.33
|
-1,397.67
|
-7.10%
|
|
|
2019
|
|||||
|
Item
|
Actual Data
|
Simulation Data
|
Amount Deviation
|
Rate of Deviation
|
|
|
Operating costs
|
41,515.84
|
41,925.29
|
409.45
|
0.99%
|
|
|
Total profits
|
15,311.91
|
14,902.46
|
-409.45
|
-2.67%
|
|
|
Net profits
|
13,488.73
|
13,140.70
|
-348.03
|
-2.58%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Product
|
Corresponding Customer
|
Price Index
|
|
|
Cooler
|
Other third-party customer 1
|
105.00
|
|
|
Other third-party customer 2
|
105.00
|
||
|
The Company
|
100.00
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Related Party
|
Content
of
Transaction
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|||||
|
Amount
|
Percentage
of
Operating Costs
|
Amount
|
Percentage of Operating Costs
|
Amount
|
Percentage
of
Operating Costs
|
Amount
|
Percentage
of
Operating Costs
|
|||
|
ACMR
|
semiconductor
cleaning
equipment
|
-
|
-
|
845.96
|
0.84%
|
-
|
-
|
6,081.94
|
11.05%
|
|
|
Taiwan Wafer Works
|
semiconductor
cleaning
equipment
|
-
|
-
|
-
|
-
|
-
|
-
|
496.31
|
0.90%
|
|
|
services
and accessories
|
1.31
|
0.00%
|
7.96
|
0.01%
|
11.27
|
0.01%
|
-
|
-
|
||
|
Shanghai Jingmeng Silicon Materials Co., Ltd.
|
semiconductor
cleaning
equipment
|
-
|
-
|
1,034.64
|
1.03%
|
793.33
|
1.05%
|
-
|
-
|
|
|
services
and
accessories
|
-
|
-
|
20.42
|
0.02%
|
43.71
|
0.06%
|
7.31
|
0.01%
|
||
|
Shanghai Integrated Circuit
|
semiconductor cleaning equipment
|
-
|
-
|
-
|
-
|
-
|
-
|
2,646.96
|
4.81%
|
|
|
Shanghai Wafer Works Materials Co., Ltd.
|
semiconductor cleaning equipment
|
-
|
-
|
1,393.32
|
1.38%
|
-
|
-
|
-
|
||
|
Total
|
1.31
|
0.00%
|
3,302.29
|
3.28%
|
848.31
|
1.12%
|
9,232.52
|
16.78%
|
||
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Year
|
Customer
Name
|
Product Name
|
Sales Amount of the Issuer
|
Sales Amount
of ACMR
|
Rate of
Deviation
|
||||
|
USD
|
RMB
|
USD
|
|||||||
|
2018
|
YMTC
|
Single-wafer cleaning equipment
|
467.00
|
2,992.42
|
491.58
|
5.00%
|
|||
|
467.00
|
3,089.51
|
491.58
|
5.00%
|
||||||
|
2020
|
ASM America Inc.
|
Single-wafer cleaning equipment
|
118.75
|
845.96
|
125.00
|
5.00%
|
|||
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
Remuneration of Key Managers
|
603.18
|
878.25
|
578.06
|
446.77
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Person Providing
Security
|
Secured
Amount
|
Starting Date
|
Expiring Date
|
Status of
Performance
|
|
HUI WANG
|
7,700.00
|
April 24, 2020
|
March 19, 2022
|
Completed
|
|
HUI WANG
|
8,000.00
|
April 2, 2020
|
September 30, 2021
|
Completed
|
|
HUI WANG
|
3,000.00
|
March 1, 2018
|
March 1, 2021
|
Completed
|
|
HUI WANG
|
5,500.00
|
February 25, 2019
|
January 23, 2020
|
Completed
|
|
HUI WANG
|
5,000.00
|
February 25, 2019
|
February 24, 2020
|
Completed
|
|
HUI WANG
|
2,200.00
|
February 19, 2019
|
January 13, 2020
|
Completed
|
|
HUI WANG
|
1,000.00
|
January 24, 2018
|
January 23, 2019
|
Completed
|
|
HUI WANG
|
500.00
|
September 30, 2017
|
September 29, 2018
|
Completed
|
|
HUI WANG
|
2,750.00
|
August 21, 2017
|
August 20, 2018
|
Completed
|
|
Related Party
|
Amount of Money
Borrowed/Lent
|
Starting Date
|
Expiring Date
|
|
|
Borrow-in
|
||||
|
Shengxin Shanghai
|
RMB 20.1235 million Yuan
|
December 9, 2016
|
October 30, 2023
|
|
|
ACMR
|
US$6 million
|
December 10, 2017
|
November 6, 2019
|
|
|
ACMR
|
US$1 million
|
February 26, 2020
|
March 31, 2020
|
|
|
Lend-out
|
||||
|
ACMR
|
US$ 5 million
|
June 21, 2019
|
June 21, 2020
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to
Jun. 2021
|
2020
|
2019
|
2018
|
|
Allowances of Chinese directors of ACMR
|
-
|
-
|
44.70
|
-
|
|
U.S. listing fees of ACMR
|
-
|
-
|
-
|
8.61
|
|
Patent fees of ACMR
|
-
|
-
|
2.64
|
11.02
|
|
Others
|
-
|
-
|
3.38
|
7.23
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Corporation
|
June 30,
2021
|
December 31, 2020
|
December 31,
2019
|
December 31, 2018
|
|||
|
Receivables
|
ACMR
|
-
|
774.81
|
-
|
3,257.34
|
||
|
Shanghai Jingmeng Silicon Materials Co., Ltd.
|
-
|
101.40
|
97.47
|
1.18
|
|||
|
Shanghai Wafer Works Materials Co., Ltd.
|
-
|
131.80
|
-
|
-
|
|||
|
Taiwan Wafer Works
|
-
|
-
|
6.17
|
-
|
|||
|
Prepayments
|
ACMR
|
-
|
-
|
309.73
|
-
|
||
|
NINEBELL
|
1,118.98
|
1,048.42
|
243.07
|
392.61
|
|||
|
Other receivables
|
ACMR
|
-
|
-
|
3,693.14
|
139.93
|
||
|
JIAN WANG
|
-
|
-
|
1.03
|
2.33
|
|||
|
FUPING CHEN
|
-
|
-
|
1.90
|
1.28
|
|||
|
Long-term Receivables
|
Shengxin Shanghai
|
-
|
-
|
1,371.16
|
2,092.29
|
||
|
Payables
|
ACMR
|
-
|
-
|
2,419.57
|
5,482.65
|
||
|
NINEBELL
|
3,444.15
|
1,890.64
|
587.43
|
1,013.81
|
|||
|
Shengyi Technology
|
383.46
|
779.48
|
340.45
|
-
|
|||
|
Deposits received
|
Shanghai Jingmeng Silicon Materials Co., Ltd.
|
-
|
-
|
941.79
|
710.34
|
||
|
Other Payables
|
ACMR
|
-
|
-
|
3,458.32
|
5,817.63
|
||
|
Shengxin Shanghai
|
-
|
-
|
1,288.95
|
2,053.84
|
|||
|
Shengyi Technology
|
-
|
-
|
-
|
75.00
|
|||
|
HUI WANG
|
44.51
|
10.58
|
19.29
|
7.86
|
|||
|
JIAN WANG
|
26.62
|
4.44
|
10.49
|
3.63
|
|||
|
FUPING CHEN
|
21.21
|
-
|
3.43
|
-
|
|||
|
LISA YI LU FENG
|
-
|
-
|
3.74
|
0.41
|
|||
|
Long-term Payables
|
ACMR
|
-
|
-
|
1,371.16
|
2,092.29
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to
Jun. 2021 |
2020
|
2019
|
2018
|
|
Related Procurement
|
9,906.31
|
12,739.56
|
13,914.93
|
16,219.86
|
|
Related Sales
|
1.31
|
3,302.29
|
848.31
|
9,232.52
|
|
Remuneration of Key Managers
|
603.18
|
878.25
|
578.06
|
446.77
|
|
Fees Paid for the account of others
|
0
|
0
|
50.72
|
26.86
|
|
Other related transactions
|
0
|
107.23
|
123.97
|
45.30
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
|
Current assets:
|
|||||
|
Cash and bank balances
|
253,827,002.50
|
271,267,852.84
|
440,029,105.69
|
95,828,639.76
|
|
|
Held-for-trading financial assets
|
201,916,518.62
|
184,208,918.79
|
-
|
-
|
|
|
Accounts receivables
|
307,582,591.88
|
256,075,757.62
|
209,896,421.78
|
173,605,541.67
|
|
|
Prepayments
|
57,265,500.36
|
35,760,885.14
|
11,244,578.61
|
13,360,469.02
|
|
|
Other receivables
|
41,739,723.41
|
34,713,166.21
|
47,638,486.72
|
17,160,806.70
|
|
|
Inventory
|
935,189,764.09
|
614,869,365.46
|
307,274,118.34
|
264,159,937.04
|
|
|
Other current assets
|
25,769,142.80
|
24,666,762.37
|
192,567,769.71
|
3,717,096.53
|
|
|
Total current assets
|
1,823,290,243.66
|
1,421,562,708.43
|
1,208,650,480.85
|
567,832,490.72
|
|
|
Non-current assets:
|
|||||
|
Long-term receivables
|
-
|
-
|
14,841,790.94
|
24,704,508.34
|
|
|
Long-term equity investments
|
30,582,848.62
|
30,488,610.34
|
30,719,024.14
|
739,752.09
|
|
|
Other non-current financial assets
|
-
|
-
|
-
|
-
|
|
|
Fixed assets
|
29,171,187.61
|
28,114,683.89
|
13,963,028.87
|
16,384,814.69
|
|
|
Construction in progress
|
19,166,020.36
|
14,371,605.82
|
3,702,119.11
|
-
|
|
|
Right-of-use assets
|
33,272,425.94
|
-
|
-
|
-
|
|
|
Intangible assets
|
66,360,459.98
|
66,538,187.71
|
2,400,762.49
|
1,881,893.23
|
|
|
Long-term deferred expenses
|
9,587,028.94
|
10,526,954.10
|
8,295,263.44
|
8,689,887.89
|
|
|
deferred tax assets
|
1,920,410.01
|
2,299,731.45
|
20,120,805.29
|
11,086,424.72
|
|
|
Other non-current assets
|
280,583,645.94
|
269,621,198.09
|
5,308,201.87
|
4,702,696.64
|
|
|
Total non-current assets
|
470,644,027.40
|
421,960,971.40
|
99,350,996.15
|
68,189,977.60
|
|
|
Total Assets
|
2,293,934,271.06
|
1,843,523,679.83
|
1,308,001,477.00
|
636,022,468.32
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
|
Current liabilities:
|
|
||||
|
Short-term borrowings
|
143,503,868.29
|
171,753,542.58
|
96,958,575.62
|
64,835,620.60
|
|
|
Accounts payable
|
509,083,455.00
|
291,942,188.20
|
143,174,383.74
|
188,211,170.82
|
|
|
Deposit received
|
-
|
-
|
68,022,078.58
|
68,258,641.92
|
|
|
Contract liabilities
|
232,720,142.50
|
86,017,842.49
|
-
|
-
|
|
|
Employee benefits payable
|
15,391,937.29
|
19,601,166.54
|
13,478,935.67
|
3,416,152.85
|
|
|
Taxes payable
|
5,239,714.49
|
3,757,755.08
|
29,038,214.04
|
9,241,710.55
|
|
|
Other payables
|
12,128,518.19
|
11,057,657.83
|
61,905,739.91
|
91,372,797.93
|
|
|
Non-current liabilities due within one year
|
26,987,694.78
|
10,458,460.32
|
-
|
-
|
|
|
Total current liabilities
|
945,055,330.54
|
594,588,613.04
|
412,577,927.56
|
425,336,094.67
|
|
|
Non-current liabilities:
|
|||||
|
Long-term borrowings
|
120,909,449.95
|
117,280,857.74
|
-
|
-
|
|
|
Lease liabilities
|
18,385,698.53
|
-
|
-
|
-
|
|
|
Long-term payables
|
-
|
-
|
13,711,646.54
|
20,922,885.14
|
|
|
Long-term employee benefits payable
|
2,648,278.40
|
1,839,426.56
|
1,114,296.57
|
212,643.68
|
|
|
Estimated liabilities
|
32,211,185.17
|
30,067,131.50
|
22,053,589.22
|
13,163,850.07
|
|
|
Deferred income
|
27,293,269.28
|
51,074,327.14
|
28,615,025.37
|
31,339,538.78
|
|
|
Total non-current Liabilities
|
201,447,881.33
|
200,261,742.94
|
65,494,557.70
|
65,638,917.67
|
|
|
Total liabilities
|
1,146,503,211.87
|
794,850,355.98
|
478,072,485.26
|
490,975,012.34
|
|
|
Shareholders’ Equity
|
|||||
|
Share capital / paid in capital
|
390,201,347.00
|
390,201,347.00
|
390,201,347.00
|
213,124,950.00
|
|
|
Capital reserve
|
396,924,302.04
|
387,754,532.67
|
366,545,796.07
|
7,748,794.15
|
|
|
Other comprehensive income
|
793,198.70
|
881,213.21
|
115,559.34
|
163,531.34
|
|
|
Surplus reserve
|
28,626,564.68
|
28,626,564.68
|
7,471,613.51
|
-
|
|
|
Retained earnings
|
330,885,646.77
|
241,209,666.29
|
65,594,675.82
|
-75,989,819.51
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Total shareholders’ equity attributable to the parent company
|
1,147,431,059.19
|
1,048,673,323.85
|
829,928,991.74
|
145,047,455.98
|
|
|
Total shareholders’ equity
|
1,147,431,059.19
|
1,048,673,323.85
|
829,928,991.74
|
145,047,455.98
|
|
|
Total liabilities and shareholders’ equity
|
2,293,934,271.06
|
1,843,523,679.83
|
1,308,001,477.00
|
636,022,468.32
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
|
I. Total operating income
|
625,280,772.35
|
1,007,471,809.80
|
756,732,956.80
|
550,269,055.81
|
|
|
Including: Operating income
|
625,280,772.35
|
1,007,471,809.80
|
756,732,956.80
|
550,269,055.81
|
|
|
II. Total operating cost
|
575,982,726.86
|
896,386,734.45
|
626,548,338.60
|
464,868,954.67
|
|
|
Including: operating cost
|
360,423,960.21
|
566,422,360.10
|
415,158,395.29
|
307,096,125.81
|
|
|
Taxes and surcharges
|
357,296.03
|
843,405.52
|
647,614.16
|
421,488.03
|
|
|
Selling expenses
|
65,516,953.66
|
105,639,504.93
|
84,754,934.36
|
60,046,855.52
|
|
|
Administrative expenses
|
29,275,101.42
|
50,318,924.37
|
30,297,265.12
|
20,404,116.85
|
|
|
Research and development expenses
|
114,602,769.83
|
140,791,112.52
|
99,268,029.88
|
79,414,978.15
|
|
|
Financial expenses
|
5,806,645.71
|
32,371,427.01
|
-3,577,900.21
|
-2,514,609.69
|
|
|
Including: Interest expenses
|
3,037,479.26
|
6,295,231.98
|
7,456,097.63
|
5,047,846.77
|
|
|
Interest income
|
326,768.98
|
2,701,255.66
|
2,046,399.55
|
638,352.04
|
|
|
Add: Other income
|
28,314,811.54
|
25,929,804.09
|
26,715,646.95
|
20,876,330.34
|
|
|
Investment income (“-” for loss)
|
-929,330.51
|
1,284,412.23
|
1,240,299.89
|
-10,247.91
|
|
|
Including: investment income from associated enterprises and joint ventures
|
94,238.28
|
-230,413.80
|
-20,727.95
|
-10,247.91
|
|
|
Income from changes in fair value (“-” for loss)
|
17,707,599.83
|
86,719,932.51
|
-
|
-
|
|
|
Credit impairment losses (“-” for loss)
|
-1,967,228.51
|
1,224,680.63
|
-2,235,058.65
|
-
|
|
|
Asset impairment losses (“-” for loss)
|
215,837.60
|
-3,533,652.20
|
-788,808.94
|
-2,373,682.39
|
|
|
III. Operating profit (“-” for loss)
|
92,639,735.44
|
222,710,252.61
|
155,116,697.45
|
103,892,501.18
|
|
|
Add: Non-operating income
|
619,560.94
|
537,276.10
|
33,632.92
|
54,367.47
|
|
|
Less: Non-operating expenses
|
6,985.17
|
223,454.11
|
2,031,271.51
|
1,115,198.33
|
|
|
IV. Total profit (“-” for total losses)
|
93,252,311.21
|
223,024,074.60
|
153,119,058.86
|
102,831,670.32
|
|
|
Less: Income tax expenses
|
3,576,330.73
|
26,254,132.96
|
18,231,716.42
|
10,301,280.16
|
|
|
V. Net profit (“-” for net loss)
|
89,675,980.48
|
196,769,941.64
|
134,887,342.44
|
92,530,390.16
|
|
|
(I) Classified by business continuity
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
1. Net profit from continuing operations (“-” for net loss)
|
89,675,980.48
|
196,769,941.64
|
134,887,342.44
|
92,530,390.16
|
|
|
2. Net profit from discontinued operations (“-” for net loss)
|
-
|
-
|
-
|
-
|
|
|
(II) Classified by ownership
|
|||||
|
1. Net profits attributable to shareholders of the parent company (“-” for net loss)
|
89,675,980.48
|
196,769,941.64
|
134,887,342.44
|
92,530,390.16
|
|
|
2. Profit or loss of minority interest (“-” for net loss)
|
-
|
-
|
-
|
-
|
|
|
VI. Other comprehensive income, net of tax
|
-88,014.51
|
765,653.87
|
-47,972.00
|
160,704.28
|
|
|
Other comprehensive income attributable to owners of the parent company, net of tax
|
-88,014.51
|
765,653.87
|
-47,972.00
|
160,704.28
|
|
|
(I) Other comprehensive income that cannot be reclassified to profit or loss
|
-
|
-
|
-
|
-
|
|
|
(II) Other comprehensive income to be reclassified to profit or loss
|
-88,014.51
|
765,653.87
|
-47,972.00
|
160,704.28
|
|
|
Including: Foreign currency translation reserve
|
-88,014.51
|
765,653.87
|
-47,972.00
|
160,704.28
|
|
|
Other comprehensive income attributable to owners of minority shareholders, net of tax
|
-
|
-
|
-
|
-
|
|
|
VII. Total comprehensive income
|
89,587,965.97
|
197,535,595.51
|
134,839,370.44
|
92,691,094.44
|
|
|
Total comprehensive income attributable to owners of the parent company
|
89,587,965.97
|
197,535,595.51
|
134,839,370.44
|
92,691,094.44
|
|
|
Total comprehensive income attributable to minority shareholders
|
-
|
-
|
-
|
-
|
|
|
VIII. Earnings per share:
|
|||||
|
(I) Basic earnings per share (RMB 1 Yuan/share)
|
0.23
|
0.50
|
0.36
|
-
|
|
|
(II) Diluted earnings per share (RMB 1 Yuan/share)
|
0.23
|
0.50
|
0.36
|
-
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
|
I. Cash flows from operating activities
|
|||||
|
Cash received from sales of goods or rendering of services
|
733,198,155.36
|
965,793,104.81
|
730,630,575.46
|
540,892,514.09
|
|
|
Refunds of taxes
|
46,694,868.17
|
45,064,618.95
|
51,415,157.90
|
31,616,948.86
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Cash received relating to other operating activities
|
7,549,187.14
|
62,688,068.49
|
32,124,009.88
|
4,266,384.04
|
|
|
Subtotal of cash inflows from operating activities
|
787,442,210.67
|
1,073,545,792.25
|
814,169,743.24
|
576,775,846.99
|
|
|
Cash paid for goods and services
|
539,497,096.68
|
834,434,849.80
|
538,881,062.29
|
400,716,490.93
|
|
|
Cash paid to and on behalf of employees
|
110,036,442.30
|
113,224,120.74
|
84,379,310.56
|
58,378,437.95
|
|
|
Cash paid for all types of taxes
|
4,537,114.39
|
35,531,985.55
|
8,575,237.99
|
265,012.03
|
|
|
Cash paid relating to other operating activities
|
92,439,430.93
|
178,599,781.18
|
109,627,644.35
|
78,605,561.90
|
|
|
Subtotal of cash outflows from operating activities
|
746,510,084.30
|
1,161,790,737.27
|
741,463,255.19
|
537,965,502.81
|
|
|
Net cash flows from operating activities
|
40,932,126.37
|
-88,244,945.02
|
72,706,488.05
|
38,810,344.18
|
|
|
II. Cash inflows from investing activities
|
|||||
|
Cash received from return of investemnt
|
-
|
242,041,200.00
|
-
|
-
|
|
|
Cash received from investment
|
-
|
3,671,014.66
|
-
|
-
|
|
|
Net cash received from disposal of fixed assets, intangible assets and other long-term assets
|
-
|
2,720.73
|
2,350.00
|
8,200.00
|
|
|
Cash received relating to other investing activities
|
-
|
7,406,102.64
|
-
|
-
|
|
|
Subtotal of cash inflows from investing activities
|
-
|
253,121,038.03
|
2,350.00
|
8,200.00
|
|
|
Cash paid for acquisition and construction of fixed assets, intangible assets and other long-term assets
|
19,040,311.74
|
355,449,882.11
|
10,165,874.74
|
14,731,164.00
|
|
|
Cash paid for investment
|
-
|
120,943,300.00
|
188,852,600.00
|
-
|
|
|
Net cash paid by acquisition of subsidiaries and other business units
|
-
|
24,541,650.00
|
30,750,000.00
|
-
|
|
|
Cash paid relating to other investment activities
|
-
|
12,336,000.00
|
34,492,500.00
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Subtotal of cash outflows from investing activities
|
19,040,311.74
|
513,270,832.11
|
264,260,974.74
|
14,731,164.00
|
|
|
Net cash flows from investing activities
|
-19,040,311.74
|
-260,149,794.08
|
-264,258,624.74
|
-14,722,964.00
|
|
|
III. Cash flows from financing activities
|
|||||
|
Cash received from investment absorption
|
-
|
-
|
560,661,364.69
|
-
|
|
|
Cash received from borrowings
|
124,167,819.86
|
340,137,518.99
|
128,873,975.15
|
121,295,620.60
|
|
|
Subtotal of cash inflows from financing activities
|
124,167,819.86
|
340,137,518.99
|
689,535,339.84
|
121,295,620.60
|
|
|
Cash paid for debt repayment
|
146,935,586.45
|
132,833,143.88
|
97,735,510.19
|
89,760,000.00
|
|
|
Cash paid for distribution of dividends or profits and for interest expenses
|
6,821,352.36
|
6,442,311.63
|
7,611,020.80
|
2,640,570.32
|
|
|
Cash paid relating to other financing activities
|
7,699,573.83
|
12,286,460.98
|
49,994,239.02
|
-
|
|
|
Subtotal of cash outflows from financing activities
|
161,456,512.64
|
151,561,916.49
|
155,340,770.01
|
92,400,570.32
|
|
|
Net cash flows from financing activities
|
-37,288,692.78
|
188,575,602.50
|
534,194,569.83
|
28,895,050.28
|
|
|
IV. Effect of foreign exchange rate changes on cash and cash equivalents
|
-2,043,972.19
|
-8,942,116.25
|
1,558,032.79
|
-2,306,981.52
|
|
|
V. Net increase in cash and cash equivalents
|
-17,440,850.34
|
-168,761,252.85
|
344,200,465.93
|
50,675,448.94
|
|
|
Add: Cash and cash equivalents at beginning of period
|
271,267,852.84
|
440,029,105.69
|
95,828,639.76
|
45,153,190.82
|
|
|
VI. Cash and cash equivalents at end of period
|
253,827,002.50
|
271,267,852.84
|
440,029,105.69
|
95,828,639.76
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
|
Current assets:
|
|||||
|
Cash and bank balances
|
20,057,183.65
|
75,817,949.02
|
286,781,661.15
|
27,215,160.52
|
|
|
Held-for-trading financial assets
|
201,916,518.62
|
184,208,918.79
|
-
|
-
|
|
|
Accounts receivables
|
357,979,574.93
|
385,776,905.05
|
320,416,930.78
|
195,092,417.32
|
|
|
Prepayments
|
71,455,177.77
|
46,262,350.69
|
23,159,474.00
|
13,328,626.96
|
|
|
Other receivables
|
44,393,465.87
|
36,747,275.60
|
11,555,869.32
|
17,064,181.28
|
|
|
Inventory
|
896,443,968.41
|
602,044,135.29
|
295,107,215.49
|
263,975,720.12
|
|
|
Other current assets
|
21,322,747.20
|
20,056,989.68
|
192,023,607.72
|
2,944,359.83
|
|
|
Total current assets
|
1,613,568,636.45
|
1,350,914,524.12
|
1,129,044,758.46
|
519,620,466.03
|
|
|
Non-current assets:
|
|
||||
|
Long-term receivables
|
210,874,539.31
|
203,818,031.81
|
14,841,790.94
|
24,704,508.34
|
|
|
Long-term equity investments
|
38,582,848.62
|
38,488,610.34
|
36,719,024.14
|
5,739,752.09
|
|
|
Fixed assets
|
27,708,369.63
|
26,940,268.54
|
13,651,736.37
|
16,305,494.30
|
|
|
Construction in progress
|
14,257,883.24
|
11,095,707.80
|
3,702,119.11
|
-
|
|
|
Right-of-use assets
|
30,892,727.51
|
-
|
-
|
-
|
|
|
Intangible assets
|
3,108,222.97
|
3,131,022.63
|
1,997,794.83
|
1,600,080.80
|
|
|
Long-term deferred expenses
|
8,180,129.73
|
9,565,554.88
|
8,116,458.98
|
8,669,850.06
|
|
|
deferred tax assets
|
-
|
-
|
17,951,274.93
|
11,070,257.47
|
|
|
Other non-current assets
|
12,190,994.69
|
4,804,334.63
|
4,644,711.91
|
4,518,951.92
|
|
|
Total non-current assets
|
345,795,715.70
|
297,843,530.63
|
101,624,911.21
|
72,608,894.98
|
|
|
Total Assets
|
1,959,364,352.15
|
1,648,758,054.75
|
1,230,669,669.67
|
592,229,361.01
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
|
Current liabilities:
|
|||||
|
Short-term borrowings
|
143,503,868.29
|
171,753,542.58
|
96,958,575.62
|
64,835,620.60
|
|
|
Accounts payable
|
432,681,567.42
|
249,280,254.24
|
115,306,027.30
|
188,130,524.93
|
|
|
Deposit received
|
-
|
-
|
23,322,451.48
|
32,405,506.20
|
|
|
Contract liabilities
|
87,289,725.29
|
52,054,433.00
|
-
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Employee benefits payable
|
11,485,517.28
|
16,178,241.10
|
11,559,044.56
|
2,788,215.49
|
|
|
Taxes payable
|
1,811,908.31
|
1,425,132.55
|
27,931,334.97
|
8,196,421.68
|
|
|
Other payables
|
18,657,930.58
|
13,101,486.98
|
61,196,982.56
|
90,312,457.45
|
|
|
Non-current liabilities due within one year
|
15,035,017.20
|
-
|
-
|
-
|
|
|
Total current liabilities
|
710,465,534.37
|
503,793,090.45
|
336,274,416.49
|
386,668,746.35
|
|
|
Non-current liabilities:
|
|
||||
|
Long-term borrowings
|
9,000,000.00
|
-
|
-
|
-
|
|
|
Lease liabilities
|
17,243,916.83
|
-
|
-
|
-
|
|
|
Long-term payables
|
-
|
-
|
13,711,646.54
|
20,922,885.14
|
|
|
Estimated liabilities
|
32,211,185.17
|
30,067,131.50
|
22,053,589.22
|
13,163,850.07
|
|
|
Deferred income
|
27,293,269.28
|
51,074,327.14
|
28,615,025.37
|
31,339,538.78
|
|
|
Deferred income tax liabilities
|
3,742,709.20
|
2,090,723.42
|
-
|
-
|
|
|
Total non-current Liabilities
|
89,491,080.48
|
83,232,182.06
|
64,380,261.13
|
65,426,273.99
|
|
|
Total liabilities
|
799,956,614.85
|
587,025,272.51
|
400,654,677.62
|
452,095,020.34
|
|
|
Shareholders’ Equity
|
|
||||
|
Share capital / paid in capital
|
390,201,347.00
|
390,201,347.00
|
390,201,347.00
|
213,124,950.00
|
|
|
Capital reserve
|
393,445,715.23
|
385,265,788.47
|
365,097,509.99
|
7,222,320.06
|
|
|
Surplus reserve
|
28,626,564.68
|
28,626,564.68
|
7,471,613.51
|
-
|
|
|
Retained earnings
|
347,134,110.39
|
257,639,082.09
|
67,244,521.55
|
-80,212,929.39
|
|
|
Total shareholders’ equity
|
1,159,407,737.30
|
1,061,732,782.24
|
830,014,992.05
|
140,134,340.67
|
|
|
Total liabilities and shareholders’ equity
|
1,959,364,352.15
|
1,648,758,054.75
|
1,230,669,669.67
|
592,229,361.01
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
|
I. Operating income
|
601,261,596.98
|
961,184,814.25
|
727,990,275.70
|
538,268,092.74
|
|
|
Less: operating cost
|
362,831,583.06
|
568,943,512.84
|
415,095,559.79
|
307,096,125.81
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Taxes and surcharges
|
325,206.31
|
816,664.08
|
647,614.16
|
421,488.03
|
|
|
Selling expenses
|
46,610,151.45
|
63,143,119.47
|
59,017,992.96
|
58,120,402.63
|
|
|
Administrative expenses
|
31,989,964.25
|
51,230,844.57
|
27,274,443.41
|
18,028,288.17
|
|
|
Research and development expenses
|
103,610,022.53
|
123,002,633.42
|
89,291,097.73
|
75,582,755.94
|
|
|
Financial expenses
|
5,961,283.93
|
29,485,652.13
|
-3,651,805.80
|
-833,760.93
|
|
|
Including: Interest expenses
|
3,559,037.06
|
5,695,655.54
|
7,447,466.67
|
5,047,846.77
|
|
|
Interest income
|
1,353,139.70
|
3,532,267.65
|
1,562,504.19
|
632,774.75
|
|
|
Add: Other income
|
28,314,811.54
|
25,929,804.09
|
26,715,646.95
|
20,876,330.34
|
|
|
Investment income (“-” for loss)
|
-929,330.51
|
1,284,412.23
|
1,240,299.89
|
-10,247.91
|
|
|
Including: investment income from associated enterprises and joint ventures
|
94,238.28
|
-230,413.80
|
-20,727.95
|
-10,247.91
|
|
|
Income from changes in fair value (“-” for loss)
|
17,707,599.83
|
86,719,932.51
|
-
|
-
|
|
|
Credit impairment losses (“-” for loss)
|
-1,972,423.73
|
4,027,112.25
|
-4,401,517.26
|
-
|
|
|
Asset impairment losses (“-” for loss)
|
215,837.60
|
-3,533,652.20
|
-788,808.94
|
-2,390,364.32
|
|
|
II. Operating profit (“-” for loss)
|
93,269,880.18
|
238,989,996.62
|
163,080,994.09
|
98,328,511.20
|
|
|
Add: Non-operating income
|
53,800.03
|
313,440.61
|
24,971.35
|
836.81
|
|
|
Less: Non-operating expenses
|
6,502.00
|
217,511.29
|
2,030,140.30
|
1,113,405.44
|
|
|
III. Total profit (“-” for total losses)
|
93,317,178.21
|
239,085,925.94
|
161,075,825.14
|
97,215,942.57
|
|
|
Less: Income tax expenses
|
3,822,149.91
|
27,536,414.23
|
20,315,527.09
|
9,361,577.74
|
|
|
IV. Net profit (“-” for net loss)
|
89,495,028.30
|
211,549,511.71
|
140,760,298.05
|
87,854,364.83
|
|
|
(I) Net profit from continuing operations (“-” for net loss)
|
89,495,028.30
|
211,549,511.71
|
140,760,298.05
|
87,854,364.83
|
|
|
(II) Net profit from discontinued operations (“-” for net loss)
|
-
|
-
|
-
|
-
|
|
|
V. Other comprehensive income, net of tax
|
|
|
|
|
|
|
(I) Other comprehensive income that cannot be reclassified to profit or loss
|
-
|
-
|
-
|
-
|
|
|
(II) Other comprehensive income to be reclassified to profit or loss
|
-
|
-
|
-
|
-
|
|
|
VI. Total comprehensive income
|
89,495,028.30
|
211,549,511.71
|
140,760,298.05
|
87,854,364.83
|
|
|
VII. Earnings per share:
|
|
|
|
||
|
(I) Basic earnings per share (RMB 1 Yuan/share)
|
-
|
-
|
-
|
-
|
|
|
(II) Diluted earnings per share (RMB 1 Yuan/share)
|
-
|
-
|
-
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||
|
I. Cash flows from operating activities
|
|||||
|
Cash received from sales of goods or rendering of services
|
674,152,455.59
|
905,529,938.40
|
603,269,257.85
|
461,257,053.63
|
|
|
Refunds of taxes received
|
46,694,868.17
|
45,064,618.95
|
51,415,157.90
|
31,616,948.86
|
|
|
Cash received relating to other operating activities
|
6,970,553.52
|
51,845,877.86
|
31,998,311.79
|
4,284,153.45
|
|
|
Subtotal of cash inflows from operating activities
|
727,817,877.28
|
1,002,440,435.21
|
686,682,727.54
|
497,158,155.94
|
|
|
Cash paid for goods and services
|
544,285,889.99
|
835,714,229.81
|
544,449,905.39
|
399,376,146.95
|
|
|
Cash paid to and on behalf of employees
|
91,259,213.40
|
88,771,965.75
|
74,857,899.56
|
52,924,907.19
|
|
|
Cash paid for all types of taxes
|
4,332,855.32
|
34,754,163.67
|
8,584,497.05
|
294,768.20
|
|
|
Cash paid relating to other operating activities
|
92,759,747.74
|
146,005,489.74
|
104,829,026.11
|
72,855,435.20
|
|
|
Subtotal of cash outflows from operating activities
|
732,637,706.45
|
1,105,245,848.97
|
732,721,328.11
|
525,451,257.54
|
|
|
Net cash flows from operating activities
|
-4,819,829.17
|
-102,805,413.76
|
-46,038,600.57
|
-28,293,101.60
|
|
|
II. Cash flows from investing activities
|
|||||
|
Cash received from return of investemnt
|
-
|
209,416,700.00
|
-
|
-
|
|
|
Cash received from investment
|
-
|
3,113,683.80
|
-
|
-
|
|
|
Net cash received from disposal of fixed assets, intangible assets and other long-term assets
|
-
|
-
|
2,350.00
|
8,200.00
|
|
|
Subtotal of cash inflows from investing activities
|
-
|
212,530,383.80
|
2,350.00
|
8,200.00
|
|
|
Cash paid for acquisition and construction of fixed assets, intangible assets and other long-term assets
|
16,262,511.53
|
30,771,139.33
|
8,832,529.79
|
14,288,397.74
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Cash paid for investment
|
-
|
120,943,300.00
|
188,852,600.00
|
-
|
|
|
Net cash paid by acquisition of subsidiaries and other business units
|
-
|
26,541,650.00
|
31,750,000.00
|
-
|
|
|
Cash paid relating to other investing activities
|
6,023,000.00
|
202,959,000.00
|
-
|
-
|
|
|
Subtotal of cash outflows from investing activities
|
22,285,511.53
|
381,215,089.33
|
229,435,129.79
|
14,288,397.74
|
|
|
Net cash flows from investing activities
|
-22,285,511.53
|
-168,684,705.53
|
-229,432,779.79
|
-14,280,197.74
|
|
|
III. Cash flows from financing activities
|
|
||||
|
Cash received from investment absorption
|
-
|
-
|
560,661,364.69
|
-
|
|
|
Cash received from borrowings
|
124,167,819.86
|
211,637,518.99
|
128,873,975.15
|
121,295,620.60
|
|
|
Cash received from other financing activities
|
-
|
-
|
-
|
-
|
|
|
Subtotal of cash inflows from financing activities
|
124,167,819.86
|
211,637,518.99
|
689,535,339.84
|
121,295,620.60
|
|
|
Cash paid for debt repayment
|
141,564,178.66
|
131,990,016.88
|
97,735,510.19
|
89,760,000.00
|
|
|
Cash paid for distribution of dividends or profits and for interest expenses
|
3,883,120.03
|
5,925,180.25
|
6,624,389.84
|
2,640,570.32
|
|
|
Cash paid relating to other financing activities
|
7,361,484.15
|
12,286,460.98
|
49,994,239.02
|
-
|
|
|
Subtotal of cash outflows from financing activities
|
152,808,782.84
|
150,201,658.11
|
154,354,139.05
|
92,400,570.32
|
|
|
Net cash flows from financing activities
|
-28,640,962.98
|
61,435,860.88
|
535,181,200.79
|
28,895,050.28
|
|
|
IV. Effect of foreign exchange rate changes on cash and cash equivalents
|
-14,461.69
|
-909,453.72
|
-143,319.80
|
-610,879.68
|
|
|
V. Net increase in cash and cash equivalents
|
-55,760,765.37
|
-210,963,712.13
|
259,566,500.63
|
-14,289,128.74
|
|
|
Add: Cash and cash equivalents at beginning of period/year
|
75,817,949.02
|
286,781,661.15
|
27,215,160.52
|
41,504,289.26
|
|
|
VI. Cash and cash equivalents at end of period/year
|
20,057,183.65
|
75,817,949.02
|
286,781,661.15
|
27,215,160.52
|
|
Name of subsidiary
|
Shareholding
ratio
|
Whether it is included in the scope of consolidated financial statements
|
|||
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||
|
ACM Wuxi
|
100%
|
Yes
|
Yes
|
Yes
|
Yes
|
|
Shengwei Shanghai
|
100%
|
Yes
|
Yes
|
Yes
|
N/A
|
|
CleanChip HK
|
100%
|
Yes
|
Yes
|
Yes
|
Yes
|
|
ACMKR
|
100%
|
Yes
|
Yes
|
Yes
|
Yes
|
|
ACM CA
|
100%
|
Yes
|
Yes
|
Yes
|
N/A
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Aging
|
Provision rate for the accounts receivables (%)
|
||
|
Within 1 year (including 1 year)
|
1 or 5
|
||
|
Including: within 6 months
|
1
|
||
|
7-12 months
|
5
|
||
|
1-2 years (including 2 years)
|
10
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
2-3 years (including 3 years)
|
20
|
|
3-4 years (including 4 years)
|
25
|
|
4-5 years (including 5 years)
|
30
|
|
More than 5 years
|
100
|
|
Basis for determining group
|
|
|
Group by Aging
|
Divide the group based on Aging of receivables as credit risk characteristics
|
|
Other Group
|
Accounts receivables with very low credit risk, such as accounts receivables, export tax refund of value-added tax receivable, petty cash, deposit and margin, which final customers have paid to related
parties at the end of the period and then related parties have paid to the Company after the period
|
|
Provision method for receivables with allowances for bad debts in the group with identical credit risk characteristics
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Group by Aging
|
|
|
Other Group
|
According to the actual loss rate of previous years and the current situation, there is generally no allowances for bad debts
|
|
Aging
|
Provision rate for the accounts
receivables (%)
|
Provision rate for other receivables (%)
|
|
Within 1 year (inclusive)
|
1 or 5
|
5
|
|
Including: within 6 months
|
1
|
5
|
|
7-12 months
|
5
|
5
|
|
1-2 years (including 2 years)
|
10
|
10
|
|
2-3 years (including 3 years)
|
20
|
20
|
|
3-4 years (including 4 years)
|
25
|
25
|
|
4-5 years (including 5 years)
|
30
|
30
|
|
More than 5 years
|
100
|
100
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Category
|
Depreciation method
|
Depreciation life
(year) |
Residual value
rate (%)
|
Annual
depreciation rate
(%)
|
||||
|
Machinery equipment
|
Straight-line Method
|
5–10
|
5
|
9.50 ~ 19.00
|
||||
|
Computer and electronic equipment
|
Straight-line Method
|
3–5
|
5
|
19.00 ~ 31.67
|
||||
|
office equipment
|
Straight-line Method
|
5
|
5
|
19.00
|
||||
|
Transportation equipment
|
Straight-line Method
|
4–5
|
5
|
19.00 ~ 23.75
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Expected useful life
|
Amortization method
|
Basis
|
|
Land use rights
|
50 years
|
Straight-line method
|
Expected beneficial life
|
|
Software
|
2-10 years
|
Straight-line method
|
Expected beneficial life
|
|
Patented technology
|
10 years
|
Straight-line method
|
Expected beneficial life
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(IX)
|
Revenue
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(X)
|
Contract cost
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(XI)
|
Government grants
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(XII)
|
Share-based payments
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(XIII)
|
Foreign currency transactions and foreign currency translation
|
|
(XIV)
|
Deferred income tax assets and liabilities
|
|
(XV)
|
Changes in significant accounting policies and accounting estimates
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
VII.
|
Applicable Tax Rate and Main Fiscal and Tax Preferential Policies
|
|
(I)
|
Main taxes and tax rates
|
|
Taxes
|
Base of Taxation
|
Tax Rates
|
|||
|
From Jan.
to Jun. 2021
|
2020
|
2019
|
2018
|
||
|
Value-added Tax
|
The difference between output VAT calculated on the basis of the income from sales of goods and taxable services calculated in accordance with the provisions of tax law in China and input
Tax allowed to be credited in the current period
|
6%
13%
|
6%
13%
|
6%
13%
16%
|
6%
16%
17%
|
|
Urban Maintenance and Construction Tax
|
Amounts of actually paid value-added tax
|
1%
7%
|
1%
7%
|
1%
7%
|
1%
7%
|
|
Education surcharges
|
Amounts of actually paid value-added tax
|
3%
|
3%
|
3%
|
3%
|
|
Local Education Surcharges
|
Amounts of actually paid value-added tax
|
2%
|
2%
|
1%
2%
|
1%
2%
|
|
Corporate Income Tax
|
Taxable income
|
12.5%
10%
25%
16.5%
21%
|
15%
10%
25%
16.5%
21%
|
15%
10%
25%
16.5%
21%
|
15%
10%
25%
16.5%
|
|
Name of Taxpayer
|
Place of
Registration
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
ACMSH
|
Mainland China
|
12.5%
|
15%
|
15%
|
15%
|
|
ACM Wuxi
|
Mainland China
|
25%
|
25%
|
25%
|
25%
|
|
CleanChip HK
|
Hong Kong, China
|
16.5%
|
16.5%
|
16.5%
|
16.5%
|
|
ACMKR
|
The Republic of Korea
|
10%
|
10%
|
10%
|
10%
|
|
ACM CA
|
USA
|
21%
|
21%
|
21%
|
N/A
|
|
Shengwei Shanghai
|
Mainland China
|
25%
|
25%
|
25%
|
N/A
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(II)
|
Tax preference
|
|
VIII.
|
Segment Information
|
|
IX.
|
Non-recurring Profits or Losses
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(I)
|
Details and amounts of non-recurring profits or losses
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
Profits or losses on disposal of non-current assets
|
-
|
-16.83
|
-202.85
|
-1.47
|
|
Government grants recorded to profit or loss for the period (closely related to the business of the enterprise, except for the government grants according to the unified national standard quota or
quantitative)
|
2,791.61
|
2,592.98
|
2,666.69
|
2,082.34
|
|
Fund occupation fee charged to non-financial enterprises recorded to the current profit or loss
|
-
|
12.84
|
53.87
|
44.54
|
|
The net profit or loss for the period from the beginning of the period to the combination date of subsidiaries from business combination involving enterprises under common control
|
-
|
-
|
-1,054.11
|
394.41
|
|
Profit or loss from changes in fair value arising from the holding of held-for-trading financial assets, derivative financial assets, held-for-trading financial liabilities and derivative financial
liabilities, as well as the investment income from disposal of held-for-trading financial assets, derivative financial assets, held-for-trading financial liabilities, derivative financial liabilities and other debt investments, except
the effective hedging business related to the normal business of the Company
|
1,770.76
|
8,671.99
|
-
|
-
|
|
Other non-operating income and expenditure other than the above items
|
61.26
|
47.97
|
2.39
|
-109.79
|
|
Other profit or loss items that meet the definition of non-recurring profits or losses
|
39.88
|
971.92
|
-647.47
|
5.30
|
|
Subtotal
|
4,663.50
|
12,280.88
|
818.51
|
2,415.32
|
|
Impact on the income tax
|
-581.56
|
-1,847.66
|
-377.28
|
-302.34
|
|
Impact on the minority interests (after tax)
|
-
|
-
|
-
|
-
|
|
Net non-recurring profits or losses attributable to shareholders of the parent company
|
4,081.94
|
10,433.21
|
441.23
|
2,112.98
|
|
(II)
|
Impact of non-recurring profits or losses on current operating results
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
Net non-recurring profits or losses attributable to shareholders of the parent company
|
4,081.94
|
10,433.21
|
441.23
|
2,112.98
|
|
Net profits attributable to shareholders of the parent company
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net profits attributable to shareholders of the parent company after deduction of non-recurring profits or losses
|
4,885.66
|
9,243.78
|
13,047.50
|
7,140.06
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
X.
|
Main Financial Indicators
|
|
Main financial indicators
|
June 30, 2021
|
December 31, 2020
|
December 31,
2019
|
December 31,
2018
|
|
Current ratio (frequency)
|
1.93
|
2.39
|
2.93
|
1.34
|
|
Quick ratio (frequency)
|
0.94
|
1.36
|
2.18
|
0.71
|
|
Liabilities to assets (L/A) ratio (parent company)
|
40.83%
|
35.60%
|
32.56%
|
76.34%
|
|
Net assets per share attributable to shareholders of the issuer (RMB 1 Yuan)
|
2.94
|
2.69
|
2.13
|
N/A
|
|
Main financial indicators
|
2021
|
2020
|
2019
|
2018
|
|
Accounts receivables turnover ratio (frequency)
|
2.15
|
4.19
|
3.80
|
3.91
|
|
Inventory turnover rate (frequency)
|
0.46
|
1.21
|
1.44
|
1.51
|
|
EBITDA (RMB 10,000 Yuan)
|
10,398.61
|
23,752.53
|
16,654.67
|
11,063.48
|
|
Net profits attributable to shareholders of the issuer (RMB 10,000 Yuan)
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net profits attributable to shareholders of the issuer after deduction of non-recurring profits or losses (RMB 10,000 Yuan)
|
4,885.66
|
9,243.78
|
13,047.50
|
7,140.06
|
|
Times interest earned (frequency)
|
31.70
|
36.43
|
21.54
|
21.37
|
|
Proportion of R&D investment in operating income
|
18.33%
|
13.97%
|
13.12%
|
14.43%
|
|
Cash flows from operating activities per share (RMB 1 Yuan/share)
|
0.10
|
-0.23
|
0.19
|
N/A
|
|
Net cash flows per share (RMB 1 Yuan/share)
|
-0.04
|
-0.43
|
0.88
|
N/A
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(II)
|
ROE and earnings per share
|
|
Profit in the Reporting
Period
|
Reporting Period
|
Weighted average
ROE (%)
|
Earnings per share (RMB 1 Yuan/share)
|
|
|
Basic earnings per
share
|
Diluted earnings per
share
|
|||
|
Net profits attributable to common shareholders of the Company
|
From Jan. to Jun. 2021
|
8.20
|
0.23
|
0.23
|
|
2020
|
21.20
|
0.50
|
0.50
|
|
|
2019
|
34.22
|
0.36
|
0.36
|
|
|
2018
|
137.72
|
N/A
|
N/A
|
|
|
Net profits attributable to common shareholders after deduction of non-recurring profits or losses
|
From Jan. to Jun. 2021
|
4.47
|
0.13
|
0.13
|
|
2020
|
9.96
|
0.24
|
0.24
|
|
|
2019
|
30.67
|
0.32
|
0.32
|
|
|
2018
|
115.54
|
N/A
|
N/A
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
XI.
|
Operating Results Analysis
|
|
(I)
|
Changes in the Company’s main operating results during the Reporting Period
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
Operating income
|
62,528.08
|
100,747.18
|
75,673.30
|
55,026.91
|
|
Operating profit
|
9,263.97
|
22,271.03
|
15,511.67
|
10,389.25
|
|
Total profit
|
9,325.23
|
22,302.41
|
15,311.91
|
10,283.17
|
|
Net profit
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net profits attributable to shareholders of the parent company
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net profits attributable to shareholders of the parent company after deduction of non-recurring profits or losses
|
4,885.66
|
9,243.78
|
13,047.50
|
7,140.06
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(II)
|
Operating income analysis
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
% |
Amount
|
Proportion
%
|
Amount
|
Proportion
%
|
Amount
|
Proportion
%
|
|
|
Main operating income
|
58,804.77
|
94.05%
|
97,532.78
|
96.81%
|
74,340.81
|
98.24%
|
53,961.17
|
98.06%
|
|
Other operating income
|
3,723.30
|
5.95%
|
3,214.40
|
3.19%
|
1,332.48
|
1.76%
|
1,065.74
|
1.94%
|
|
Total
|
62,528.08
|
100.00%
|
100,747.18
|
100.00%
|
75,673.30
|
100.00%
|
55,026.91
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
%
|
Amount
|
Proportion
%
|
Amount
|
Proportion
%
|
Amount
|
Proportion
%
|
|
|
Semiconductor cleaning equipment
|
48,900.39
|
83.16%
|
81,627.25
|
83.69%
|
62,522.30
|
84.10%
|
50,135.96
|
92.91%
|
|
Including: single wafer cleaning equipment
|
43,884.74
|
74.63%
|
71,610.80
|
73.42%
|
55,099.52
|
74.12%
|
50,135.96
|
92.91%
|
|
Wet bench cleaning equipment
|
5,015.65
|
8.53%
|
3,310.85
|
3.39%
|
4,801.36
|
6.46%
|
-
|
-
|
|
Single wafer wet bench combined cleaning equipment
|
-
|
-
|
6,705.60
|
6.88%
|
2,621.43
|
3.53%
|
-
|
-
|
|
Semiconductor electroplating equipment
|
3,591.85
|
6.11%
|
5,290.13
|
5.42%
|
7,857.39
|
10.57%
|
1,191.13
|
2.21%
|
|
Advanced packaging wet process equipment
|
6,312.54
|
10.73%
|
9,856.51
|
10.11%
|
3,961.12
|
5.33%
|
2,634.07
|
4.88%
|
|
Vertical furnace tube equipment
|
-
|
-
|
758.90
|
0.78%
|
-
|
-
|
-
|
-
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
|
Single wafer cleaning equipment
|
|||||
|
Sales volume
|
Quantity (per piece)
|
21
|
31
|
22
|
21
|
|
Change ratio
|
-
|
40.91%
|
4.76%
|
90.91%
|
|
|
Unit price
|
Average price (RMB 10,000 Yuan/piece)
|
2,089.75
|
2,310.03
|
2,504.52
|
2,387.43
|
|
Change ratio
|
-9.54%
|
-7.77%
|
4.90%
|
22.19%
|
|
|
Sales revenue
|
Amount
(RMB 10,000 Yuan)
|
43,884.74
|
71,610.80
|
55,099.52
|
50,135.96
|
|
Change ratio
|
-
|
29.97%
|
9.90%
|
133.27%
|
|
|
Wet bench cleaning equipment
|
|||||
|
Sales volume
|
Quantity (per piece)
|
3
|
2
|
3
|
-
|
|
Change ratio
|
-
|
-33.33%
|
-
|
-
|
|
|
Unit price
|
Average price (RMB 10,000 Yuan/piece)
|
1,671.88
|
1,655.43
|
1,600.45
|
-
|
|
Change ratio
|
0.99%
|
3.43%
|
-
|
-
|
|
|
Sales revenue
|
Amount
(RMB 10,000 Yuan)
|
5,015.65
|
3,310.85
|
4,801.36
|
-
|
|
Change ratio
|
-
|
-31.04%
|
-
|
-
|
|
|
Single wafer wet bench combined cleaning equipment
|
|||||
|
Sales volume
|
Quantity (per piece)
|
-
|
2
|
1
|
-
|
|
Change ratio
|
-
|
100.00%
|
-
|
-
|
|
|
Unit price
|
Average price (RMB 10,000 Yuan/piece)
|
-
|
3,352.80
|
2,621.43
|
-
|
|
Change ratio
|
-
|
27.90%
|
-
|
-
|
|
|
Sales revenue
|
Amount
(RMB 10,000 Yuan)
|
-
|
6,705.60
|
2,621.43
|
-
|
|
Change ratio
|
-
|
155.80%
|
-
|
-
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
|
Sales volume
|
Quantity (per piece)
|
2
|
4
|
4
|
1
|
|
Change ratio
|
-
|
0.00%
|
300.00%
|
-
|
|
|
Unit price
|
Average price (RMB 10,000 Yuan/piece)
|
1,795.93
|
1,322.53
|
1,964.35
|
1,191.13
|
|
Change ratio
|
35.80%
|
-32.67%
|
64.91%
|
||
|
Sales revenue
|
Amount
(RMB 10,000 Yuan)
|
3,591.85
|
5,290.13
|
7,857.39
|
1,191.13
|
|
Change ratio
|
-
|
-32.67%
|
559.66%
|
-
|
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
|
Sales volume
|
Quantity (per piece)
|
14.00
|
20
|
7
|
6
|
|
Change ratio
|
-
|
185.71%
|
16.67%
|
-14.29%
|
|
|
Unit price
|
Average price (RMB 10,000 Yuan/piece)
|
450.90
|
492.83
|
565.87
|
439.01
|
|
Change ratio
|
-8.51%
|
-12.91%
|
28.90%
|
-10.18%
|
|
|
Sales revenue
|
Amount
(RMB 10,000 Yuan)
|
6,312.54
|
9,856.51
|
3,961.12
|
2,634.07
|
|
Change ratio
|
-
|
148.83%
|
50.38%
|
-23.01%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun.
2021
|
2020
|
2019
|
2018
|
|
|
Sales volume
|
Quantity (per piece)
|
-
|
1
|
-
|
-
|
|
Change ratio
|
-
|
-
|
-
|
-
|
|
|
Unit price
|
Average price (RMB 10,000 Yuan/piece)
|
-
|
758.90
|
-
|
-
|
|
Change ratio
|
-
|
-
|
-
|
-
|
|
|
Sales revenue
|
Amount
(RMB 10,000 Yuan)
|
-
|
758.90
|
-
|
-
|
|
Change ratio
|
-
|
-
|
-
|
-
|
|
|
Sales region
|
Location of ultimate customer
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
||
|
Export sales
|
Overseas countries or regions
|
-
|
-
|
1,290.86
|
1.32%
|
2,613.69
|
3.52%
|
3,443.94
|
6.38%
|
|
Domestic bonded areas
|
Mainland China
|
48,410.23
|
82.32%
|
96,241.93
|
98.68%
|
71,727.12
|
96.48%
|
49,639.75
|
91.99%
|
|
Home sales
|
Mainland China
|
10,394.54
|
17.68%
|
-
|
-
|
-
|
877.48
|
1.63%
|
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Regions
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Mainland China
|
58,804.77
|
100.00%
|
96,241.93
|
98.68%
|
71,727.12
|
96.48%
|
50,517.23
|
93.62%
|
|
Taiwan
|
-
|
-
|
-
|
-
|
2,613.69
|
3.52%
|
496.31
|
0.92%
|
|
South Korea
|
-
|
-
|
-
|
-
|
-
|
-
|
2,494.67
|
4.62%
|
|
Philippines
|
-
|
-
|
444.90
|
0.46%
|
-
|
-
|
452.97
|
0.84%
|
|
USA
|
-
|
-
|
845.96
|
0.87%
|
-
|
-
|
-
|
-
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
Quarters
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
1st quarter
|
25,732.14
|
43.76%
|
13,446.31
|
13.79%
|
9,682.43
|
13.02%
|
3,721.39
|
6.90%
|
|
2nd quarter
|
33,072.63
|
56.24%
|
20,992.28
|
21.52%
|
19,613.53
|
26.38%
|
14,060.04
|
26.06%
|
|
3rd quarter
|
-
|
-
|
26,362.03
|
27.03%
|
27,445.54
|
36.92%
|
11,587.61
|
21.47%
|
|
4th quarter
|
-
|
-
|
36,732.16
|
37.66%
|
17,599.30
|
23.67%
|
24,592.12
|
45.57%
|
|
Total
|
58,804.77
|
100.00%
|
97,532.78
|
100.00%
|
74,340.81
|
100.00%
|
53,961.17
|
100.00%
|
|
(III)
|
Operating cost analysis
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Main operating cost
|
34,951.94
|
96.97%
|
55,932.96
|
98.75%
|
41,134.20
|
99.08%
|
30,324.39
|
98.75%
|
|
Other operating costs
|
1,090.46
|
3.03%
|
709.28
|
1.25%
|
381.64
|
0.92%
|
385.22
|
1.25%
|
|
Total
|
36,042.40
|
100.00%
|
56,642.24
|
100.00%
|
41,515.84
|
100.00%
|
30,709.61
|
100.00%
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Semiconductor cleaning equipment
|
27,080.84
|
77.48%
|
44,887.96
|
80.25%
|
34,171.81
|
83.07%
|
27,823.44
|
91.75%
|
|
Including: single wafer cleaning equipment
|
23,566.22
|
67.42%
|
38,736.48
|
69.26%
|
29,775.66
|
72.39%
|
27,823.44
|
91.75%
|
|
Wet bench cleaning equipment
|
3,514.62
|
10.06%
|
2,163.51
|
3.87%
|
3,050.71
|
7.42%
|
-
|
-
|
|
Single wafer wet bench combined cleaning equipment
|
-
|
-
|
3,987.97
|
7.13%
|
1,345.44
|
3.27%
|
-
|
-
|
|
Semiconductor electroplating equipment
|
2,528.96
|
7.24%
|
3,986.22
|
7.13%
|
4,773.22
|
11.60%
|
992.43
|
3.27%
|
|
Advanced packaging wet process equipment
|
5,342.13
|
15.28%
|
6,497.95
|
11.62%
|
2,189.17
|
5.32%
|
1,508.52
|
4.97%
|
|
Vertical furnace tube equipment
|
-
|
-
|
560.83
|
1.00%
|
-
|
-
|
-
|
-
|
|
Total
|
34,951.94
|
100.00%
|
55,932.96
|
100.00%
|
41,134.20
|
100.00%
|
30,324.39
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Direct materials
|
32,345.22
|
92.54%
|
52,842.53
|
94.47%
|
38,418.92
|
93.40%
|
28,595.15
|
94.30%
|
|
Direct labor costs
|
817.99
|
2.34%
|
1,091.96
|
1.95%
|
905.50
|
2.20%
|
600.52
|
1.98%
|
|
Manufacturing expenses
|
1,788.73
|
5.12%
|
1,998.46
|
3.57%
|
1,809.78
|
4.40%
|
1,128.72
|
3.72%
|
|
Total
|
34,951.94
|
100.00%
|
55,932.96
|
100.00%
|
41,134.20
|
100.00%
|
30,324.39
|
100.00%
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Outsourcing processing fee
|
350.98
|
19.62%
|
400.96
|
20.06%
|
691.65
|
38.22%
|
417.71
|
37.01%
|
|
Factory rental fee
|
263.12
|
14.71%
|
590.02
|
29.52%
|
511.73
|
28.28%
|
490.10
|
43.42%
|
|
Indirect labor cost
|
284.01
|
15.88%
|
522.62
|
26.15%
|
443.78
|
24.52%
|
295.15
|
26.15%
|
|
Other
|
890.63
|
49.79%
|
484.86
|
24.26%
|
162.62
|
8.98%
|
-74.24
|
-6.58%
|
|
Total
|
1,788.73
|
100.00%
|
1,998.46
|
100.00%
|
1,809.78
|
100.00%
|
1,128.72
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(IV)
|
Gross margin analysis
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
||||
|
Amount
|
Contribution level
|
Gross profit margin
|
Amount
|
Contribution level
|
Gross profit margin
|
|
|
Main business
|
23,852.83
|
90.06%
|
40.56%
|
41,599.82
|
94.32%
|
42.65%
|
|
Other business
|
2,632.84
|
9.94%
|
70.71%
|
2,505.12
|
5.68%
|
77.93%
|
|
Total
|
26,485.68
|
100.00%
|
42.36%
|
44,104.94
|
100.00%
|
43.78%
|
|
Item
|
2019
|
2018
|
||||
|
Amount
|
Contribution level
|
Gross profit margin
|
Amount
|
Contribution level
|
Gross profit margin
|
|
|
Main business
|
33,206.61
|
97.22%
|
44.67%
|
23,636.78
|
97.20%
|
43.80%
|
|
Other business
|
950.85
|
2.78%
|
71.36%
|
680.52
|
2.80%
|
63.85%
|
|
Total
|
34,157.46
|
100.00%
|
45.14%
|
24,317.29
|
100.00%
|
44.19%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
||||
|
Gross profit amount
|
Gross Profit Margin
|
Proportion of income
|
Gross profit amount
|
Gross Profit Margin
|
Proportion of income
|
|
|
Semiconductor cleaning equipment
|
21,819.55
|
44.62%
|
83.16%
|
36,739.29
|
45.01%
|
83.69%
|
|
Including: single wafer cleaning equipment
|
20,318.52
|
46.30%
|
74.63%
|
32,874.32
|
45.91%
|
73.42%
|
|
Wet bench cleaning equipment
|
1,501.03
|
29.93%
|
8.53%
|
1,147.34
|
34.65%
|
3.39%
|
|
Single wafer wet bench combined cleaning equipment
|
-
|
-
|
-
|
2,717.63
|
40.53%
|
6.88%
|
|
Semiconductor electroplating equipment
|
1,062.89
|
29.59%
|
6.11%
|
1,303.91
|
24.65%
|
5.42%
|
|
Advanced packaging wet process equipment
|
970.41
|
15.37%
|
10.73%
|
3,358.56
|
34.07%
|
10.11%
|
|
Vertical furnace tube equipment
|
-
|
-
|
-
|
198.06
|
26.10%
|
0.78%
|
|
Total
|
23,852.83
|
40.56%
|
100.00%
|
41,599.82
|
42.65%
|
100.00%
|
|
Item
|
2019
|
2018
|
||||
|
Gross profit amount
|
Gross Profit Margin
|
Proportion of income
|
Gross profit amount
|
Gross Profit Margin
|
Proportion of income
|
|
|
Semiconductor cleaning equipment
|
28,350.49
|
45.34%
|
84.10%
|
22,312.53
|
44.50%
|
92.91%
|
|
Including: single wafer cleaning equipment
|
25,323.86
|
45.96%
|
74.12%
|
22,312.53
|
44.50%
|
92.91%
|
|
Wet bench cleaning equipment
|
1,750.64
|
36.46%
|
6.46%
|
-
|
-
|
-
|
|
Single wafer wet bench combined cleaning equipment
|
1,275.99
|
48.68%
|
3.53%
|
-
|
-
|
-
|
|
Semiconductor electroplating equipment
|
3,084.18
|
39.25%
|
10.57%
|
198.70
|
16.68%
|
2.21%
|
|
Advanced packaging wet process equipment
|
1,771.95
|
44.73%
|
5.33%
|
1,125.55
|
42.73%
|
4.88%
|
|
Vertical furnace tube equipment
|
-
|
-
|
-
|
-
|
-
|
-
|
|
Total
|
33,206.61
|
44.67%
|
100.00%
|
23,636.78
|
43.80%
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Company Name
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
NAURA
|
43.15%
|
36.69%
|
40.53%
|
38.38%
|
|
AMEC
|
42.34%
|
37.67%
|
34.93%
|
35.50%
|
|
KINGSEMI
|
40.76%
|
42.58%
|
46.62%
|
46.49%
|
|
HZCCTECH
|
53.70%
|
50.11%
|
51.15%
|
55.60%
|
|
Average value
|
44.99%
|
41.76%
|
43.31%
|
43.99%
|
|
The Company
|
40.56%
|
42.65%
|
44.67%
|
43.80%
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount (RMB 10,000 Yuan)
|
Proportion in operating income
|
Amount (RMB 10,000 Yuan)
|
Proportion in operating income
|
Amount (RMB 10,000 Yuan)
|
Proportion in operating income
|
Amount (RMB 10,000 Yuan)
|
Proportion in operating income
|
|
|
Selling expenses
|
6,551.70
|
10.48%
|
10,563.95
|
10.49%
|
8,475.49
|
11.20%
|
6,004.69
|
10.91%
|
|
Administrative expenses
|
2,927.51
|
4.68%
|
5,031.89
|
4.99%
|
3,029.73
|
4.00%
|
2,040.41
|
3.71%
|
|
Financial expenses
|
580.66
|
0.93%
|
3,237.14
|
3.21%
|
-357.79
|
-0.47%
|
-251.46
|
-0.46%
|
|
R&D expenses
|
11,460.28
|
18.33%
|
14,079.11
|
13.97%
|
9,926.80
|
13.12%
|
7,941.50
|
14.43%
|
|
Total
|
21,520.15
|
34.42%
|
32,912.10
|
32.67%
|
21,074.23
|
27.85%
|
15,735.13
|
28.60%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Sales commission
|
2,221.47
|
33.91%
|
4,046.99
|
38.31%
|
2,761.73
|
32.58%
|
1,931.14
|
32.16%
|
|
Employee benefits
|
1,704.87
|
26.02%
|
2,499.05
|
23.66%
|
1,945.09
|
22.95%
|
1,036.01
|
17.25%
|
|
After sales service fee
|
798.80
|
12.19%
|
1,167.85
|
11.06%
|
1,360.12
|
16.05%
|
1,174.57
|
19.56%
|
|
Installation and service fee
|
63.35
|
0.97%
|
601.01
|
5.69%
|
820.50
|
9.68%
|
665.92
|
11.09%
|
|
Travel expenses
|
347.37
|
5.30%
|
492.76
|
4.66%
|
436.99
|
5.16%
|
316.84
|
5.28%
|
|
Logistics and package fee
|
708.53
|
10.81%
|
477.22
|
4.52%
|
380.01
|
4.48%
|
276.08
|
4.60%
|
|
Share-based payment
|
267.03
|
4.08%
|
465.69
|
4.41%
|
219.09
|
2.58%
|
77.79
|
1.30%
|
|
Business entertainment
|
207.68
|
3.17%
|
252.39
|
2.39%
|
204.99
|
2.42%
|
238.93
|
3.98%
|
|
Exhibition advertising fee
|
85.14
|
1.30%
|
59.97
|
0.57%
|
112.78
|
1.33%
|
84.95
|
1.41%
|
|
Office expenses
|
13.23
|
0.20%
|
14.05
|
0.13%
|
11.02
|
0.13%
|
42.38
|
0.71%
|
|
Rental fee
|
10.53
|
0.16%
|
67.95
|
0.64%
|
96.91
|
1.14%
|
58.72
|
0.98%
|
|
Depreciation charge
|
17.74
|
0.27%
|
8.60
|
0.08%
|
5.04
|
0.06%
|
3.16
|
0.05%
|
|
Other
|
105.95
|
1.62%
|
410.43
|
3.89%
|
121.23
|
1.43%
|
98.18
|
1.64%
|
|
Total
|
6,551.70
|
100.00%
|
10,563.95
|
100.00%
|
8,475.49
|
100.00%
|
6,004.69
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Company name
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Operating income
|
Sales expense rate
|
Operating income
|
Sales expense rate
|
Operating income
|
Sales expense rate
|
Operating income
|
Sales expense rate
|
|
|
NAURA
|
360,835.87
|
6.14%
|
605,604.30
|
5.84%
|
405,831.29
|
5.87%
|
332,385.10
|
5.08%
|
|
AMEC
|
133,862.77
|
11.00%
|
227,329.19
|
10.41%
|
194,694.93
|
10.12%
|
163,928.83
|
13.21%
|
|
KINGSEMI
|
35,090.80
|
8.66%
|
32,890.02
|
11.34%
|
21,315.67
|
9.67%
|
20,999.05
|
8.24%
|
|
HZCCTECH
|
67,328.38
|
9.91%
|
80,382.93
|
10.90%
|
39,883.41
|
13.59%
|
21,612.15
|
14.40%
|
|
Average value
|
149,279.46
|
8.93%
|
236,551.61
|
9.62%
|
165,431.32
|
9.81%
|
134,731.28
|
10.23%
|
|
The Company
|
62,528.08
|
10.48%
|
100,747.18
|
10.49%
|
75,673.30
|
11.20%
|
55,026.91
|
10.91%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Employee benefits
|
1,307.39
|
44.66%
|
1,921.12
|
38.18%
|
1,219.20
|
40.24%
|
840.52
|
41.19%
|
|
Intermediary fee
|
195.79
|
6.69%
|
411.44
|
8.18%
|
374.17
|
12.35%
|
189.65
|
9.29%
|
|
Consulting service fee
|
434.88
|
14.85%
|
508.66
|
10.11%
|
371.33
|
12.26%
|
213.08
|
10.44%
|
|
Rental fee
|
179.28
|
6.12%
|
411.05
|
8.17%
|
294.72
|
9.73%
|
301.11
|
14.76%
|
|
Share-based payment
|
211.59
|
7.23%
|
1,011.58
|
20.10%
|
248.18
|
8.19%
|
106.27
|
5.21%
|
|
Business entertainment
|
100.57
|
3.44%
|
162.58
|
3.23%
|
121.17
|
4.00%
|
59.16
|
2.90%
|
|
Travel expenses
|
77.52
|
2.65%
|
127.21
|
2.53%
|
127.28
|
4.20%
|
126.15
|
6.18%
|
|
Office expenses
|
146.05
|
4.99%
|
242.79
|
4.83%
|
91.07
|
3.01%
|
81.55
|
4.00%
|
|
Depreciation and amortization
|
243.02
|
8.30%
|
133.27
|
2.65%
|
24.24
|
0.80%
|
20.71
|
1.02%
|
|
Other
|
31.43
|
1.07%
|
102.19
|
2.03%
|
158.37
|
5.23%
|
102.21
|
5.01%
|
|
Total
|
2,927.51
|
100.00%
|
5,031.89
|
100.00%
|
3,029.73
|
100.00%
|
2,040.41
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Category
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Sales expenses
|
267.03
|
465.69
|
219.09
|
77.79
|
|
Administrative expenses
|
211.59
|
1,011.58
|
248.18
|
106.27
|
|
R&D expenses
|
329.47
|
523.19
|
752.70
|
168.81
|
|
Operation cost
|
108.89
|
120.43
|
172.28
|
46.90
|
|
Total
|
916.98
|
2,120.89
|
1,392.25
|
399.78
|
|
Company name
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
NAURA
|
11.28%
|
14.06%
|
13.75%
|
15.14%
|
|
AMEC
|
7.85%
|
6.73%
|
5.59%
|
7.96%
|
|
KINGSEMI
|
11.56%
|
17.37%
|
15.96%
|
13.61%
|
|
HZCCTECH
|
7.39%
|
10.23%
|
14.06%
|
9.43%
|
|
Average value
|
9.52%
|
12.10%
|
12.34%
|
11.54%
|
|
The Company
|
4.68%
|
4.99%
|
4.00%
|
3.71%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Employee benefits
|
4,697.70
|
40.99%
|
5,918.68
|
42.04%
|
4,731.41
|
47.66%
|
3,020.84
|
38.04%
|
|
Material consumption
|
4,772.20
|
41.64%
|
5,427.71
|
38.55%
|
2,664.11
|
26.84%
|
2,007.19
|
25.27%
|
|
Share-based payment
|
329.47
|
2.87%
|
523.19
|
3.72%
|
752.70
|
7.58%
|
168.81
|
2.13%
|
|
Travel expenses
|
451.51
|
3.94%
|
639.89
|
4.54%
|
582.91
|
5.87%
|
420.73
|
5.30%
|
|
Depreciation and amortization
|
469.35
|
4.10%
|
306.39
|
2.18%
|
267.96
|
2.70%
|
216.89
|
2.73%
|
|
Rental expenses
|
40.80
|
0.36%
|
237.92
|
1.69%
|
236.03
|
2.38%
|
224.50
|
2.83%
|
|
Service charge
|
402.05
|
3.51%
|
397.40
|
2.82%
|
215.74
|
2.17%
|
106.33
|
1.34%
|
|
Test and development expenses
|
-
|
-
|
31.74
|
0.23%
|
50.93
|
0.51%
|
1,566.36
|
19.72%
|
|
other expenses
|
297.20
|
2.59%
|
596.19
|
4.23%
|
425.01
|
4.28%
|
209.84
|
2.64%
|
|
Total
|
1
|
1
|
14,079.11
|
100.00%
|
9,926.80
|
100.00%
|
7,941.50
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Project
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
SAPS cleaning technology
|
1,365.18
|
2,204.99
|
4,215.52
|
3,482.72
|
|
ECP electrochemistry electroplating technology
|
2,021.60
|
3,633.89
|
2,144.10
|
2,187.17
|
|
WET bench cleaning technology
|
1,293.93
|
1,306.64
|
927.15
|
208.06
|
|
Backside cleaning technology
|
2,433.00
|
2,540.09
|
688.98
|
325.06
|
|
Tahoe technology
|
1,372.26
|
638.03
|
449.17
|
253.52
|
|
Furnace vertical furnace tube technology
|
763.43
|
827.79
|
422.41
|
201.38
|
|
Backend Tools advanced packaging wet process technology
|
596.66
|
1,187.62
|
395.58
|
647.67
|
|
SFP stress-free polishing technology
|
98.91
|
348.45
|
265.23
|
270.08
|
|
TEBO cleaning technology
|
158.83
|
423.29
|
259.69
|
329.10
|
|
Development and industrialization of polytetrafluoroethylene cavity manufacturing process for semiconductor equipment
|
468.51
|
9.20
|
28.13
|
13.94
|
|
Other
|
887.97
|
959.12
|
130.83
|
22.79
|
|
Total
|
11,460.28
|
14,079.11
|
9,926.80
|
7,941.50
|
|
Company name
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
NAURA
|
17.39%
|
11.07%
|
12.93%
|
10.57%
|
|
AMEC
|
12.54%
|
14.55%
|
12.00%
|
7.21%
|
|
KINGSEMI
|
14.08%
|
13.81%
|
16.45%
|
16.29%
|
|
HZCCTECH
|
21.17%
|
23.30%
|
26.82%
|
28.55%
|
|
Average value
|
16.29%
|
14.18%
|
17.05%
|
15.66%
|
|
The Company
|
18.33%
|
13.97%
|
13.12%
|
14.43%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Interest expenses
|
303.75
|
629.52
|
745.61
|
504.78
|
|
Less: interest income
|
32.68
|
270.13
|
204.64
|
63.84
|
|
Exchange gains/losses
|
286.72
|
2,841.84
|
-924.65
|
-716.95
|
|
Bank charges
|
22.87
|
35.91
|
25.89
|
24.54
|
|
Total
|
580.66
|
3,237.14
|
-357.79
|
-251.46
|
|
(VI)
|
Analysis of other profit or loss items
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Government grants
|
2,791.61
|
2,592.98
|
2,666.69
|
2,082.34
|
|
Commission for withholding individual income tax
|
39.88
|
-
|
4.88
|
5.30
|
|
Total
|
2,831.48
|
2,592.98
|
2,671.56
|
2,087.63
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Grant project
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
Asset related /income related
|
|
65-45nm Copper Interconnection Stress Free Polishing Equipment R&D
|
44.27
|
128.40
|
138.70
|
199.83
|
Comprehensive subsidy
|
|
20-14nm Copper Interconnection Copper Plating Equipment R&D and Application
|
165.25
|
453.50
|
2,088.34
|
1,802.77
|
Comprehensive subsidy
|
|
Patent Pilot Funding
|
-
|
24.00
|
31.36
|
12.14
|
Income related
|
|
R&D and Industrialization of Polytetrafluoroethylene Cavity Manufacturing Process for Semiconductor Equipment
|
84.89
|
9.20
|
28.13
|
13.94
|
Income related
|
|
R & D and industrialization of single wafer wet bench combined cleaning equipment
|
619.29
|
347.15
|
-
|
-
|
Comprehensive subsidy
|
|
Special R&D of 300mm integrated circuit back etching / cleaning equipment and process
|
1,834.45
|
876.32
|
-
|
-
|
Comprehensive subsidy
|
|
Shanghai enterprise and public institution patent work demonstration unit
|
13.46
|
-
|
-
|
-
|
Income related
|
|
2019 Technology Giant Subsidy
|
-
|
-
|
300.00
|
-
|
Income related
|
|
2019 Shanghai Patent Funding
|
-
|
-
|
45.77
|
-
|
Income related
|
|
2019 Zhangjiang Science City Intellectual Property Support Fund
|
-
|
-
|
20.00
|
-
|
Income related
|
|
Grants for Chinese patent applications and licensing fees in Pudong New Area in 2019
|
-
|
-
|
14.40
|
-
|
Income related
|
|
2018 Shanghai Patent Grant
|
-
|
-
|
-
|
18.89
|
Income related
|
|
Grants for Chinese patent applications and licensing fees in Pudong New Area in 2018
|
-
|
-
|
-
|
4.40
|
Income related
|
|
2018 Stability Grants
|
-
|
-
|
-
|
8.17
|
Income related
|
|
Others
|
-
|
-
|
-
|
22.20
|
Income related
|
|
2019 equity investment subsidy
|
-
|
400.00
|
-
|
-
|
Income related
|
|
Second Batch of Grants of Science and Technology Development Fund for Key Enterprise R&D Institution in 2020
|
-
|
80.00
|
-
|
-
|
Income related
|
|
2020 Shanghai Patent Grant
|
-
|
78.53
|
-
|
-
|
Income related
|
|
2020 Zhangjiang Science City Intellectual Property Support Fund
|
-
|
60.00
|
-
|
-
|
Income related
|
|
2020 High Value Patent Portfolio Award
|
-
|
50.00
|
-
|
-
|
Income related
|
|
2020 Exhibition Subsidy
|
-
|
24.85
|
-
|
-
|
Income related
|
|
2020 Stability Grants
|
-
|
16.67
|
-
|
-
|
Income related
|
|
Financial subsidy of science and technology development fund in 2020
|
-
|
14.74
|
-
|
-
|
Income related
|
|
2019 Stability Grants
|
-
|
11.23
|
-
|
-
|
Income related
|
|
2020 Excellent Patent Award
|
-
|
10.00
|
-
|
-
|
Income related
|
|
Grants for Chinese patent applications and licensing fees in Pudong New Area in 2020
|
-
|
8.40
|
-
|
-
|
Income related
|
|
2021 Shanghai Patent Grant
|
30.00
|
-
|
-
|
-
|
Income related
|
|
Total
|
2,791.61
|
2,592.98
|
2,666.69
|
2,082.34
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Long-term equity investment income accounted by equity method
|
9.42
|
-23.04
|
-2.07
|
-1.02
|
|
Investment income from held-for-trading financial assets during the holding period
|
-102.36
|
-148.74
|
-
|
-
|
|
Investment income of wealth management products
|
-
|
300.23
|
126.10
|
-
|
|
Total
|
-92.93
|
128.44
|
124.03
|
-1.02
|
|
Item
|
Category
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Credit impairment loss
|
Bad debts loss of accounts receivables
|
-198.06
|
116.88
|
-221.58
|
-
|
|
Bad debts loss of other receivables
|
1.33
|
5.59
|
-1.93
|
-
|
|
|
Assets impairment loss
|
Bad debts losses
|
-
|
-
|
-
|
-267.47
|
|
Losses from decline in value of inventories
|
21.58
|
-353.37
|
-78.88
|
30.10
|
|
|
Total
|
-175.14
|
-203.90
|
-302.39
|
-237.37
|
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Non-recurring losses
|
-
|
-
|
-
|
108.36
|
|
Losses from damage and retirement of non-current assets
|
-
|
16.83
|
202.85
|
1.47
|
|
Penalties and overdue fines
|
0.70
|
0.44
|
0.11
|
1.52
|
|
Others
|
0.00
|
5.08
|
0.17
|
0.18
|
|
Total
|
0.70
|
22.35
|
203.13
|
111.52
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Held-for-trading financial assets
|
1,770.76
|
8,671.99
|
-
|
-
|
|
Total
|
1,770.76
|
8,671.99
|
-
|
-
|
|
(VII)
|
Tax payment
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Current income tax expenses
|
319.70
|
874.65
|
2,722.98
|
893.05
|
|
Deferred income tax expenses
|
37.93
|
1,750.76
|
-899.81
|
137.08
|
|
Total
|
357.63
|
2,625.41
|
1,823.17
|
1,030.13
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
XII.
|
Asset Quality and Solvency Analysis
|
|
(I)
|
Asset structure and change analysis
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Current assets
|
182,329.02
|
79.48%
|
142,156.27
|
77.11%
|
120,865.05
|
92.40%
|
56,783.25
|
89.28%
|
|
Non-current assets
|
47,064.40
|
20.52%
|
42,196.10
|
22.89%
|
9,935.10
|
7.60%
|
6,819.00
|
10.72%
|
|
Total Assets
|
229,393.43
|
100.00%
|
184,352.37
|
100.00%
|
130,800.15
|
100.00%
|
63,602.25
|
100.00%
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Cash and bank balances
|
25,382.70
|
13.92%
|
27,126.79
|
19.08%
|
44,002.91
|
36.41%
|
9,582.86
|
16.88%
|
|
Held-for-trading financial assets
|
20,191.65
|
11.07%
|
18,420.89
|
12.96%
|
-
|
-
|
-
|
-
|
|
Accounts receivables
|
30,758.26
|
16.87%
|
25,607.58
|
18.01%
|
20,989.64
|
17.37%
|
17,360.55
|
30.57%
|
|
Prepayments
|
5,726.55
|
3.14%
|
3,576.09
|
2.52%
|
1,124.46
|
0.93%
|
1,336.05
|
2.35%
|
|
Other receivables
|
4,173.97
|
2.29%
|
3,471.32
|
2.44%
|
4,763.85
|
3.94%
|
1,716.08
|
3.02%
|
|
Inventory
|
93,518.98
|
51.29%
|
61,486.94
|
43.25%
|
30,727.41
|
25.42%
|
26,415.99
|
46.52%
|
|
Other current assets
|
2,576.91
|
1.41%
|
2,466.68
|
1.74%
|
19,256.78
|
15.93%
|
371.71
|
0.65%
|
|
Total current assets
|
182,329.02
|
100.00%
|
142,156.27
|
100.00%
|
120,865.05
|
100.00%
|
56,783.25
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Cash on hand
|
1.53
|
2.02
|
3.05
|
4.70
|
|
Bank deposit
|
25,381.17
|
27,124.76
|
43,999.86
|
9,578.16
|
|
Other cash and bank balances
|
-
|
-
|
-
|
-
|
|
Total
|
25,382.70
|
27,126.79
|
44,002.91
|
9,582.86
|
|
Including: total amount deposited overseas
|
23,168.78
|
19,074.57
|
15,259.82
|
6,832.42
|
|
Company
|
Place of Deposit
|
Jun. 30, 2021
|
Dec. 31, 2020
|
Dec. 31, 2019
|
Dec. 31, 2018
|
Source/Use
|
|
CleanChip HK
|
Hong Kong, China
|
20,458.68
|
18,343.16
|
14,507.61
|
6,696.58
|
Sales proceeds, daily operation of the Company
|
|
ACMKR
|
Korea
|
702.19
|
216.22
|
240.27
|
135.84
|
Daily operation of the Company
|
|
ACM CA
|
U.S.
|
2,007.92
|
515.19
|
511.95
|
-
|
Daily operation of the Company
|
|
-
|
Total
|
23,168.78
|
19,074.57
|
15,259.82
|
6,832.42
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Amounts deposited overseas and restricted in repatriation
|
173.75
|
188.81
|
83.21
|
23.47
|
|
Voluntary committed restricted funds
|
-
|
-
|
22,817.00
|
-
|
|
Total
|
173.75
|
188.81
|
22,900.21
|
23.47
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Financing
|
Currency
|
Amount
|
Use and deposit
|
Currency
|
Amount
|
|
The fifth capital increase of ACMSH (before restructuring)
|
RMB
|
16,792.40
|
Other current assets
|
RMB
|
16,792.40
|
|
USD
|
283.73
|
USD
|
283.73
|
||
|
The first capital increase of ACMSH
|
RMB
|
22,817.00
|
Cash and bank balances
|
RMB
|
22,817.00
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Financial assets at fair value through profit or loss
|
20,191.65
|
18,420.89
|
-
|
-
|
|
Including: Investments in debt instruments
|
-
|
-
|
-
|
-
|
|
Investments in equity instruments
|
20,191.65
|
18,420.89
|
-
|
-
|
|
Financial assets designated as at fair value through profit or loss
|
-
|
-
|
-
|
-
|
|
Total
|
20,191.65
|
18,420.89
|
-
|
-
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Balance of accounts receivables
|
31,700.30
|
26,359.08
|
21,845.46
|
17,987.45
|
|
Less: allowances for bad debts
|
942.04
|
751.50
|
855.82
|
626.89
|
|
Net accounts receivables
|
30,758.26
|
25,607.58
|
20,989.64
|
17,360.55
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Balance of accounts receivables
|
31,700.30
|
26,359.08
|
21,845.46
|
17,987.45
|
|
Growth rate of balance of accounts receivables at the end of the period
|
20.26%
|
20.66%
|
21.45%
|
77.45%
|
|
Growth rate of operating income
|
-
|
33.13%
|
37.52%
|
116.99%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Aging
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Within 1year (inclusive)
|
27,564.32
|
22,638.63
|
16,651.68
|
15,203.01
|
|
Including: within 6 months
|
21,244.37
|
18,618.18
|
12,612.86
|
10,556.63
|
|
within 7-12 months
|
6,319.96
|
4,020.45
|
4,038.82
|
4,646.39
|
|
1-2 years (including 2 years)
|
4,135.97
|
3,720.45
|
5,110.07
|
2,698.68
|
|
2-3 years (including 3 years)
|
-
|
-
|
83.71
|
45.98
|
|
3-4 years (including 4 years)
|
-
|
-
|
-
|
39.77
|
|
4-5 years (including 5 years)
|
-
|
-
|
-
|
-
|
|
Over 5 years
|
-
|
-
|
-
|
-
|
|
Subtotal
|
31,700.30
|
26,359.08
|
21,845.46
|
17,987.45
|
|
Less: allowances for bad debts
|
942.04
|
751.50
|
855.82
|
626.89
|
|
Total
|
30,758.26
|
25,607.58
|
20,989.64
|
17,360.55
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Category
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
||||||
|
Carrying amount
|
Provision for bad debts
|
Proportion (%)
|
Carrying amount
|
Provision for bad debts
|
Proportion (%)
|
Carrying amount
|
Provision for bad debts
|
Proportion (%)
|
|
|
Provision for bad debts made individually
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
|
Provision for bad debts made by group:
|
31,700.30
|
942.04
|
2.97
|
26,359.08
|
751.50
|
2.85
|
21,845.46
|
855.82
|
3.92
|
|
Including:
|
|||||||||
|
Credit group of non-combined related parties
|
31,700.30
|
942.04
|
2.97
|
25,584.26
|
751.50
|
2.94
|
21,845.46
|
855.82
|
3.92
|
|
Accounts receivables that final customers have paid to related parties at the end of the period and then related parties have paid to the Company after the period
|
-
|
-
|
-
|
774.81
|
-
|
-
|
-
|
-
|
-
|
|
Total
|
31,700.30
|
942.04
|
2.97
|
26,359.08
|
751.50
|
2.85
|
21,845.46
|
855.82
|
3.92
|
|
Aging
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
||||||
|
Accounts receivables
|
Provisions for bad debts
|
Proportion (%)
|
Accounts receivables
|
Provisions for bad debts
|
Proportion (%)
|
Accounts receivables
|
Provisions for bad debts
|
Proportion (%)
|
|
|
Within 6 months
|
21,244.37
|
212.44
|
1.00
|
17,843.36
|
178.43
|
1.00
|
12,612.86
|
126.13
|
1.00
|
|
Within 7-12 months
|
6,319.96
|
316.00
|
5.00
|
4,020.45
|
201.02
|
5.00
|
4,038.82
|
201.94
|
5.00
|
|
1-2 years (including 2 years)
|
4,135.97
|
413.60
|
10.00
|
3,720.45
|
372.04
|
10.00
|
5,110.07
|
511.01
|
10.00
|
|
2-3 years (including 3 years)
|
-
|
-
|
20.00
|
-
|
-
|
20.00
|
83.71
|
16.74
|
20.00
|
|
3-4 years (including 4 years)
|
-
|
-
|
25.00
|
-
|
-
|
25.00
|
-
|
-
|
25.00
|
|
4-5 years (including 5 years)
|
-
|
-
|
30.00
|
-
|
-
|
30.00
|
-
|
-
|
30.00
|
|
Over 5 years
|
-
|
-
|
100.00
|
-
|
-
|
100.00
|
-
|
-
|
100.00
|
|
Total
|
31,700.30
|
942.04
|
-
|
25,584.26
|
751.50
|
-
|
21,845.46
|
855.82
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Aging
|
December 31, 2018
|
||
|
Accounts receivables
|
Provisions for bad debts
|
Proportion (%)
|
|
|
Within 1year (inclusive)
|
15,203.01
|
337.89
|
2.22
|
|
Including: within 6 months
|
10,556.63
|
105.57
|
1.00
|
|
within 7-12 months
|
4,646.39
|
232.32
|
5.00
|
|
1-2 years (including 2 years)
|
2,698.68
|
269.87
|
10.00
|
|
2-3 years (including 3 years)
|
45.98
|
9.20
|
20.00
|
|
3-4 years (including 4 years)
|
39.77
|
9.94
|
25.00
|
|
4-5 years (including 5 years)
|
-
|
-
|
-
|
|
Over 5 years
|
-
|
-
|
-
|
|
Total
|
17,987.45
|
626.89
|
-
|
|
Listed companies
|
Within 6 months
|
7-12 months
|
1-2 years
|
2-3 years
|
3-4 years
|
4-5 years
|
Over 5 years
|
|
NAURA
|
5.00%
|
5.00%
|
10.00%
|
20.00%
|
30.00%
|
30.00%
|
100.00%
|
|
AMEC
|
1.00%
|
5.00%
|
15.00%
|
20.00%
|
30.00%
|
50.00%
|
100.00%
|
|
KINGSEMI
|
5.00%
|
5.00%
|
10.00%
|
30.00%
|
50.00%
|
80.00%
|
100.00%
|
|
HZCCTECH
|
5.00%
|
5.00%
|
10.00%
|
20.00%
|
40.00%
|
80.00%
|
100.00%
|
|
Issuer
|
1.00%
|
5.00%
|
10.00%
|
20.00%
|
25.00%
|
30.00%
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Customer name
|
Closing balance of accounts receivables
|
Proportion in accounts receivables (%)
|
|
Huahong Group
|
13,118.41
|
41.38
|
|
Yangtze Memory
|
7,941.00
|
25.05
|
|
Xiamen Silan Microchip Manufacturing Co., Ltd.
|
2,097.54
|
6.62
|
|
Changdian Integrated Circuit (Shaoxing) Co., Ltd.
|
1,850.17
|
5.84
|
|
Beijing Yitang Technology Co., Ltd.
|
1,668.00
|
5.26
|
|
Total
|
26,675.13
|
84.15
|
|
Customer name
|
Closing balance of accounts receivables
|
Proportion in accounts receivables (%)
|
|
Huahong Group
|
9,332.07
|
35.40
|
|
Yangtze Memory
|
7,910.78
|
30.01
|
|
Innotron Memory Co., Ltd.
|
2,572.77
|
9.76
|
|
Xiamen Silan Microchip Manufacturing Co., Ltd.
|
1,292.58
|
4.90
|
|
Changdian Integrated Circuit (Shaoxing) Co., Ltd.
|
978.74
|
3.71
|
|
Total
|
22,086.94
|
83.78
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Customer name
|
Closing balance of accounts receivables
|
Proportion in accounts receivables (%)
|
|
Huahong Group
|
11,825.01
|
54.13
|
|
Chater Base International
|
3,676.46
|
16.83
|
|
Yangtze Memory
|
2,328.52
|
10.66
|
|
JCET
|
1,512.24
|
6.92
|
|
Taiwan Phoenix Silicon
|
908.38
|
4.16
|
|
Total
|
20,250.60
|
92.70
|
|
Customer name
|
Closing balance of accounts receivables
|
Proportion in accounts receivables
|
|
Huahong Group
|
5,475.96
|
30.44
|
|
Chater Base International
|
4,251.72
|
23.64
|
|
ACMR
|
3,257.34
|
18.11
|
|
Hynix
|
3,098.92
|
17.23
|
|
Yangtze Memory
|
1,317.03
|
7.32
|
|
Total
|
17,400.96
|
96.74
|
|
Aging
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Within 1 year (inclusive)
|
5,726.55
|
100%
|
3,576.09
|
100%
|
1,124.46
|
100%
|
1,336.05
|
100%
|
|
1-2 years (including 2 years)
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
|
2-3 years (including 3 years)
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
|
Over 3 years
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
|
Total
|
5,726.55
|
100%
|
3,576.09
|
100%
|
1,124.46
|
100%
|
1,336.05
|
100%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Balance of other receivables
|
4,176.11
|
3,474.79
|
4,772.91
|
1,723.22
|
|
Less: Provisions for bad debts
|
2.14
|
3.47
|
9.06
|
7.14
|
|
Net amount of other receivables
|
4,173.97
|
3,471.32
|
4,763.85
|
1,716.08
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Related party accounts
|
-
|
-
|
3,696.06
|
143.53
|
|
Export tax refund receivable
|
2,747.57
|
2,224.26
|
613.58
|
1,288.70
|
|
Deposit
|
109.27
|
297.61
|
148.05
|
180.30
|
|
Intermediary prepayment fee
|
1,113.86
|
845.65
|
125.00
|
-
|
|
Staff reserve
|
32.53
|
24.35
|
78.05
|
30.14
|
|
Other
|
172.88
|
82.92
|
112.17
|
80.55
|
|
Total
|
4,176.11
|
3,474.79
|
4,772.91
|
1,723.22
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Book Value
|
Proportion
|
Book Value
|
Proportion
|
Book Value
|
Proportion
|
Book Value
|
Proportion
|
|
|
Raw material
|
31,526.48
|
33.71%
|
21,129.18
|
34.36%
|
9,139.20
|
29.74%
|
7,873.60
|
29.81%
|
|
Work in process
|
15,557.68
|
16.64%
|
15,571.85
|
25.33%
|
7,524.25
|
24.49%
|
6,067.57
|
22.97%
|
|
Finished goods
|
-
|
0.00%
|
66.26
|
0.11%
|
301.50
|
0.98%
|
-
|
0.00%
|
|
Delivered goods
|
46,434.82
|
49.65%
|
24,719.65
|
40.20%
|
13,762.46
|
44.79%
|
12,474.82
|
47.22%
|
|
Total
|
93,518.98
|
100.00%
|
61,486.94
|
100.00%
|
30,727.41
|
100.00%
|
26,415.99
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
||
|
Carrying amount
|
Provision for decline in value of inventories
|
Book value
|
|
|
Raw material
|
31,886.58
|
360.10
|
31,526.48
|
|
Work in process
|
15,557.68
|
-
|
15,557.68
|
|
Finished goods
|
362.27
|
362.27
|
-
|
|
Delivered goods
|
46,434.82
|
-
|
46,434.82
|
|
Total
|
94,241.34
|
722.36
|
93,518.98
|
|
Item
|
December 31, 2020
|
||
|
Carrying amount
|
Provision for decline in value of inventories
|
Book value
|
|
|
Raw material
|
21,510.86
|
381.68
|
21,129.18
|
|
Work in process
|
15,571.85
|
-
|
15,571.85
|
|
Finished goods
|
428.52
|
362.27
|
66.26
|
|
Delivered goods
|
24,719.65
|
-
|
24,719.65
|
|
Total
|
62,230.88
|
743.95
|
61,486.94
|
|
Item
|
December 31, 2019
|
||
|
Carrying amount
|
Provision for decline in value of inventories
|
Book value
|
|
|
Raw material
|
9,469.01
|
329.82
|
9,139.20
|
|
Work in process
|
7,524.25
|
-
|
7,524.25
|
|
Finished goods
|
362.27
|
60.76
|
301.50
|
|
Delivered goods
|
13,762.46
|
-
|
13,762.46
|
|
Total
|
31,117.99
|
390.58
|
30,727.41
|
|
Item
|
December 31, 2018
|
||
|
Carrying amount
|
Provision for decline in value of inventories
|
Book value
|
|
|
Raw material
|
8,185.30
|
311.70
|
7,873.60
|
|
Work in process
|
6,067.57
|
-
|
6,067.57
|
|
Finished goods
|
-
|
-
|
-
|
|
Delivered goods
|
12,474.82
|
-
|
12,474.82
|
|
Total
|
26,727.69
|
311.70
|
26,415.99
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Aging
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Within 1 year (inclusive)
|
43,255.62
|
93.15%
|
21,541.57
|
87.14%
|
11,389.90
|
82.76%
|
10,818.02
|
86.72%
|
|
1-2 years (including 2 years)
|
568.41
|
1.22%
|
1,872.98
|
7.58%
|
1,078.02
|
7.83%
|
1,294.53
|
10.38%
|
|
2-3 years (including 3 years)
|
1,304.58
|
2.81%
|
-
|
-
|
1,294.53
|
9.41%
|
-
|
-
|
|
Over 3 years
|
1,306.21
|
2.81%
|
1,305.09
|
5.28%
|
-
|
-
|
362.27
|
2.90%
|
|
Total
|
46,434.82
|
100.00%
|
24,719.65
|
100.00%
|
13,762.46
|
100.00%
|
12,474.82
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Customer
|
Order/Contract No.
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
Specific reasons for failure to obtain customer acceptance
|
Whether the contract has been complied with
|
Is there any possibility that the customer may cancel the purchase
|
Is there any impairment risk
|
Whether sufficient provision has been made for decline in value
|
||||
|
Amount
|
Aging
|
Amount
|
Aging
|
Amount
|
Aging
|
Amount
|
Aging
|
|||||||
|
SMIC
|
1121704748
|
1,306.21
|
Over 3 years
|
1,305.09
|
More than 3 years
|
1,294.53
|
2 to 3 years
|
1,294.53
|
1 to 2 years
|
See Note 1
|
See Note 1
|
See Note 1
|
No
|
No provision for decline in value is required
|
|
Nepes
|
1600337
|
680.69
|
2 to 3 years
|
680.69
|
1 to 2 years
|
680.69
|
Within 1 year
|
-
|
-
|
The equipment was delivered in June 2019, but has not been installed, given the customer is in the Philippines, and the Company’s engineers are prevented by COVID-19 epidemic from proceeding to the site.
|
Yes, 50% of the contract price as the deposit from customer has been received, and no acceptance time is agreed in the contract.
|
No
|
No
|
No provision for decline in value is required
|
|
Nepes
|
1601173
|
623.89
|
2 to 3 years
|
623.89
|
1 to 2 years
|
623.89
|
Within 1 year
|
-
|
-
|
The equipment was delivered in June 2019, but has not been installed, given the customer is in the Philippines, and the Company’s engineers are prevented by COVID-19 epidemic from proceeding to the site.
|
Yes, 50% of the contract price as the deposit from customer has been received, and no acceptance time is agreed in the contract.
|
No
|
No
|
No provision for decline in value is required
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
JCET
|
JCAPEQ-2018-097
|
568.41
|
1 to 2 years
|
568.41
|
1 to 2 years
|
568.41
|
Within 1 year
|
-
|
-
|
The equipment was delivered in November 2019. The installation has not been installed yet as the equipment has been postponed due to the customer’s production line, which is expected to be completed by the
end of 2021. The acceptance is expected to be completed by the end of 2022.
|
Yes, 80% of the contract price as the deposit from customer has been received, and no acceptance time is agreed in the contract.
|
No
|
No
|
No provision for decline in value is required
|
|
SMIC
|
7222002408
|
-
|
-
|
-
|
-
|
463.68
|
1 to 2 years
|
463.68
|
Within 1 year
|
The equipment has been accepted in 2020
|
Yes, the full payment has been received
|
The equipment has been accepted in 2020
|
The equipment has been accepted in 2020, without impairment risk
|
No provision for decline in value is required
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
SMIC
|
7222002408
|
-
|
-
|
-
|
-
|
410.29
|
1 to 2 years
|
410.29
|
Within 1 year
|
The equipment has been accepted in 2020
|
Yes, the full payment has been received
|
The equipment has been accepted in 2020
|
The equipment has been accepted in 2020 without impairment risk
|
No provision for decline in value is required
|
|
SMIC Shaoxing (SMIC)
|
7721800597
|
-
|
-
|
-
|
-
|
204.05
|
1 to 2 years
|
204.05
|
Within 1 year
|
The equipment has been accepted in 2020
|
Yes, the full payment has been received
|
The equipment has been accepted in 2020
|
The equipment has been accepted in 2020 without impairment risk
|
No provision for decline in value is required
|
|
Taiwan Wafer Works
|
ZP21 8110025539
|
-
|
-
|
-
|
-
|
-
|
-
|
362.27
|
More than 3 years
|
See Note 2
|
See Note 2
|
See Note 2
|
Full provision for decline in value has been made at the end of the reporting period as the contract cannot be executed
|
The equipment has been recorded as delivered goods instead of finished goods after being transported back to the warehouse, and full provision for decline in value has been made at the end of the reporting
period
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||||||
|
Carrying amount (RMB 10,000 Yuan)
|
Provision for decline in value of inventory (RMB 10,000 Yuan)
|
Book value
(RMB 10,000 Yuan)
|
Carrying amount (RMB 10,000 Yuan)
|
Provision for decline in value of inventory (RMB 10,000 Yuan)
|
Book value
(RMB 10,000 Yuan)
|
Carrying amount (RMB 10,000 Yuan)
|
Provision for decline in value of inventory (RMB 10,000 Yuan)
|
Book value
(RMB 10,000 Yuan)
|
Carrying amount (RMB 10,000 Yuan)
|
Provision for decline in value of inventory (RMB 10,000 Yuan)
|
Book value
(RMB 10,000 Yuan)
|
|
|
Delivered goods
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
-
|
362.27
|
-
|
362.27
|
|
Finished goods
|
-
|
-
|
-
|
362.27
|
362.27
|
-
|
362.27
|
60.76
|
301.50
|
-
|
-
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Fixed deposit
|
-
|
-
|
19,011.36
|
-
|
|
Input tax to be deducted
|
2,060.19
|
1,862.31
|
159.40
|
274.71
|
|
Input tax to be certified
|
9.93
|
40.69
|
60.12
|
77.61
|
|
Prepaid expenses
|
174.58
|
473.96
|
25.90
|
19.39
|
|
Contract acquisition cost
|
88.83
|
89.72
|
-
|
-
|
|
Prepayment of enterprise income tax
|
243.39
|
-
|
-
|
-
|
|
Total
|
2,576.91
|
2,466.68
|
19,256.78
|
371.71
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Long-term receivables
|
-
|
-
|
-
|
-
|
1,484.18
|
14.94%
|
2,470.45
|
36.23%
|
|
Long term equity investment
|
3,058.28
|
6.50%
|
3,048.86
|
7.23%
|
3,071.90
|
30.92%
|
73.98
|
1.08%
|
|
Fixed assets
|
2,917.12
|
6.20%
|
2,811.47
|
6.66%
|
1,396.30
|
14.05%
|
1,638.48
|
24.03%
|
|
Construction in progress
|
1,916.60
|
4.07%
|
1,437.16
|
3.41%
|
370.21
|
3.73%
|
-
|
-
|
|
Right-of-use assets
|
3,327.24
|
7.07%
|
||||||
|
Intangible assets
|
6,636.05
|
14.10%
|
6,653.82
|
15.77%
|
240.08
|
2.42%
|
188.19
|
2.76%
|
|
Long-term deferred expenses
|
958.70
|
2.04%
|
1,052.70
|
2.49%
|
829.53
|
8.35%
|
868.99
|
12.74%
|
|
Deferred tax assets
|
192.04
|
0.41%
|
229.97
|
0.55%
|
2,012.08
|
20.25%
|
1,108.64
|
16.26%
|
|
Other non-current assets
|
28,058.36
|
59.62%
|
26,962.12
|
63.90%
|
530.82
|
5.34%
|
470.27
|
6.90%
|
|
Total non-current assets
|
47,064.40
|
100.00%
|
42,196.10
|
100.00%
|
9,935.10
|
100.00%
|
6,819.00
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Shengxin Shanghai
|
-
|
-
|
1,371.16
|
2,092.29
|
|
Product sales receivables
|
-
|
-
|
113.01
|
378.16
|
|
Total
|
-
|
-
|
1,484.18
|
2,470.45
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Shixi Chanheng
|
2,934.44
|
2,960.90
|
2,993.19
|
-
|
|
Shengyi Semiconductor
|
123.84
|
87.97
|
78.72
|
73.98
|
|
Total
|
3,058.28
|
3,048.86
|
3,071.90
|
73.98
|
|
Company name
|
Duration of investment
|
Investment amount
(10,000 Yuan)
|
Shareholding ratio
|
Change in value during the Reporting Period (10,000 Yuan)
|
|
Shixi Chanheng
|
Long term
|
3,000.00
|
10.00%
|
-65.55
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Book value
|
Proportion
|
Book value
|
Proportion
|
Book value
|
Proportion
|
Book value
|
Proportion
|
|
|
Machinery equipment
|
2,321.62
|
79.59%
|
2,386.66
|
84.89%
|
1,196.90
|
85.72%
|
1,488.79
|
90.86%
|
|
Computer and electronic equipment
|
358.78
|
12.30%
|
306.14
|
10.89%
|
148.48
|
10.63%
|
83.96
|
5.12%
|
|
Office equipment
|
174.37
|
5.98%
|
49.11
|
1.75%
|
19.38
|
1.39%
|
21.08
|
1.29%
|
|
Transportation
|
62.35
|
2.14%
|
69.57
|
2.47%
|
31.55
|
2.26%
|
44.66
|
2.73%
|
|
Total
|
2,917.12
|
100.00%
|
2,811.47
|
100.00%
|
1,396.30
|
100.00%
|
1,638.48
|
100.00%
|
|
Year of fixed assets transfer
|
Project name
|
Amount (10,000 Yuan)
|
Basis for transferring to fixed assets
|
|
2020
|
Clean room reconstruction project of Zhangjiang plant
|
978.01
|
Fixed assets acceptance form
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
I. Original cost
|
||||
|
Office equipment
|
242.12
|
106.93
|
71.43
|
67.06
|
|
Computer and electronic equipment
|
614.67
|
512.24
|
312.83
|
223.35
|
|
Transportation
|
139.69
|
140.63
|
86.70
|
126.12
|
|
Machinery equipment
|
4,124.75
|
3,925.44
|
2,787.16
|
6,688.51
|
|
II. Accumulated depreciation
|
||||
|
Office equipment
|
67.75
|
57.82
|
52.06
|
45.98
|
|
Computer and electronic equipment
|
255.89
|
206.10
|
164.35
|
139.39
|
|
Transportation
|
77.33
|
71.06
|
55.15
|
81.46
|
|
Machinery equipment
|
1,803.13
|
1,538.78
|
1,590.26
|
5,199.72
|
|
III. Book value
|
||||
|
Office equipment
|
174.37
|
49.11
|
19.38
|
21.08
|
|
Computer and electronic equipment
|
358.78
|
306.14
|
148.48
|
83.96
|
|
Transportation
|
62.35
|
69.57
|
31.55
|
44.66
|
|
Machinery equipment
|
2,321.62
|
2,386.66
|
1,196.90
|
1,488.79
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Construction in progress
|
1,916.60
|
1,437.16
|
370.21
|
-
|
|
Total
|
1,916.60
|
1,437.16
|
370.21
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Balance at the beginning of the year
|
Current year increase
|
Amount of fixed assets transferred in current year
|
Other decrease
|
Year-end balance
|
|
Lingang R&D and manufacturing center civil construction and decoration project
|
327.59
|
163.22
|
-
|
-
|
490.81
|
|
Total
|
327.59
|
163.22
|
-
|
-
|
490.81
|
|
Item
|
Balance at the beginning of the year
|
Current year increase
|
Amount of fixed assets transferred in current year
|
Other decrease
|
Year-end balance
|
|
Clean room reconstruction project of Zhangjiang plant
|
360.54
|
617.47
|
978.01
|
-
|
-
|
|
Chuansha plant reconstruction project
|
5.60
|
452.42
|
-
|
458.02
|
-
|
|
Lingang R&D and manufacturing center civil construction and decoration project
|
-
|
327.59
|
-
|
-
|
327.59
|
|
Total
|
366.14
|
1,397.48
|
978.01
|
458.02
|
327.59
|
|
Item
|
Balance at the beginning of the year
|
Current year increase
|
Amount of fixed assets transferred in current year
|
Other decrease
|
Year-end balance
|
|
Clean room reconstruction project of Zhangjiang plant
|
-
|
360.54
|
-
|
-
|
360.54
|
|
Total
|
-
|
360.54
|
-
|
-
|
360.54
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
I. Original cost of intangible assets
|
15,467.16
|
15,341.58
|
8,770.73
|
8,662.39
|
|
Land use right
|
6,356.12
|
6,356.12
|
-
|
-
|
|
Software use right
|
484.44
|
358.86
|
216.37
|
108.04
|
|
Patent right
|
8,626.60
|
8,626.60
|
8,554.35
|
8,554.35
|
|
II. Accumulated amortization
|
8,831.12
|
8,687.77
|
8,530.65
|
8,474.20
|
|
Land use right
|
127.12
|
63.56
|
-
|
-
|
|
Software use right
|
242.92
|
174.46
|
96.94
|
55.93
|
|
Patent right
|
8,461.07
|
8,449.74
|
8,433.70
|
8,418.27
|
|
III. Provision for impairment of intangible assets
|
-
|
-
|
-
|
-
|
|
IV. Book value of intangible assets
|
6,636.05
|
6,653.82
|
240.08
|
188.19
|
|
Land use right
|
6,229.00
|
6,292.56
|
-
|
-
|
|
Software use right
|
241.51
|
184.40
|
119.43
|
52.11
|
|
Patent right
|
165.53
|
176.86
|
120.65
|
136.08
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Deductible temporary differences
|
Deferred tax assets
|
Deductible temporary differences
|
Deferred tax assets
|
Deductible temporary differences
|
Deferred tax assets
|
Deductible temporary differences
|
Deferred tax assets
|
|
|
Provision for impairment of assets
|
1,666.54
|
243.14
|
1,498.92
|
235.78
|
1,268.02
|
197.15
|
965.63
|
146.22
|
|
Deductible loss
|
3,085.68
|
524.34
|
2,477.96
|
418.32
|
1,370.64
|
242.25
|
-
|
-
|
|
Accrued expenses
|
3,596.56
|
449.57
|
3,469.13
|
520.37
|
2,603.41
|
390.51
|
2,533.54
|
380.03
|
|
Difference between revenue recognition accounting and tax law
|
2,412.44
|
301.55
|
2,556.79
|
383.52
|
8,085.85
|
1,212.88
|
4,110.75
|
616.61
|
|
Total
|
10,761.22
|
1,518.60
|
10,002.80
|
1,557.99
|
13,327.92
|
2,042.80
|
7,609.93
|
1,142.86
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Taxable temporary difference
|
Deferred tax assets
|
Taxable temporary difference
|
Deferred tax assets
|
Taxable temporary difference
|
Deferred tax assets
|
Taxable temporary difference
|
Deferred tax assets
|
|
|
Difference of fixed assets between accounting standards and tax law
|
169.75
|
21.22
|
181.42
|
27.21
|
204.77
|
30.72
|
228.11
|
34.22
|
|
Differences of changes in fair value of tradable financial assets between accounting standards and tax law
|
10,442.75
|
1,305.34
|
8,671.99
|
1,300.80
|
-
|
-
|
-
|
-
|
|
合计
|
10,612.50
|
1,326.56
|
8,853.42
|
1,328.01
|
204.77
|
30.72
|
228.11
|
34.22
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Offset amount of deferred income tax assets and liabilities
|
Balance of deferred income tax assets or liabilities after offset
|
Offset amount of deferred income tax assets and liabilities
|
Balance of deferred income tax assets or liabilities after offset
|
Offset amount of deferred income tax assets and liabilities
|
Balance of deferred income tax assets or liabilities after offset
|
Offset amount of deferred income tax assets and liabilities
|
Balance of deferred income tax assets or liabilities after offset
|
|
|
Deferred income tax assets
|
1,326.56
|
192.04
|
1,328.01
|
229.97
|
30.72
|
2,012.08
|
34.22
|
1,108.64
|
|
Deferred income tax liabilities
|
1,326.56
|
-
|
1,328.01
|
-
|
30.72
|
-
|
34.22
|
-
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Public rental housing deposit
|
26,079.89
|
25,730.32
|
-
|
-
|
|
Performance guarantee
|
492.99
|
492.99
|
-
|
-
|
|
Patent application fee
|
356.44
|
207.25
|
162.94
|
156.62
|
|
Advance project payment
|
533.45
|
3.50
|
90.00
|
18.83
|
|
Advance equipment payment
|
58.95
|
89.35
|
27.69
|
92.62
|
|
Lease deposit
|
536.65
|
438.71
|
250.19
|
202.21
|
|
Total
|
28,058.36
|
26,962.12
|
530.82
|
470.27
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
Original cost
|
Accumulated depreciation
|
Book value
|
|
Houses and buildings
|
4,017.56
|
690.32
|
3,327.24
|
|
Total
|
4,017.56
|
690.32
|
3,327.24
|
|
(II)
|
Analysis of debt structure and changes
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Current liabilities
|
94,505.53
|
82.43%
|
59,458.86
|
74.81%
|
41,257.79
|
86.30%
|
42,533.61
|
86.63%
|
|
Non-current liabilities
|
20,144.79
|
17.57%
|
20,026.17
|
25.19%
|
6,549.46
|
13.70%
|
6,563.89
|
13.37%
|
|
Total liabilities
|
114,650.32
|
100.00%
|
79,485.04
|
100.00%
|
47,807.25
|
100.00%
|
49,097.50
|
100.00%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Short-term borrowings
|
14,350.39
|
15.18%
|
17,175.35
|
28.89%
|
9,695.86
|
23.50%
|
6,483.56
|
15.24%
|
|
Accounts payable
|
50,908.35
|
53.87%
|
29,194.22
|
49.10%
|
14,317.44
|
34.70%
|
18,821.12
|
44.25%
|
|
Deposit received
|
-
|
-
|
-
|
-
|
6,802.21
|
16.49%
|
6,825.86
|
16.05%
|
|
Contract liabilities
|
23,272.01
|
24.63%
|
8,601.78
|
14.47%
|
-
|
-
|
-
|
-
|
|
Employee benefits payable
|
1,539.19
|
1.63%
|
1,960.12
|
3.30%
|
1,347.89
|
3.27%
|
341.62
|
0.80%
|
|
Taxes payable
|
523.97
|
0.55%
|
375.78
|
0.63%
|
2,903.82
|
7.04%
|
924.17
|
2.17%
|
|
Other payables
|
1,212.85
|
1.28%
|
1,105.77
|
1.86%
|
6,190.57
|
15.00%
|
9,137.28
|
21.48%
|
|
Non-current liabilities due within one year
|
2,698.77
|
2.86%
|
1,045.85
|
1.76%
|
-
|
-
|
-
|
-
|
|
Total current liabilities
|
94,505.53
|
100.00%
|
59,458.86
|
100.00%
|
41,257.79
|
100.00%
|
42,533.61
|
100.00%
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Credit loan
|
9,490.00
|
4,900.00
|
2,000.00
|
-
|
|
Guaranteed loan
|
4,826.78
|
12,156.42
|
6,597.41
|
2,483.56
|
|
Borrowing (Guarantee + pledge)
|
-
|
-
|
1,000.00
|
4,000.00
|
|
Accrued interest
|
33.60
|
118.94
|
98.45
|
-
|
|
Total
|
14,350.39
|
17,175.35
|
9,695.86
|
6,483.56
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Corporate income tax
|
398.75
|
253.74
|
2,822.47
|
896.03
|
|
Individual income tax
|
86.65
|
83.56
|
57.90
|
5.97
|
|
Stamp duty
|
30.48
|
35.79
|
23.45
|
19.68
|
|
Auto-purchase tax
|
-
|
-
|
-
|
2.50
|
|
Land use tax
|
1.60
|
2.67
|
-
|
-
|
|
VAT payable
|
6.49
|
-
|
-
|
-
|
|
Total
|
523.97
|
375.78
|
2,903.82
|
924.17
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Interest payable
|
-
|
-
|
-
|
67.66
|
|
Other payables
|
1,212.85
|
1,105.77
|
6,190.57
|
9,069.62
|
|
Total
|
1,212.85
|
1,105.77
|
6,190.57
|
9,137.28
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Current accounts of related parties
|
92.34
|
15.01
|
4,784.23
|
7,958.38
|
|
Deposit
|
-
|
-
|
565.22
|
21.35
|
|
Rental fee payable
|
6.09
|
136.45
|
113.34
|
164.08
|
|
Intermediary fee payable
|
7.01
|
4.94
|
114.24
|
25.11
|
|
Accrued installation cost
|
-
|
-
|
65.00
|
167.08
|
|
Other accrued expenses
|
769.11
|
531.84
|
175.32
|
167.68
|
|
Employee reimbursement and subsidies
|
72.30
|
81.09
|
105.77
|
77.96
|
|
Other
|
266.00
|
336.42
|
267.45
|
487.98
|
|
Total
|
1,212.85
|
1,105.77
|
6,190.57
|
9,069.62
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Long-term borrowings due within one year
|
1,170.61
|
1,045.85
|
-
|
-
|
|
Lease liabilities due within one year
|
1,528.16
|
-
|
-
|
-
|
|
Total
|
2,698.77
|
1,045.85
|
-
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
Amount
|
Proportion
|
|
|
Long-term borrowings
|
12,090.94
|
60.02%
|
11,728.09
|
58.56%
|
-
|
-
|
-
|
-
|
|
Lease liabilities
|
1,838.57
|
9.13%
|
||||||
|
Long term accounts payable
|
-
|
0.00%
|
-
|
-
|
1,371.16
|
20.94%
|
2,092.29
|
31.88%
|
|
Long-term employee benefits payable
|
264.83
|
1.31%
|
183.94
|
0.92%
|
111.43
|
1.70%
|
21.26
|
0.32%
|
|
Estimated liabilities
|
3,221.12
|
15.99%
|
3,006.71
|
15.01%
|
2,205.36
|
33.67%
|
1,316.39
|
20.05%
|
|
Deferred income
|
2,729.33
|
13.55%
|
5,107.43
|
25.50%
|
2,861.50
|
43.69%
|
3,133.95
|
47.75%
|
|
Total
|
20,144.79
|
100.00%
|
20,026.17
|
100.00%
|
6,549.46
|
100.00%
|
6,563.89
|
100.00%
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Mortgage + guaranteed loan
|
11,190.94
|
11,728.09
|
-
|
-
|
|
Credit loan
|
900.00
|
-
|
-
|
-
|
|
Total
|
12,090.94
|
11,728.09
|
-
|
-
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
ACMR
|
-
|
-
|
1,371.16
|
2,092.29
|
|
Total
|
-
|
-
|
1,371.16
|
2,092.29
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Product quality warranty
|
3,221.12
|
3,006.71
|
2,205.36
|
1,316.39
|
|
Estimated liabilities
|
3,221.12
|
3,006.71
|
2,205.36
|
1,316.39
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
Asset related /income related
|
|
65-45nm Copper Interconnection Stress Free Polishing Equipment R&D
|
814.15
|
858.43
|
906.82
|
1,045.52
|
Comprehensive subsidy
|
|
20-14nm Copper Interconnection Copper Plating Equipment R&D and Application
|
1,241.84
|
1,407.09
|
1,860.60
|
1,934.86
|
Comprehensive subsidy
|
|
Patent Pilot Funding
|
-
|
-
|
-
|
31.36
|
Income related
|
|
R&D and Industrialization of Polytetrafluoroethylene Cavity Manufacturing Process for Semiconductor Equipment
|
-
|
84.89
|
94.09
|
122.22
|
Income related
|
|
R & D and industrialization of single wafer wet bench combined cleaning equipment
|
387.56
|
1,006.85
|
-
|
-
|
Comprehensive subsidy
|
|
R&D of 300mm integrated circuit back etching / cleaning equipment and process
|
239.23
|
1,690.18
|
-
|
-
|
Comprehensive subsidy
|
|
Shanghai enterprise and public institution patent work demonstration unit
|
16.54
|
30.00
|
-
|
-
|
Income related
|
|
Supporting subsidy for pilot (demonstration) units of patent work in Shanghai
|
30.00
|
30.00
|
-
|
-
|
Income related
|
|
Total
|
2,729.33
|
5,107.43
|
2,861.50
|
3,133.95
|
-
|
|
(III)
|
Liquidity analysis
|
|
Main financial indicators
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
Current ratio (frequency)
|
1.93
|
2.39
|
2.93
|
1.34
|
|
Quick ratio (frequency)
|
0.94
|
1.36
|
2.18
|
0.71
|
|
Company name
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
||||
|
Current ratio
|
Quick ratio
|
Current ratio
|
Quick ratio
|
Current ratio
|
Quick ratio
|
Current ratio
|
Quick ratio
|
|
|
NAURA
|
1.19
|
0.60
|
1.39
|
0.77
|
1.77
|
1.01
|
1.27
|
0.59
|
|
AMEC
|
10.19
|
9.02
|
3.41
|
2.54
|
4.29
|
3.08
|
2.12
|
1.19
|
|
KINGSEMI
|
1.82
|
0.94
|
2.58
|
1.58
|
5.84
|
4.69
|
2.35
|
1.19
|
|
HZCCTECH
|
2.31
|
1.44
|
2.30
|
1.56
|
2.65
|
1.62
|
2.30
|
1.80
|
|
Average value
|
3.88
|
3.00
|
2.42
|
1.61
|
3.64
|
2.60
|
2.01
|
1.19
|
|
The Company
|
1.93
|
0.94
|
2.39
|
1.36
|
2.93
|
2.18
|
1.34
|
0.71
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(IV)
|
Solvency analysis
|
|
Main financial indicators
|
June 30, 2021/
From Jan. to Jun. 2021
|
December 31, 2020/
2020
|
December 31, 2019/
2019
|
December 31, 2018/
2018
|
|
Asset liability ratio (parent company)
|
40.83%
|
35.60%
|
32.56%
|
76.34%
|
|
Asset liability ratio (consolidated)
|
49.98%
|
43.12%
|
36.55%
|
77.19%
|
|
EBITDA (RMB 10,000 Yuan)
|
10,398.61
|
23,752.53
|
16,654.67
|
11,063.48
|
|
Interest protection multiples
|
31.70
|
36.43
|
21.54
|
21.37
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Company name
|
June 30, 2021
|
December 31, 2020
|
December 31, 2019
|
December 31, 2018
|
|
NAURA
|
66.35%
|
59.40%
|
55.59%
|
62.49%
|
|
AMEC
|
9.89%
|
24.68%
|
21.43%
|
40.09%
|
|
KINGSEMI
|
48.45%
|
34.79%
|
18.93%
|
42.09%
|
|
HZCCTECH
|
34.06%
|
31.75%
|
24.57%
|
30.63%
|
|
Average value
|
39.69%
|
37.66%
|
30.13%
|
43.83%
|
|
The Company
|
49.98%
|
43.12%
|
36.55%
|
77.19%
|
|
(V)
|
Assets turnover capacity analysis
|
|
Financial indicators
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Turnover rate of accounts receivables (frequency)
|
2.15
|
4.19
|
3.80
|
3.91
|
|
Inventory turnover rate (frequency)
|
0.46
|
1.21
|
1.44
|
1.51
|
|
Company name
|
Turnover rate of accounts receivables
|
Inventory turnover
|
||||||
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
|
NAURA
|
2.06
|
5.12
|
4.56
|
4.21
|
0.34
|
0.89
|
0.73
|
0.81
|
|
AMEC
|
4.35
|
8.03
|
5.21
|
3.56
|
0.62
|
1.32
|
1.08
|
0.99
|
|
KINGSEMI
|
2.65
|
4.73
|
3.93
|
5.39
|
0.39
|
0.67
|
0.74
|
0.97
|
|
HZCCTECH
|
1.34
|
2.39
|
2.05
|
1.79
|
0.55
|
1.04
|
0.89
|
1.20
|
|
Average value
|
2.60
|
5.07
|
3.94
|
3.74
|
0.48
|
0.98
|
0.86
|
0.99
|
|
The Company
|
2.15
|
4.19
|
3.80
|
3.91
|
0.46
|
1.21
|
1.44
|
1.51
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
XIII.
|
Dividend Distribution Policy
|
|
(I)
|
Dividend distribution during the Reporting Period
|
|
(II)
|
Dividend policy in recent three years
|
|
XIV.
|
Cash Flow Analysis
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Net cash flow from operating activities
|
4,093.21
|
-8,824.49
|
7,270.65
|
3,881.03
|
|
Net cash flow from investment activities
|
-1,904.03
|
-26,014.98
|
-26,425.86
|
-1,472.30
|
|
Net cash flow from financing activities
|
-3,728.87
|
18,857.56
|
53,419.46
|
2,889.51
|
|
Effect of exchange rate changes on cash and cash equivalents
|
-204.40
|
-894.21
|
155.80
|
-230.70
|
|
Net increase in cash and cash equivalents
|
-1,744.09
|
-16,876.13
|
34,420.05
|
5,067.54
|
|
Balance of cash and cash equivalents at the beginning of the period
|
27,126.79
|
44,002.91
|
9,582.86
|
4,515.32
|
|
Balance of cash and cash equivalents at the end of the period
|
25,382.70
|
27,126.79
|
44,002.91
|
9,582.86
|
|
(I)
|
Cash flow analysis of operating activities
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Cash received from sales of goods or rendering of services
|
73,319.82
|
96,579.31
|
73,063.06
|
54,089.25
|
|
Refunds of taxes
|
4,669.49
|
4,506.46
|
5,141.52
|
3,161.69
|
|
Cash received from other operating activities
|
754.92
|
6,268.81
|
3,212.40
|
426.64
|
|
Subtotal of cash inflow from operating activities
|
78,744.22
|
107,354.58
|
81,416.97
|
57,677.58
|
|
Cash paid for goods and services
|
53,949.71
|
83,443.48
|
53,888.11
|
40,071.65
|
|
Cash paid to and on behalf of employees
|
11,003.64
|
11,322.41
|
8,437.93
|
5,837.84
|
|
Taxes paid
|
453.71
|
3,553.20
|
857.52
|
26.50
|
|
Other cash paid related to operating activities
|
9,243.94
|
17,859.98
|
10,962.76
|
7,860.56
|
|
Subtotal of cash outflow from operating activities
|
74,651.01
|
116,179.07
|
74,146.33
|
53,796.55
|
|
Net cash flow from operating activities
|
4,093.21
|
-8,824.49
|
7,270.65
|
3,881.03
|
|
Net profit
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Net cash flow/net profit from operating activities
|
45.64%
|
-44.85%
|
53.90%
|
41.94%
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Net profit
|
8,967.60
|
19,676.99
|
13,488.73
|
9,253.04
|
|
Add: credit impairment loss
|
196.72
|
-122.47
|
223.51
|
-
|
|
Provision for impairment of assets
|
-21.58
|
353.37
|
78.88
|
237.37
|
|
Depreciation of fixed assets
|
332.14
|
307.92
|
253.72
|
201.07
|
|
Depreciation of right-of-use assets
|
690.84
|
-
|
-
|
-
|
|
Amortization of intangible assets
|
144.58
|
158.37
|
56.30
|
44.50
|
|
Amortization of long-term deferred expenses
|
292.91
|
354.31
|
287.13
|
29.96
|
|
Losses on scrapping of fixed assets (“-” for gains)
|
-
|
16.83
|
202.85
|
1.47
|
|
Losses from changes in fair value (“-” for gains)
|
-1,770.76
|
-8,671.99
|
-
|
-
|
|
Financial expenses (“-” for gains)
|
615.86
|
1,378.78
|
531.55
|
751.55
|
|
Investment loss (“-” for gains)
|
-9.42
|
-277.19
|
-170.78
|
1.02
|
|
Decrease of deferred income tax assets (“-” for increase)
|
37.93
|
1,782.11
|
-903.44
|
137.07
|
|
Decrease of inventory (“-” for increase)
|
-32,010.46
|
-31,112.89
|
-4,390.30
|
-12,832.70
|
|
Decrease of operating receivables (“-” for increase)
|
-8,551.47
|
-11,167.16
|
-2,849.30
|
-10,560.81
|
|
Increase in operating payables (“-” for decrease)
|
36,639.45
|
14,131.71
|
-1,379.44
|
18,106.79
|
|
Others
|
-1,461.13
|
4,366.80
|
1,841.24
|
-1,489.31
|
|
Net cash flow from operating activities
|
4,093.21
|
-8,824.49
|
7,270.65
|
3,881.03
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
(II)
|
Cash flow analysis of investment activities
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Cash received from return of investemnt
|
-
|
24,204.12
|
-
|
-
|
|
Cash received from investment
|
-
|
367.10
|
-
|
-
|
|
Net cash received from disposal of fixed assets
|
-
|
0.27
|
0.24
|
0.82
|
|
Cash received relating to other investing activities
|
-
|
740.61
|
-
|
-
|
|
Subtotal of cash inflow from investment activities
|
-
|
25,312.10
|
0.24
|
0.82
|
|
Cash paid for acquisition and construction of fixed assets, intangible assets and other long-term assets
|
1,904.03
|
35,544.99
|
1,016.59
|
1,473.12
|
|
Cash paid for investment
|
-
|
12,094.33
|
18,885.26
|
-
|
|
Net cash paid by subsidiaries and other business units
|
-
|
2,454.17
|
3,075.00
|
-
|
|
Other cash paid related to investment activities
|
-
|
1,233.60
|
3,449.25
|
-
|
|
Subtotal of cash outflow from investment activities
|
1,904.03
|
51,327.08
|
26,426.10
|
1,473.12
|
|
Net cash flow used in investment activities
|
-1,904.03
|
-26,014.98
|
-26,425.86
|
-1,472.30
|
|
(III)
|
Cash flow analysis of financing activities
|
|
Item
|
From Jan. to Jun. 2021
|
2020
|
2019
|
2018
|
|
Cash received from investment absorption
|
-
|
-
|
56,066.14
|
-
|
|
Cash received from borrowings
|
12,416.78
|
34,013.75
|
12,887.40
|
12,129.56
|
|
Subtotal of cash inflows from financing activities
|
12,416.78
|
34,013.75
|
68,953.53
|
12,129.56
|
|
Cash paid for debt repayment
|
14,693.56
|
13,283.31
|
9,773.55
|
8,976.00
|
|
Cash paid for distribution of dividends or profits and for interest expenses
|
682.14
|
644.23
|
761.10
|
264.06
|
|
Cash paid relating to other financing activities
|
769.96
|
1,228.65
|
4,999.42
|
-
|
|
Subtotal of cash outflows from financing activities
|
16,145.65
|
15,156.19
|
15,534.08
|
9,240.06
|
|
Net cash flows from financing activities
|
-3,728.87
|
18,857.56
|
53,419.46
|
2,889.51
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
XV.
|
Capital Expenditure Analysis
|
|
(I)
|
Expenditure of major assets during the Reporting Period
|
|
(II)
|
Foreseeable expenditure of major assets in the future
|
|
XVI.
|
Analysis of Going Concern Capability
|
|
XVII.
|
Major Equity Acquisition and Merger
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
XVIII.
|
Subsequent Matters, Contingencies, Other Important Matters, Major Guarantees and Litigation Matters
|
|
(I)
|
Events after the balance sheet date
|
|
(II)
|
Contingencies
|
|
(III)
|
Other important matters
|
|
(IV)
|
Major guarantee and litigation matters
|
|
XIX.
|
Profit Forecast
|
|
XX.
|
Main Financial Information and Operating Conditions after the Deadline for Auditing Financial Report
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
I.
|
Overview of Investment Projects with Raised Funds
|
|
(I)
|
Investment direction of raised funds
|
|
S/N
|
Investment direction of raised funds
|
Total Investment
|
Amount of raised funds to be used
|
|
1
|
ACMSH Equipment R&D and Manufacturing Center
|
88,245.00
|
70,000.00
|
|
2
|
ACMSH High-end Semiconductor Equipment R&D Project
|
45,000.00
|
45,000.00
|
|
3
|
Supplementary working capital
|
65,000.00
|
65,000.00
|
|
Total
|
198,245.00
|
180,000.00
|
|
|
(II)
|
Arrangement for investment and use of raised funds
|
|
(III)
|
Impact of raised fund investment projects on horizontal competition and independence
|
|
(IV)
|
The management system for the use of raised funds and specific arrangements for the raised funds invested in the
key scientific and technological innovation projects
|
|
(V)
|
Analysis of necessity and feasibility of implementation of investment projects with raised funds
|
|
ACM Research (Shanghai), Inc.
|
[***]
|
|
ACM Research (Shanghai), Inc.
|
[***]
|

| ACM Research (Shanghai), Inc. |
[***] |

| ACM Research (Shanghai), Inc. |
[***] |

| ACM Research (Shanghai), Inc. |
[***] |
|
S/N
|
Project name
|
Amount
|
Proportion
|
|
1
|
Civil work and decoration
|
30, 337.28
|
34.38%
|
|
2
|
Equipment and software investment
|
9,662.72
|
10.95%
|
|
3
|
Development or design costs
|
6,292.36
|
7.13%
|
|
4
|
Cost of raw materials for trial production
|
27, 266.87
|
30.90%
|
|
5
|
Fuel power cost for trial production
|
1,993.43
|
2.26%
|
|
6
|
Fees for testing (or detection)
|
2,097.45
|
2.38%
|
|
7
|
Reserve fund
|
4,194.89
|
4.75%
|
|
8
|
Land acquisition
|
6,400.00
|
7.25%
|
|
Total
|
88,245.00
|
100.00%
|
|
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
|
S/N
|
Project name
|
Amount
|
Proportion
|
|
1
|
Hardware investment
|
8,156.15
|
18.12%
|
|
2
|
R&D Materials
|
28, 790.22
|
63.98%
|
|
3
|
Testing and inspection
|
749.23
|
1.66%
|
|
4
|
Staff remuneration
|
6,177.60
|
13.73%
|
|
5
|
Other expenses
|
1,126.80
|
2.50%
|
|
Total
|
45,000.00
|
100.00%
|
|
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
|
Name of Supplier
|
Purchased
Product
|
Contract Term
|
Degree of
Performance
|
|
|
1
|
NINEBELL
|
Material transforming products
|
Non-fixed term from January 1, 2017
|
Ongoing
|
|
2
|
DOUBLE MERITS HOLDINGS LIMITED
|
Gas circuit and special equipment products, etc.
|
Non-fixed term from January 1, 2019
|
Ongoing
|
|
3
|
Nomura Micro Science Co., Ltd.
|
Special equipment products
|
Non-fixed term from January 1, 2017
|
Ongoing
|
|
4
|
SAS Technology Limited
|
Gas circuit products
|
Non-fixed term from January 1, 2017
|
Ongoing
|
|
5
|
ACMR
|
Electrical, machinery, gas circuit, drive, special equipment, materials transforming and other products
|
Non-fixed term from January 1, 2017
|
Completed
|
|
6
|
Tokyo Keiso (Beijing) Instrument Co., Ltd.
|
Gas circuit products, etc.
|
Non-fixed term from January 1, 2017
|
Ongoing
|
|
7
|
Fujikin of China Incorporated
|
Gas circuit and special equipment products, etc.
|
Non-fixed term from January 1, 2018
|
Ongoing
|
|
8
|
Shanghai Molan Electromechanical Equipment Co., Ltd.
|
Electrical products, etc.
|
Non-fixed term from January 1, 2018
|
Ongoing
|
|
9
|
Goodwill Precision Machinery (SuZhou) Co., Ltd
|
Machinery and gas circuit products, etc.
|
Non-fixed term from January 1, 2018
|
Ongoing
|
|
10
|
Wuxi PSK Technology Co., Ltd.
|
Machinery products, etc.
|
Non-fixed term from January 1, 2018
|
Ongoing
|
|
11
|
MKS Instruments (HK) Company Ltd.
|
Gas circuit and special equipment products, etc.
|
Non-fixed term from November 15, 2019
|
Ongoing
|
| ACM Research (Shanghai), Inc. |
[***] |
|
12
|
Entegris (Shanghai) Microelectronics Trading Co., Ltd.
|
Machinery, gas circuit and electrical products, etc.
|
Non-fixed term from January 5, 2017
|
Ongoing
|
|
13
|
Shanghai Chuanzhimeng Automation Equipment Co., Ltd.
|
Machinery, gas circuit, special equipment and electrical products, etc.
|
Non-fixed term from March 16, 2020
|
Ongoing
|
|
14
|
KBF Technology (Shanghai) Co., Ltd.
|
Machinery and gas circuit products, etc.
|
Non-fixed term from March 18, 2020
|
Ongoing
|
|
15
|
Shanghai Oriental Motor Co., Ltd.
|
Drive and electrical products, etc.
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
16
|
Horiba (China) Trading Co., Ltd.
|
Electrical, gas circuit and special equipment products, etc.
|
From March 26, 2020 to March 26, 2022
|
Ongoing
|
|
17
|
Shengyi Technology
|
Machinery, electrical, gas circuit, special equipment and materials transforming products, etc.
|
Non-fixed term from October 20, 2020
|
Ongoing
|
|
18
|
Yixun Automobile Equipment (Shanghai) Co., Ltd.
|
Machinery products, etc.
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
19
|
Art Precision Machinery (Suzhou) Co., Ltd.
|
Machinery, gas circuit and drive products, etc.
|
Non-fixed term from March 18, 2020
|
Ongoing
|
|
20
|
Heyan Electronic Technology (Shanghai) Co., Ltd.
|
Machinery, gas circuit, and special equipment products, etc.
|
Non-fixed term from October 20, 2020
|
Ongoing
|
|
21
|
Zhihui Precision Plastics (Shanghai) Co., Ltd.
|
Machinery products
|
Non-fixed term from March 16, 2020
|
Ongoing
|
|
22
|
Shanghai Etong Automation Equipment Co., Ltd.
|
Drive, electrical and materials transforming products, etc.
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
23
|
Shanghai Hongji Electronic Technology Co., Ltd.
|
Machinery, drive, electrical and gas circuit products, etc.
|
Non-fixed term from October 20, 2020
|
Ongoing
|
|
24
|
Nichias (SHANGHAI) Trading Co., Ltd.
|
Machinery and gas circuit products, etc.
|
Non-fixed term from October 20, 2020
|
Ongoing
|
| ACM Research (Shanghai), Inc. |
[***] |
|
25
|
MOTION ELECTRONICS CO., LIMITED
|
Machinery and gas circuit products, etc.
|
Non-fixed term from March 16, 2020
|
Ongoing
|
|
26
|
Beijing Kunlun Jincheng Technology Development Co., Ltd.
|
Gas circuit, electrical and special equipment products, etc.
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
27
|
Pall Filter (Beijing) Co., Ltd.
|
Gas circuit products, etc.
|
Non-fixed term from March 18, 2020
|
Ongoing
|
|
28
|
Suzhou Gemasun Machinery Equipment Co., Ltd.
|
Machinery products
|
Non-fixed term from March 16, 2020
|
Ongoing
|
|
29
|
Shanghai Hexiang Precision Machinery Co., Ltd.
|
Machinery products
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
30
|
Beijing Reje Automation Co., Ltd.
|
Gas circuit and materials transforming products, etc.
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
31
|
Suzhou Tomake Mechanical and Electrical Equipment Co., Ltd.
|
Machinery products
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
32
|
Shanghai Xinbi Industry Co., Ltd.
|
Gas circuit and electrical products, etc.
|
Non-fixed term from March 17, 2020
|
Ongoing
|
|
33
|
MARS(Method Application cReative System) CO., LTD
|
Gas circuit, electrical products, machinery and materials transforming products, etc.
|
Non-fixed term from March 20, 2019
|
Ongoing
|
|
S/N
|
Seller
|
Final Customer
|
Subject Matter of Contract
|
Contract
Price
|
Specified
Delivery Date
|
|
1
|
Issuer
|
Hynix
|
Cleaning equipment
|
365.00
|
August 4, 2018
|
|
2
|
Issuer
|
Sk Hynix Semiconductor (China) Ltd.
|
Cleaning equipment
|
5,646.79
|
Subject to the contract/order
|
|
3
|
CleanChip HK
|
Fujian Jinhua Integrated Circuit Co., Ltd.
|
Cleaning equipment
|
350.00
|
September 15, 2018
|
|
4
|
CleanChip HK
|
Huahong Semiconductor (Wuxi) Co., Ltd.
|
Cleaning equipment, advanced packaging wet process equipment
|
4,074.00
|
Subject to the contract/order
|
|
5
|
Chater Base International, CleanChip HK
|
Jiangyin Changdian Advanced Packaging Co., Ltd.
|
Advanced packaging wet process equipment, electroplating equipment
|
2,090.00
|
Subject to the contract/order
|
| ACM Research (Shanghai), Inc. |
[***] |
|
6
|
CleanChip HK
|
Jinruihong Technology (Quzhou) Co., Ltd.
|
Cleaning equipment
|
315.00
|
Subject to the contract/order
|
|
7
|
CleanChip HK
|
Shanghai Huahong Grace Semiconductor Manufacturing Corporation
|
Cleaning equipment
|
185.00
|
June 25, 2019
|
|
8
|
Chater Base International, CleanChip HK
|
Shanghai Huali Integrated Circuit Corporation
|
Cleaning equipment, vertical furnace tube, advanced packaging wet process equipment,
|
7,042.40
|
Subject to the contract/order
|
|
9
|
CleanChip HK
|
Shanghai Huali Microelectronics Corporation
|
Cleaning equipment
|
695.80
|
August 20, 2019
|
|
10
|
Chater Base International
|
ICRD
|
Cleaning equipment
|
400.00
|
4 months after execution of the contract
|
|
11
|
Issuer
|
Taiwan Phoenix Silicon
|
Cleaning equipment
|
326.90
|
January 10, 2019
|
|
12
|
ACMR, CleanChip HK
|
Yangtze Memory
|
Cleaning equipment
|
12,491.87
|
Subject to the contract/order
|
|
13
|
Chater Base International
|
JRH
|
Cleaning equipment
|
155.00
|
February 28, 2018
|
|
14
|
Chater Base International, CleanChip HK
|
Semiconductor Manufacturing North China (Beijing) Corporation
|
Cleaning equipment
|
1,582.00
|
Subject to the contract/order
|
|
15
|
CleanChip HK
|
Ningbo Semiconductor International Corporation
|
Cleaning equipment
|
220.00
|
4.5 months after receipt of the order
|
|
16
|
CleanChip HK
|
SMIC Southern Integrated Circuit Manufacturing Co., Ltd.
|
Cleaning equipment
|
600.00
|
Subject to the contract/order
|
|
17
|
CleanChip HK
|
SJsemi
|
Advanced packaging wet process equipment, electroplating equipment
|
324.70
|
Subject to the contract/order
|
|
18
|
Issuer
|
Shanghai Jingmeng Silicon Materials Co., Ltd.
|
Cleaning equipment
|
150.00
|
November 1, 2019
|
|
19
|
CleanChip HK
|
Xiamen Tongfu
|
Advanced packaging wet process equipment
|
290.00
|
Subject to the contract/order
|
|
20
|
CleanChip HK
|
Jiangsu CAS Microelectronics Integration Technology Co., Ltd.
|
Advanced packaging wet process equipment
|
171.00
|
Subject to the contract/order
|
|
21
|
CleanChip HK
|
Innotron Memory Co., Ltd.
|
Cleaning equipment
|
394.30
|
June 25, 2019
|
|
22
|
CleanChip HK
|
Xiamen Silan Microchip Manufacturing Co., Ltd.
|
Advanced packaging wet process equipment, cleaning equipment
|
627.00
|
Subject to the contract/order
|
| ACM Research (Shanghai), Inc. |
[***] |
|
23
|
CleanChip HK
|
Changdian Integrated Circuit (Shaoxing) Co., Ltd.
|
Electroplating equipment, advanced packaging wet process equipment
|
698.00
|
Subject to the contract/order
|
|
24
|
CleanChip HK
|
Zhengzhou Airport Economy Zone Waferworks Technology Corp.
|
Cleaning equipment
|
202.00
|
May 30, 2020
|
|
25
|
Issuer
|
Beijing Yitang Technology Co., Ltd.
|
Cleaning equipment
|
388.78
|
January 31, 2021
|
|
26
|
CleanChip HK
|
Jiangsu Xinde Semiconductor Technology Co., Ltd.
|
Advanced packaging wet process equipment
|
262.00
|
Subject to the contract/order
|
|
27
|
CleanChip HK
|
QL Electronics Science (Quzhou) Co., Ltd.
|
Automatic liquid supply system
|
366.40
|
Subject to the contract/order
|
|
28
|
CleanChip HK
|
ZING SEMI
|
Cleaning equipment
|
185.00
|
Subject to the contract/order
|
|
29
|
Issuer
|
Xincheng Technology (Shaoxing) Co., Ltd.
|
Cleaning equipment
|
332.83
|
December 31, 2020
|
|
S/N
|
Seller
|
Name of Customer
|
Subject Matter of Contract
|
Contract
Price
|
Specified
Delivery
Date
|
|
1
|
CleanChip HK
|
SJsemi
|
Electroplating equipment, advanced packaging wet process equipment
|
1,087.80
|
Subject to the contract/order
|
|
2
|
CleanChip HK
|
SMIC Southern Integrated Circuit Manufacturing Co., Ltd.
|
Cleaning equipment
|
308.00
|
September 14, 2020
|
|
3
|
Chater Base International
|
Semiconductor Manufacturing International (Shanghai) Corporation
|
Cleaning equipment
|
320.00
|
June 30, 2017
|
|
4
|
CleanChip HK
|
Semiconductor Manufacturing North China (Beijing) Corporation
|
Cleaning equipment
|
1,258.00
|
Subject to the contract/order
|
|
5
|
CleanChip HK
|
Yangtze Memory
|
Cleaning equipment, advanced packaging wet process equipment, electroplating equipment
|
5,129.78
|
Subject to the contract/order
|
| ACM Research (Shanghai), Inc. |
[***] |
|
6
|
CleanChip HK
|
Zing Semiconductor Corporation
|
Cleaning equipment
|
166.00
|
June 30, 2021
|
|
7
|
Issuer
|
Shanghai Huali Integrated Circuit Corporation
|
Cleaning equipment
|
338.00
|
Subject to the contract/order
|
|
8
|
Issuer, CleanChip HK
|
Innotron Memory Co., Ltd.
|
Cleaning equipment, electroplating equipment, advanced packaging wet process equipment
|
2,937.13
|
Subject to the contract/order
|
|
9
|
CleanChip HK
|
Jiangyin Changdian Advanced Packaging Co., Ltd.
|
Advanced packaging wet process equipment, stress free polishing equipment, electroplating equipment
|
1,306.50
|
Subject to the contract/order
|
|
10
|
CleanChip HK
|
Huahong Semiconductor (Wuxi) Co., Ltd.
|
Advanced packaging wet process equipment, cleaning equipment
|
1,456.00
|
Subject to the contract/order
|
|
11
|
Issuer
|
Nepes
|
Advanced packaging wet process equipment
|
282.40
|
Subject to the contract/order
|
|
12
|
Issuer, CleanChip HK
|
Shanghai Jita Semiconductor Co, Ltd.
|
Cleaning equipment
|
322.60
|
Subject to the contract/order
|
|
13
|
CleanChip HK
|
Changdian Integrated Circuit (Shaoxing) Co., Ltd.
|
Advanced packaging wet process equipment, electroplating equipment
|
963.00
|
Subject to the contract/order
|
|
14
|
Issuer, CleanChip HK
|
Xiamen Silan Microchip Manufacturing Co., Ltd.
|
Vertical furnace tube, cleaning equipment, advanced packaging wet process equipment
|
1,137.47
|
Subject to the contract/order
|
|
15
|
Issuer
|
Sk Hynix Semiconductor (China) Ltd.
|
Cleaning equipment
|
424.00
|
November 15, 2021
|
|
16
|
CleanChip HK
|
Shanghai Integrated Circuit Equipment& Materials Industry Innovation Center Co., Ltd.
|
Cleaning equipment, electroplating equipment
|
5,073.50
|
Subject to the contract/order
|
|
17
|
CleanChip HK
|
SiEn (Qingdao) Integrated Circuits Co., Ltd.
|
Cleaning equipment
|
585.00
|
March 18, 2021
|
|
18
|
CleanChip HK
|
Quliang Electronics Co., Ltd.
|
Electroplating equipment
|
385.00
|
May 30, 2021
|
| ACM Research (Shanghai), Inc. |
[***] |
|
19
|
Issuer, CleanChip HK
|
Beijing Yitang Technology Co., Ltd.
|
Cleaning equipment, electroplating equipment, advanced packaging wet process equipment
|
2,934.41
|
Subject to the contract/order
|
|
20
|
CleanChip HK
|
Hangzhou Liangdongxin Microelectronics Co., Ltd.
|
Electroplating equipment
|
286.00
|
Subject to the contract/order
|
|
21
|
Issuer, CleanChip HK
|
Nexchip Semiconductor Corporation
|
Cleaning equipment
|
718.00
|
4 months after receipt of the order
|
|
22
|
Issuer
|
NCAP
|
Electroplating equipment
|
280.00
|
4 months after execution of the contract
|
|
23
|
CleanChip HK
|
Jiangsu Xinde Semiconductor Technology Co., Ltd.
|
Advanced packaging wet process equipment
|
383.00
|
Subject to the contract/order
|
|
24
|
CleanChip HK
|
QL Electronics Science (Quzhou) Co., Ltd.
|
Cleaning equipment
|
167.50
|
June 3, 2021
|
|
25
|
CleanChip HK
|
Ningbo Semiconductor International Corporation
|
Advanced packaging wet process equipment
|
498.00
|
Subject to the contract/order
|
|
26
|
Issuer
|
North IC Technology Innovation Center (Beijing) Co., Ltd.
|
Electroplating equipment
|
455.00
|
Subject to the contract/order
|
|
27
|
Issuer
|
Chengdu Tianfu New Area Tianfu Laboratory
|
Cleaning equipment
|
170.30
|
Within 6 months after the contract coming into effect
|
|
28
|
CleanChip HK
|
Texas Instruments Semiconductor Manufacturing (Chengdu) Co., Ltd.
|
Advanced packaging wet process equipment
|
192.00
|
Subject to the contract/order
|
|
29
|
CleanChip HK
|
Geke Semiconductor (Shanghai) Co., Ltd.
|
Cleaning equipment
|
1,705.00
|
Subject to the contract/order
|
|
30
|
CleanChip HK
|
Guangzhou Cansemi Technology Inc.
|
Cleaning equipment
|
345.00
|
July 30, 2021
|
|
31
|
CleanChip HK
|
Hangzhou Fullsemi Semiconductor Co., Ltd
|
Cleaning equipment
|
235.00
|
June 2022
|
|
32
|
Issuer
|
Hefei Seeya Display Technology Co., Ltd.
|
Cleaning equipment
|
185.00
|
February 20, 2022
|
|
33
|
CleanChip HK
|
Hubei 3d Semiconductor Integrated Innovation Center Co., Ltd.
|
Electroplating equipment
|
470.00
|
November 18, 2021
|
|
34
|
CleanChip HK
|
Maxscend Microelectronics Company Limited
|
Cleaning equipment, electroplating equipment, advanced packaging wet process equipment
|
1,343.00
|
Subject to the contract/order
|
| ACM Research (Shanghai), Inc. |
[***] |
|
35
|
Issuer
|
Nantong Tongfu Technology Co., Ltd.
|
Electroplating equipment
|
402.80
|
January 15, 2022
|
|
36
|
CleanChip HK
|
Xiamen Tongfu
|
Advanced packaging wet process equipment
|
288.00
|
September 30, 2021
|
|
37
|
CleanChip HK
|
SIWAVE, Inc
|
Cleaning equipment, advanced packaging wet process equipment
|
575.00
|
Subject to the contract/order
|
|
38
|
Issuer
|
Shenzhen Ameston Electronic Co., Ltd.
|
Cleaning equipment, electroplating equipment, advanced packaging wet process equipment
|
1,540.60
|
Subject to the contract/order
|
|
39
|
CleanChip HK
|
Wuhan Xinxin Semiconductor Manufacturing Co., Ltd.
|
Cleaning equipment, advanced packaging wet process equipment
|
298.00
|
Subject to the contract/order
|
|
40
|
Issuer, CleanChip HK
|
Zhejiang ICsprout Semiconductor Co., Ltd.
|
Cleaning equipment, advanced packaging wet process equipment
|
490.00
|
Subject to the contract/order
|
|
41
|
Issuer, CleanChip HK
|
Zhe Jiang He Xin Semiconductor Co., Ltd.
|
Electroplating equipment, advanced packaging wet process equipment
|
635.00
|
Subject to the contract/order
|
|
42
|
Issuer
|
Institute of Optics and Electronics
|
Cleaning equipment
|
170.99
|
Within 6 months after execution of the contract
|
|
43
|
CleanChip HK
|
SMIC International Integrated Circuit Manufacturing (Shenzhen) Co., Ltd.
|
Cleaning equipment
|
370.00
|
August 1, 2021
|
| ACM Research (Shanghai), Inc. |
[***] |
|
S/N
|
Lender
|
Borrower
|
Contract Name
|
Contract
Amount
|
Term
|
|
1
|
China Merchants Bank, Subbranch of Lingang New Area, China (Shanghai) Pilot Free Trade Zone
|
Shengwei Shanghai
|
Loan and Mortgage Contract for Corporate House Purchase (No.: ZJ02201111)
|
RMB 128.5 million Yuan
|
November 26, 2020 to November 25, 2030
|
|
2
|
Bank of Shanghai Pudong Branch
|
Issuer
|
Foreign Exchange Liquidity Revolving Loan Contract (No.: 20121041002)
|
US$15 million
|
June 1, 2021 to May 10, 2023
|
|
3
|
Bank of Shanghai Pudong Branch
|
Issuer
|
Liquidity Revolving Loan Contract (No.: 20121041001)
|
RMB 100
million Yuan
|
June 1, 2021 to May 10, 2023
|
|
4
|
Bank of China Shanghai Pudong Development Zone Sub-branch
|
Issuer
|
Liquidity Loan Contract (No.: M122021PK(GS)40)
|
RMB 10
million Yuan
|
June 4, 2021 to June 4, 2024
|
|
5
|
Bank of China Shanghai Pudong Development Zone Sub-branch
|
Issuer
|
Liquidity Loan Contract (No.: M122021PK(GS)42)
|
RMB 19.9
million Yuan
|
June 15, 2021 to June 15, 2022
|
|
6
|
Bank of China Shanghai Pudong Development Zone Sub-branch
|
Issuer
|
Liquidity Loan Contract (No.: M122021PK(GS)81)
|
RMB 35
million Yuan
|
September 18, 2021 to September 18, 2024
|
|
S/N
|
Credit Grantor
|
Credit Receiver
|
Contract Name
|
Maximum Credit Line
|
Term
|
|
1
|
Bank of China Shanghai Pudong Development Zone Sub-branch
|
Issuer
|
Credit Line Agreement (No.: E012021PK(GS)42)
|
RMB 40 million Yuan
|
June 11, 2021 to December 30, 2021
|
|
2
|
China Everbright Bank Shanghai Branch
|
Issuer
|
Comprehensive Credit Agreement (No.: 3675012021003)
|
RMB 150 million Yuan
|
July 1, 2021 to June 30, 2024
|
|
3
|
Bank of Shanghai Pudong Branch
|
Issuer
|
Comprehensive Credit Contract (No.: 201210410)
|
RMB 100 million Yuan
|
June 1, 2021 to May 10, 2023
|
|
S/N
|
Lender
|
Guarantor
|
Contract
|
Guarantee Amount
|
Term
|
|
1
|
China Merchants Bank, Subbranch of Lingang New Area, China (Shanghai) Pilot Free Trade Zone
|
ACMSH
|
Irrevocable Guarantee (No.: ZJ02201111)
|
RMB 128.5 million Yuan
|
From the effective date of the guarantee to the maturity date of loan or other debt, three years from the date of disbursement
|
|
2
|
Bank of Shanghai Pudong Branch
|
CleanChip HK
|
Maximum Amount Guarantee Contract (No.: ZDB201210410)
|
RMB 120 million Yuan
|
June 1, 2021 to May 10, 2023
|
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
|
HUI WANG
|
HAIPING DUN
|
||
|
STEPHEN SUN-HAI CHIAO
|
QIANLI LUO
|
||
|
JIANG LI
|
|||
|
CHEN HUANG
|
DI ZHANG
|
||
|
MINGXIU PENG
|
ZHANBING REN
|
||
|
SUTONG ZHANG
|
|
ACM Research (Shanghai), Inc.
|
|
|
Date:
|
| ACM Research (Shanghai), Inc. |
[***] |
|
TRACY DONG LIU
|
QIAN DONG
|
||
|
QIAN LI
|
|
JIAN WANG
|
FUPING CHEN
|
||
|
SOTHEARA CHEAV
|
LISA YI LU FENG
|
||
|
MINGZHU LUO
|
|
Date:
|
| ACM Research (Shanghai), Inc. |
[***] |
|
|
||
|
HUI WANG
|
|
ACM RESEARCH, INC.
|
|
|
Date:
|
| ACM Research (Shanghai), Inc. |
[***] |
|
|
||
|
HUI WANG
|
|
ACM Research (Shanghai), Inc.
|
|
|
Date:
|
| ACM Research (Shanghai), Inc. |
[***] |
|
Signed by the Project Co-organizer:
|
||||
|
Signed by the Sponsor Deputy:
|
||||
|
BOWEN ZHANG
|
LING LI
|
|||
|
Signed by the Sponsor’s General Manager:
|
||||
|
JUN LI
|
||||
|
Signed by the Sponsor’s President and Legal Representative:
|
||||
|
JIE ZHOU
|
||||
| [***] | ||||
| Date: | ||||
| ACM Research (Shanghai), Inc. |
[***] |
|
Signed by the Sponsor’s General Manager:
|
||
|
JUN LI
|
||
|
Signed by the Sponsor’s President:
|
||
|
JIE ZHOU
|
||
|
[***]
|
||
|
Date:
|
| ACM Research (Shanghai), Inc. |
[***] |
|
JIE ZHOU
|
||||
| [***] | ||||
| Date: |
| ACM Research (Shanghai), Inc. |
[***] |
|
Legal Representative:
|
||
|
RUJUN SHEN
|
||
|
[***]
|
||
|
Date:
|
||
| ACM Research (Shanghai), Inc. |
[***] |
|
Person in Charge:
|
||||||
|
LING WANG
|
||||||
|
Handling Lawyers:
|
||||||
|
HUI XU
|
FUAN CHEN
|
ANRONG WANG
|
||||
|
|
King & Wood Mallesons
|
|
|
Date: [ ], 2021
|
| ACM Research (Shanghai), Inc. |
[***] |
|
ZHIGUO YANG
|
|
YI TANG
|
JING ZHAO
|
|
|
[ ], 2021 |
| ACM Research (Shanghai), Inc. |
[***] |
|
Signed by the Certified Public Valuers:
|
||||
|
WEI LIU
|
QIQUAN GE
|
|||
|
Signed by the Legal Representative or Authorized Representative:
|
||||
|
ZHI HU
|
||||
|
|
China United Assets Appraisal Group Co., Ltd. |
| Date: |
| ACM Research (Shanghai), Inc. |
[***] |
|
ZHIGUO YANG
|
|
YI TANG
|
BAOYAN YIN
|
|
|
Date: |
| ACM Research (Shanghai), Inc. |
[***] |
| ACM Research (Shanghai), Inc. |
[***] |
| (1) |
Letter of sponsorship for offering;
|
| (2) |
Letter of sponsorship for listing;
|
| (3) |
Legal opinions;
|
| (4) |
Financial reports and audit reports;
|
| (5) |
Articles of Association (Draft);
|
| (6) |
Letters of commitments made by the Issuer and other responsible parties in connection with the Offering and listing;
|
| (7) |
Relevant financial statements and review reports (if any) between the base date of the Issuer’s audit report and the
execution date of this [***];
|
| (8) |
Profit forecast report and audit report (if any);
|
| (9) |
Internal control verification report;
|
| (10) |
Non-recurring income statement verified by certified public accountants;
|
| (11) |
Documents from CSRC approving the Issuer’s registration for the Offering;
|
| (12) |
Other important documents relating to the Offering.
|
| ACM Research (Shanghai), Inc. |
[***] |
|
S/N
|
Patentee
|
Patent Name
|
Patent
Type
|
Patent No.
|
Patent
Application Date
|
Registr
ation
Place
|
|
1
|
Issuer
|
Heat treatment method and device for semiconductor workpieces
|
Invention
|
ZL200710046405.9
|
September 26, 2007
|
China
|
|
2
|
Issuer
|
electroplating apparatus for electroplating metal on semi-conductor wok piece
|
Invention
|
ZL200710172314.X
|
December 14, 2007
|
China
|
|
3
|
Issuer
|
Method and device for cleaning semiconductor chip
|
Invention
|
ZL200810034827.9
|
March 20, 2008
|
China
|
|
4
|
Issuer
|
Heat treatment method and device for semiconductor workpieces
|
Invention
|
ZL200710046404.4
|
September 26, 2007
|
China
|
|
5
|
Issuer
|
Device or method for preparing solution for processing single wafer semiconductor
|
Invention
|
ZL200810037270.4
|
May 12, 2008
|
China
|
|
6
|
Issuer
|
Invention
|
ZL200810034826.4
|
March 20, 2008
|
China
|
|
|
7
|
Issuer
|
Invention
|
ZL200810037271.9
|
May 12, 2008
|
China
|
|
|
8
|
Issuer
|
Invention
|
ZL200910050834.2
|
May 8, 2009
|
China
|
|
|
9
|
Issuer
|
Invention
|
ZL200710172313.5
|
December 14, 2007
|
China
|
|
|
10
|
Issuer
|
Utility Model
|
ZL201320216748.6
|
April 25, 2013
|
China
|
|
|
11
|
Issuer
|
Wet process equipment
|
Design
|
ZL201330546123.1
|
November 14, 2013
|
China
|
|
12
|
Issuer
|
Method and device for removing barrier layer
|
Invention
|
ZL200910050835.7
|
May 8, 2009
|
China
|
|
13
|
Issuer
|
Invention
|
ZL200910053774.×
|
June 25, 2009
|
China
|
|
|
14
|
Issuer
|
Invention
|
ZL200810203809.9
|
December 1, 2008
|
China
|
|
|
15
|
Issuer
|
Invention
|
ZL201210369969.7
|
September 27, 2012
|
China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
16
|
Issuer
|
Utility Model
|
ZL201520110723.7
|
February 15, 2015
|
China
|
|
|
17
|
Issuer
|
Invention
|
ZL201280071561.X
|
March 28, 2012
|
China
|
|
|
18
|
Issuer
|
Method and device for realizing deep hole uniform metal interconnection on semiconductor silicon chip
|
Invention
|
ZL201110365926.7
|
November 17,
2011
|
China
|
|
19
|
Issuer
|
Invention
|
ZL201210163145.4
|
May 22, 2012
|
China
|
|
|
20
|
Issuer
|
Vacuum chuck for electropolishing and/or electroplating
|
Invention
|
ZL201280071572.8
|
March 28, 2012
|
China
|
|
21
|
Issuer
|
Method and apparatus for pulse electrochemical polishing
|
Invention
|
ZL201280073426.9
|
May 24, 2012
|
China
|
|
22
|
Issuer
|
Device and method for cleaning reverse side of wafer
|
Invention
|
ZL201210220445.1
|
June 28, 2012
|
China
|
|
23
|
Issuer
|
Invention
|
ZL201280071560.5
|
March 30, 2012
|
China
|
|
|
24
|
Issuer
|
Invention
|
ZL201210292690.3
|
August 16, 2012
|
China
|
|
|
25
|
Issuer
|
Barrier layer removal method and barrier layer removal device
|
Invention
|
ZL201410257649.1
|
May 8, 2009
|
China
|
|
26
|
Issuer
|
Invention
|
ZL201210243831.2
|
July 13, 2012
|
China
|
|
|
27
|
Issuer
|
Invention
|
ZL201210163151.X
|
May 22, 2012
|
China
|
|
|
28
|
Issuer
|
Invention
|
ZL201210491738.3
|
November 27,
2012
|
China
|
|
|
29
|
Issuer
|
Invention
|
ZL201280077256.1
|
November 28,
2012
|
China
|
|
|
30
|
Issuer
|
Invention
|
ZL201380076475.2
|
May 9, 2013
|
China
|
|
|
31
|
Issuer
|
Invention
|
ZL201210089507.X
|
March 30, 2012
|
China
|
|
|
32
|
Issuer
|
Invention
|
ZL201310116848.6
|
April 7, 2013
|
China
|
|
|
33
|
Issuer
|
Invention
|
ZL201210189044.4
|
June 8, 2012
|
China
|
|
|
34
|
Issuer
|
Invention
|
ZL201210369944.7
|
September 27,
2012
|
China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
35
|
Issuer
|
Invention
|
ZL201210499934.5
|
November 29,
2012
|
China
|
|
|
36
|
Issuer
|
Invention
|
ZL201210214030.3
|
June 26, 2012
|
China
|
|
|
37
|
Issuer
|
Invention
|
ZL201210366048.5
|
September 27,
2012
|
China
|
|
|
38
|
Issuer
|
Invention
|
ZL201280077584.1
|
December 10,
2012
|
China
|
|
|
39
|
Issuer
|
Invention
|
ZL201380075887.4
|
April 22, 2013
|
China
|
|
|
40
|
Issuer
|
Invention
|
ZL201210089500.8
|
March 30, 2012
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China
|
|
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41
|
Issuer
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Invention
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ZL201310335864.4
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August 2, 2013
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China
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|
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42
|
Issuer
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Invention
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ZL201210375488.7
|
September 27,
2012 |
China
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|
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43
|
Issuer
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Invention
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ZL201210491746.8
|
November 27,
2012
|
China
|
|
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44
|
Issuer
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Invention
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ZL201280077240.0
|
November 27,
2012
|
China
|
|
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45
|
Issuer
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Invention
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ZL201310117998.9
|
April 7, 2013
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China
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46
|
Issuer
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Invention
|
ZL201210292475.3
|
August 16, 2012
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China
|
|
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47
|
Issuer
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Invention
|
ZL201210213955.6
|
June 26, 2012
|
China
|
|
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48
|
Issuer
|
Invention
|
ZL201210290651.X
|
August 15, 2012
|
China
|
|
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49
|
Issuer
|
Invention
|
ZL201410236079.8
|
May 30, 2014
|
China
|
|
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50
|
Issuer
|
Invention
|
ZL201210292689.0
|
August 16, 2012
|
China
|
|
|
51
|
Issuer
|
Invention
|
ZL201210501578.6
|
November 30,
2012
|
China
|
|
|
52
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Issuer
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Invention
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ZL201310167821.X
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May 8, 2013
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China
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| ACM Research (Shanghai), Inc. |
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53
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Issuer
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Invention
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ZL201210290586.0
|
August 15, 2012
|
China
|
|
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54
|
Issuer
|
Invention
|
ZL201310566941.7
|
November 14,
2013 |
China
|
|
|
55
|
Issuer
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Invention
|
ZL201410067707.4
|
February 26, 2014
|
China
|
|
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56
|
Issuer
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Invention
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ZL201410131557.9
|
April 2, 2014
|
China
|
|
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57
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Issuer
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Invention
|
ZL201210366144.X
|
September 27,
2012
|
China
|
|
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58
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Issuer
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Invention
|
ZL201310166862.7
|
May 8, 2013
|
China
|
|
|
59
|
Issuer
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Invention
|
ZL201310567168.6
|
November 14,
2013 |
China
|
|
|
60
|
Issuer
|
Invention
|
ZL201410117472.5
|
March 26, 2014
|
China
|
|
|
61
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Issuer
|
Invention
|
ZL201410190482.1
|
May 7, 2014
|
China
|
|
|
62
|
Issuer
|
Invention
|
ZL201410512483.3
|
September 29,
2014 |
China
|
|
|
63
|
Issuer
|
Invention
|
ZL201310169389.8
|
May 9, 2013
|
China
|
|
|
64
|
Issuer
|
Invention
|
ZL201410067724.8
|
February 26, 2014
|
China
|
|
|
65
|
Issuer
|
Invention
|
ZL201380077368.1
|
June 19, 2013
|
China
|
|
|
66
|
Issuer
|
Invention
|
ZL201410235896.1
|
May 30, 2014
|
China
|
|
|
67
|
Issuer
|
Invention
|
ZL201480079797.7
|
July 8, 2014
|
China
|
|
|
68
|
Issuer
|
Invention
|
ZL201410110796.6
|
March 24, 2014
|
China
|
|
|
69
|
Issuer
|
Invention
|
ZL201410190424.9
|
May 7, 2014
|
China
|
|
|
70
|
Issuer
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Invention
|
ZL201410235876.4
|
May 30, 2014
|
China
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| ACM Research (Shanghai), Inc. |
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71
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Issuer
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Invention
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ZL201380075888.9
|
April 22, 2013
|
China
|
|
|
72
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Issuer
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Invention
|
ZL201410512787.X
|
September 29,
2014
|
China
|
|
|
73
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NOMURA
MICRO
SCIENCE
KK; Issuer;
HJS ENG
CO LTD
|
Invention
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ZL201610561383.9
|
July 15, 2016
|
China
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|
|
74
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Issuer
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Invention
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ZL201480082120.9
|
September 26,
2014
|
China
|
|
|
75
|
Issuer
|
Invention
|
ZL201410235874.5
|
May 30, 2014
|
China
|
|
|
76
|
Issuer
|
Invention
|
ZL201410365997.0
|
July 29, 2014
|
China
|
|
|
77
|
Issuer
|
Invention
|
ZL201310553969.7
|
November 8,
2013
|
China
|
|
|
78
|
Issuer
|
Invention
|
ZL201310553944.7
|
November 8,
2013
|
China
|
|
|
79
|
Issuer
|
Invention
|
ZL201410235865.6
|
May 30, 2014
|
China
|
|
|
80
|
Issuer
|
Invention
|
ZL201280072827.2
|
May 2, 2012
|
China
|
|
|
81
|
Issuer
|
Invention
|
ZL201310169431.6
|
May 9, 2013
|
China
|
|
|
82
|
Issuer
|
Invention
|
ZL201310566899.9
|
November 14,
2013
|
China
|
|
|
83
|
Issuer
|
Invention
|
ZL201410066813.0
|
February 26, 2014
|
China
|
|
|
84
|
Issuer
|
Invention
|
ZL201410196004.1
|
May 9, 2014
|
China
|
|
|
85
|
Issuer
|
Invention
|
ZL201410366139.8
|
July 29, 2014
|
China
|
|
|
86
|
Issuer
|
Invention
|
ZL201310567261.7
|
November 14,
2013
|
China
|
|
|
87
|
Issuer
|
Invention
|
ZL201410366491.1
|
July 29, 2014
|
China
|
|
|
88
|
Issuer
|
Invention
|
ZL201410366155.7
|
July 29, 2014
|
China
|
|
|
89
|
Issuer
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Invention
|
ZL201410366212.1
|
July 29, 2014
|
China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
90
|
Issuer
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Device for processing semiconductor structure
|
Invention
|
ZL201410513602.7
|
September 29, 2014
|
China
|
|
91
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Issuer
|
Wafer gluing equipment
|
Invention
|
ZL201410366461.0
|
July 29, 2014
|
China
|
|
92
|
Issuer
|
Polishing disk and cooling device thereof
|
Invention
|
ZL201410235835.5
|
May 30, 2014
|
China
|
|
93
|
Issuer
|
Method for improving polishing uniformity of wafer
|
Invention
|
ZL201410236044.4
|
May 30, 2014
|
China
|
|
94
|
Issuer
|
Workpiece processing device
|
Invention
|
ZL201310553898.0
|
November 8, 2013
|
China
|
|
95
|
Issuer
|
Gelatinizing equipment and framework thereof
|
Invention
|
ZL201410365925.6
|
July 29, 2014
|
China
|
|
96
|
Issuer
|
Levelness measuring device and method
|
Invention
|
ZL201410066598.4
|
February 26, 2014
|
China
|
|
97
|
Issuer
|
Recovery device for metal ions in electrochemical
polishing solutions
|
Invention
|
ZL201410512977.1
|
September 29, 2014
|
China
|
|
98
|
Issuer
|
Method for forming semiconductor structures
|
Invention
|
ZL201310566058.8
|
November 14, 2013
|
China
|
|
99
|
Issuer
|
Metal coating processing method
|
Invention
|
ZL201310330145.3
|
July 31, 2013
|
China
|
|
100
|
Issuer
|
Apparatus For Holding Substrate
|
Invention
|
ZL201580085077.6
|
December 4, 2015
|
China
|
|
101
|
Issuer
|
Horizontal adjusting device for chuck and method utilizing
device to horizontally adjust chuck
|
Invention
|
ZL201410513026.6
|
September 29, 2014
|
China
|
|
102
|
Issuer
|
Uniform air flow device
|
Invention
|
ZL201410366171.6
|
July 29, 2014
|
China
|
|
103
|
Issuer
|
Gumming machine with automatic cleaning function and automatic
cleaning method for gumming machine
|
Invention
|
ZL201510242142.3
|
May 13, 2015
|
China
|
|
104
|
Issuer
|
Coaxial adjusting device and coaxial adjusting method
using the same
|
Invention
|
ZL201510081687.0
|
February 15, 2015
|
China
|
|
105
|
Issuer
|
Falling-prevention semiconductor cleaning device
|
Invention
|
ZL201510081989.8
|
February 15, 2015
|
China
|
|
106
|
Issuer
|
Two-sided vapor-phase etching device
|
Invention
|
ZL201410512991.1
|
September 29, 2014
|
China
|
|
107
|
Issuer
|
Brush moving device of semiconductor cleaning device
|
Invention
|
ZL201410366503.0
|
July 29, 2014
|
China
|
|
108
|
Issuer
|
Copper-plated thinning integrated device
|
Invention
|
ZL201410190951.X
|
May 7, 2014
|
China
|
|
109
|
Issuer
|
Measuring apparatus and method for semiconductor wafer
|
Invention
|
ZL 2015100808855
|
February 15, 2015
|
China
|
|
110
|
Issuer
|
End point detection method of semiconductor etching process
|
Invention
|
ZL 2015100819455
|
February 15, 2015
|
China
|
|
111
|
Issuer
|
Current stabilizer
|
Invention
|
ZL 201410365759X
|
July 29, 2014
|
China
|
|
112
|
Issuer
|
Method for electrochemical polish in constant voltage mode
|
Invention
|
ZL 2015800839194
|
October 30, 2015
|
China
|
|
113
|
Issuer
|
Automatic correcting method for radial thickness
|
Invention
|
ZL 2014101161195
|
March 26, 2014
|
China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
114
|
Issuer
|
Base plate transmitting cabin in semiconductor device
|
Invention
|
ZL 2015100812206
|
February 15, 2015
|
China
|
|
115
|
Issuer
|
Dual-axis alignment apparatus and method in
semiconductor device
|
Invention
|
ZL 2015100818221
|
February 15, 2015
|
China
|
|
116
|
Issuer
|
Cleaning method for semiconductor structure
|
Invention
|
ZL 2015100818819
|
February 15, 2015
|
China
|
|
117
|
Issuer
|
Method for reducing surface roughness of wafer
|
Invention
|
ZL 2015100818876
|
February 15, 2015
|
China
|
|
118
|
Issuer
|
Polishing method for high-K-dielectric silicon wafer
|
Invention
|
ZL 2015100819972
|
February 15, 2015
|
China
|
|
119
|
Issuer
|
Method for removing residual substance in semiconductor
processing
|
Invention
|
ZL 2015102528806
|
May 18, 2015
|
China
|
|
120
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Issuer
|
Flow compensation method
|
Invention
|
ZL 2015104208342
|
July 17, 2015
|
China
|
|
121
|
Issuer
|
Semiconductor pre-wetting device and semiconductor
pre-wetting method
|
Invention
|
ZL 2014105124706
|
September 29, 2014
|
China
|
|
122
|
Issuer
|
Pre-wetting method of semiconductor substrate
|
Invention
|
ZL 2014105125107
|
September 29, 2014
|
China
|
|
123
|
Issuer
|
Device and method for conducting uniform metallization
on substrate
|
Invention
|
ZL 2015100865133
|
February 17, 2015
|
China
|
|
124
|
Issuer
|
Unstressed electrochemical polishing method
|
Invention
|
ZL 2015102511400
|
May 18, 2015
|
China
|
|
125
|
Issuer
|
Wafer rotating chuck optimized on basis of cathode spray
head position change
|
Invention
|
ZL 2015104187609
|
July 16, 2015
|
China
|
|
126
|
Issuer
|
Alignment device and method
|
Invention
|
ZL 2013104325807
|
September 22, 2013
|
China
|
|
127
|
Issuer
|
Method for electrochemical polishing of metal
interconnection wafer structure
|
Invention
|
ZL 2014105135382
|
September 29, 2014
|
China
|
|
128
|
Issuer
|
A fall-proof apparatus for cleaning semiconductor
devices and a chamber
with the apparatus
|
Invention
|
ZL 2015800757160
|
September 8, 2015
|
China
|
|
129
|
Issuer
|
Method for optimizing metal planarization process
|
Invention
|
ZL 201580076084X
|
February 15, 2015
|
China
|
|
130
|
Issuer
|
Two-sided vapor etching device for wafer
|
Invention
|
ZL 2014105124918
|
September 29, 2014
|
China
|
|
131
|
Issuer
|
Wafer rotating chuck achieving optimization based on
position of anode sprayer
|
Invention
|
2015104187562
|
July 16, 2015
|
China
|
|
132
|
Issuer
|
Automatic correcting method for voltage
|
Invention
|
201510252932X
|
May 18, 2015
|
China
|
|
133
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Issuer
|
Semiconductor machining device and technological method for
machining semiconductor workpiece
|
Invention
|
2014102360213
|
May 30, 2014
|
China
|
|
134
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Issuer
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Magnetic connecting device
|
Invention
|
2014102358622
|
May 30, 2014
|
China
|
|
135
|
Issuer
|
Semiconductor substrate heat treatment device
|
Invention
|
2014102381351
|
May 30, 2014
|
China
|
| ACM Research (Shanghai), Inc. |
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136
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Issuer
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Optical radiation heating etching device and method
|
Invention
|
2015102434090
|
May 13, 2015
|
China
|
|
137
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Issuer
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Method and apparatus for integrated substrate
cleaning and drying
|
Invention
|
2015800760750
|
February 15, 2015
|
China
|
|
138
|
Issuer
|
Wafer processing device
|
Invention
|
2014100677233
|
February 26, 2014
|
China
|
|
139
|
Issuer
|
Dry-process cleaning cavity and dry-process cleaning method
|
Invention
|
2015104187986
|
July 16, 2015
|
China
|
|
140
|
Issuer
|
Etching method
|
Invention
|
2015103674119
|
June 29, 2015
|
China
|
|
141
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Issuer
|
Rotary gluing method for semiconductor chip
|
Invention
|
2014105136597
|
September 29, 2014
|
China
|
|
142
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Issuer
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Barrier layer removal method and semiconductor
structure forming method
|
Invention
|
2014800826931
|
October 17, 2014
|
China
|
|
143
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Issuer
|
Apparatus for substrate bevel and backside protection
|
Invention
|
201580079977X
|
May 14, 2015
|
China
|
|
144
|
Issuer
|
Flow control method
|
Invention
|
2014103672617
|
July 29, 2014
|
China
|
|
145
|
Issuer
|
Method for polishing wafers
|
Invention
|
2016103532485
|
May 25, 2016
|
China
|
|
146
|
Issuer
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Method for removing barrier layer for minimizing
sidewall recess
|
Invention
|
2015800754001
|
February 15, 2015
|
China
|
|
147
|
Issuer
|
Method of reducing thickness of copper film
|
Invention
|
201610292045X
|
May 5, 2016
|
China
|
|
148
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Issuer
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Semiconductor substrate developing apparatus and semiconductor
substrate developing method
|
Invention
|
2014102359979
|
May 30, 2014
|
China
|
|
149
|
Issuer
|
Vapor phase etching method of copper interconnection structure
|
Invention
|
2015103731874
|
June 30, 2015
|
China
|
|
150
|
Issuer
|
Integrated circuit substrate cleaning equipment
|
Invention
|
2016102558596
|
April 22, 2016
|
China
|
|
151
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Issuer
|
Electroplating tank
|
Invention
|
2016107043168
|
August 22, 2016
|
China
|
|
152
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Issuer
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Apparatus and method for removing film on edge of
backside of wafer
|
Invention
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2014800796033
|
June 6, 2014
|
China
|
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Patentee
|
Patent Name
|
Patent
Type
|
Patent No.
|
Patent
Application Date
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Registration
Place
|
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1
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Issuer
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METHODES AND APPARATUS FOR
CLEANING
SEMICONDUCTOR WAFERS
|
Invention
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4994501
|
December 10, 2007
|
Japan
|
|
2
|
Issuer
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METHODS AND APPARATUS FOR
CLEANING
SEMICONDUCTOR WAFERS
|
Invention
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5367840
|
December 12, 2008
|
Japan
|
|
3
|
Issuer
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BARRIER LAYER REMOVAL METHOD AND APPARATUS
|
Invention
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5412517
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August 20, 2008
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Japan
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| ACM Research (Shanghai), Inc. |
[***] |
|
4
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Issuer
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SOLUTION PREPARATION APPARATUS
AND
METHOD FOR TREATING INDIVIDUAL
SEMICONDUCTOR WORKPIECE
|
Invention
|
5442705
|
March 17, 2008
|
Japan
|
|
5
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
5466638
|
July 5, 2007
|
Japan
|
|
6
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
5648047
|
March 31, 2009
|
Japan
|
|
7
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING
FLIP CHIP ASSEMBLIES
|
Invention
|
6063944
|
September 22, 2011
|
Japan
|
|
8
|
Issuer
|
NOZZLE FOR STRESS-FREE POLISHING
METAL
LAYERS ON SEMICONDUCTOR WAFERS
|
Invention
|
6076458
|
March 30, 2012
|
Japan
|
|
9
|
Issuer
|
METHODS AND APPARATUS FOR
UNIFORMLY METALLIZATION
ON SUBSTRATES
|
Invention
|
6113154
|
June 24, 2011
|
Japan
|
|
10
|
NOMURA
MICRO
SCIENCE KK;
Issuer; HJS
ENG CO LTD
|
WASHING HYDROGEN WATER PRODUCING METHOD
AND PRODUCING APPARATUS
|
Invention
|
6154860
|
July 17, 2015
|
Japan
|
|
11
|
Issuer
|
METHOD AND APPARATUS FOR UNIFORMLY
METALLIZATION ON SUBSTRATE
|
Invention
|
6162881
|
April 22, 2013
|
Japan
|
|
12
|
Issuer
|
APPARATUS AND METHOD FOR PLATING
AND/OR POLISHING WAFER
|
Invention
|
6186499
|
May 9, 2013
|
Japan
|
|
13
|
Issuer
|
SUBSTRATE SUPPORTING APPARATUS
|
Invention
|
6198840
|
November 27, 2012
|
Japan
|
|
14
|
NOMURA
MICRO
SCIENCE KK;
Issuer; HJS
ENG CO LTD
|
FUNCTIONAL WATER PRODUCING APPARATUS AND
FUNCTIONAL
WATER PRODUCING METHOD
|
Invention
|
6232086
|
January 29, 2016
|
Japan
|
|
15
|
Issuer
|
METHOD AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
6275155
|
November 28, 2012
|
Japan
|
|
16
|
Issuer
|
METHOD FOR FORMING METAL
INTERCONNECTION
|
Invention
|
6301003
|
July 8, 2014
|
Japan
|
|
17
|
Issuer
|
APPARATUS AND METHOD FOR PLATING AND/OR POLISHING WAFER
|
Invention
|
6431128
|
May 9, 2013
|
Japan
|
|
18
|
Issuer
|
BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR STRUCTURE FORMING METHOD
|
Invention
|
6438131
|
October 17, 2014
|
Japan
|
| ACM Research (Shanghai), Inc. |
[***] |
|
19
|
Issuer
|
APPARATUS AND METHOD FOR CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
6490202
|
September 26, 2014
|
Japan
|
|
20
|
Issuer
|
METHOD FOR REMOVING BARRIER LAYER FOR
MINIMIZING SIDEWALL RECESS
|
Invention
|
6574486
|
February 15, 2015
|
Japan
|
|
21
|
Issuer
|
APPARATUS FOR SUBSTRATE BEVEL AND
BACKSIDE PROTECTION
|
Invention
|
6592529
|
May 14, 2015
|
Japan
|
|
22
|
Issuer
|
A FALL-PROOF APPARATUS FOR CLEANING SEMICONDUCTOR
DEVICES AND A CHAMBER WITH THE APPARATUS
|
Invention
|
6591555
|
September 8, 2015
|
Japan
|
|
23
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
6605044
|
May 20, 2015
|
Japan
|
|
24
|
Issuer
|
APPARATUS FOR HOLDING SUBSTRATE
|
Invention
|
6633756
|
December 4, 2015
|
Japan
|
|
25
|
Issuer
|
METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES
|
Invention
|
10-1370807
|
August 29, 2007
|
Korea
|
|
26
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
10--1424622
|
July 5, 2007
|
Korea
|
|
27
|
Issuer
|
PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE
|
Invention
|
10-1424623
|
November 2, 2007
|
Korea
|
|
28
|
Issuer
|
METHODES AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
10-1467974
|
December 10, 2007
|
Korea
|
|
29
|
Issuer
|
METHOD AND APPARATUS TO PREWET WAFER SURFACE FOR METALLIZATION
FROM ELECTROLYTE SOLUTION
|
Invention
|
10-1487708
|
October 30, 2007
|
Korea
|
|
30
|
Issuer
|
BARRIER LAYER REMOVAL METHOD AND APPARATUS
|
Invention
|
10-1492467
|
August 20, 2008
|
Korea
|
|
31
|
Issuer
|
SOLUTION PREPARATION APPARATUS AND
METHOD FOR TREATING
INDIVIDUAL SEMICONDUCTOR WORKPIECE
|
Invention
|
10-1519832
|
March 17, 2008
|
Korea
|
|
32
|
Issuer
|
METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO
SEMICONDUCTOR WAFER
|
Invention
|
10-1521470
|
September 16, 2008
|
Korea
|
|
33
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
10-1546660
|
December 12, 2008
|
Korea
|
| ACM Research (Shanghai), Inc. |
[***] |
|
34
|
Issuer
|
METHODS AND APPARATUS FOR UNIFORMLY
METALLIZATION ON SUBSTRATES
|
Invention
|
10-1783786
|
June 24, 2011
|
Korea
|
|
35
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING
FLIP CHIP ASSEMBLIES
|
Invention
|
10-1837070
|
September 22, 2011
|
Korea
|
|
36
|
Issuer
|
METHOD FOR FORMING AIR GAP INTERCONNECT STRUCTURE
|
Invention
|
10-1842903
|
September 20, 2011
|
Korea
|
|
37
|
Issuer
|
NOZZLE FOR STRESS-FREE POLISHING METAL LAYERS ON
SEMICONDUCTOR WAFERS
|
Invention
|
10-1891730
|
March 30, 2012
|
Korea
|
|
38
|
Issuer, and
NOMURA
MICRO
SCIENCE
CO., LTD
|
WASHING HYDROGEN WATER PRODUCING METHOD
AND PRODUCING APPARATUS
|
Invention
|
10-1913465
|
July 14, 2016
|
Korea
|
|
39
|
Issuer
|
LOADLOCK CHAMBER AND METHOD FOR TREATING SUBSTRATES
USING THE SAME
|
Invention
|
10-1940580
|
May 24, 2012
|
Korea
|
|
40
|
Issuer
|
METHOD AND APPARATUS FOR PULSE
ELECTROCHEMICAL POLISHING
|
Invention
|
10-1947032
|
May 24, 2012
|
Korea
|
|
41
|
Issuer
|
VACUUM CHUCK
|
Invention
|
10-1963851
|
March 28, 2012
|
Korea
|
|
42
|
Issuer
|
METHOD AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
10-1992660
|
November 28, 2012
|
Korea
|
|
43
|
Issuer
|
METHOD FOR FORMING INTERCONNECTION STRUCTURES
|
Invention
|
10-1976727
|
November 27, 2012
|
Korea
|
|
44
|
Issuer
|
METHOD AND APPARATUS FOR THROUGH-
SILICON VIAS REVEAL
|
Invention
|
10-2024122
|
April 22, 2013
|
Korea
|
|
45
|
Issuer
|
APPARATUS AND METHOD FOR PLATING AND/OR
POLISHING WAFER
|
Invention
|
10-2043811
|
May 9, 2013
|
Korea
|
|
46
|
Issuer
|
PLATING APPARATUS FOR METALLIZATION ON
SEMICONDUCTOR WORKPIECE
|
Invention
|
161074
|
November 2, 2007
|
Singapore
|
|
47
|
Issuer
|
METHODES AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
162170
|
December 10, 2007
|
Singapore
|
|
48
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
157876
|
July 5, 2007
|
Singapore
|
|
49
|
Issuer
|
METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO
SEMICONDUCTOR WAFER
|
Invention
|
169663
|
September 16, 2008
|
Singapore
|
| ACM Research (Shanghai), Inc. |
[***] |
|
50
|
Issuer
|
METHOD AND APPARATUS TO PREWET WAFER SURFACE FOR METALLIZATION FROM ELECTROLYTE SOLUTION
|
Invention
|
161057
|
October 30, 2007
|
Singapore
|
|
51
|
Issuer
|
METHOD AND APPARATUS FOR THERMAL
TREATMENT OF SEMICONDUCTOR
WORKPIECES
|
Invention
|
159349
|
August 29, 2007
|
Singapore
|
|
52
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
174616
|
March 31, 2009
|
Singapore
|
|
53
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
172096
|
December 12, 2008
|
Singapore
|
|
54
|
Issuer
|
SOLUTION PREPARATION APPARATUS
AND
METHOD FOR TREATING INDIVIDUAL
SEMICONDUCTOR WORKPIECE
|
Invention
|
164856
|
March 17, 2008
|
Singapore
|
|
55
|
Issuer
|
METHOD AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
11201503659Q
|
November 28, 2012
|
Singapore
|
|
56
|
Issuer
|
METHODS AND APPARATUS FOR
UNIFORMLY
METALLIZATION ON SUBSTRATES
|
Invention
|
195849
|
June 24, 2011
|
Singapore
|
|
57
|
Issuer
|
APPARATUS AND METHOD FOR TAPING
ADHESIVE FILM ON
SEMICONDUCTOR SUBSTRATE
|
Invention
|
11201510022S
|
June 19, 2013
|
Singapore
|
|
58
|
Issuer
|
NOZZLE FOR STRESS-FREE POLISHING
METAL LAYERS ON SEMICONDUCTOR
WAFERS
|
Invention
|
11201405586T
|
March 30, 2012
|
Singapore
|
|
59
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING
FLIP CHIP ASSEMBLIES
|
Invention
|
11201400619Q
|
September 22, 2011
|
Singapore
|
|
60
|
Issuer
|
SUBSTRATE SUPPORTING APPARATUS
|
Invention
|
11201503660V
|
November 27, 2012
|
Singapore
|
|
61
|
Issuer
|
APPARATUS AND METHOD FOR PLATING
AND/OR
POLISHING WAFER
|
Invention
|
11201508466Q
|
May 9, 2013
|
Singapore
|
|
62
|
Issuer
|
METHOD AND APPARATUS FOR
UNIFORMLY METALLIZATION ON
SUBSTRATE
|
Invention
|
11201507894X
|
April 22, 2013
|
Singapore
|
|
63
|
Issuer
|
METHOD FOR OPTIMIZING METAL PLANARIZATION PROCESS
|
Invention
|
11201706624U
|
February 15, 2015
|
Singapore
|
|
64
|
Issuer
|
APPARATUS AND METHOD FOR
CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
11201702033V
|
September 26, 2014
|
Singapore
|
|
65
|
Issuer
|
METHOD FOR ELECTROCHEMICAL
POLISH IN
CONSTANT VOLTAGE MODE
|
Invention
|
11201803236V
|
October 30, 2015
|
Singapore
|
| ACM Research (Shanghai), Inc. |
[***] |
|
66
|
Issuer
|
METHOD AND APPARATUS FOR THROUGH-SILICON VIAS REVEAL
|
Invention
|
10201708304V
|
April 22, 2013
|
Singapore
|
|
67
|
Issuer
|
PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE
|
Invention
|
I355686
|
November 5, 2007
|
Taiwan, China
|
|
68
|
Issuer
|
METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES
|
Invention
|
I364075
|
August 30, 2007
|
Taiwan, China
|
|
69
|
Issuer
|
METHOD AND APPARATUS TO PREWET WAFER SURFACE FOR METALLIZATION FROM ELECTROLYTE SOLUTIONS
|
Invention
|
I366610
|
October 31, 2007
|
Taiwan, China
|
|
70
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
I371063
|
June 15, 2007
|
Taiwan, China
|
|
71
|
Issuer
|
METHODES AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
I390618
|
December 10, 2007
|
Taiwan, China
|
|
72
|
Issuer
|
WAFER CLEANING DEVICE
|
Utility Model
|
M464807
|
May 7, 2013
|
Taiwan, China
|
|
73
|
Issuer
|
ELECTROCHEMICAL DEPOSITION SYSTEM
|
Invention
|
I417962
|
March 20, 2008
|
Taiwan, China
|
|
74
|
Issuer
|
METHOD FOR SUBSTANTIALLY UNIFORM COPPER DEPOSITION ONTO
SEMICONDUCTOR WAFER
|
Invention
|
I425122
|
September 17, 2008
|
Taiwan, China
|
|
75
|
Issuer
|
SOLUTION PREPARATION APPARATUS AND METHOD FOR TREATING INDIVIDUAL SEMICONDUCTOR WORKPIECE
|
Invention
|
I459489
|
March 17, 2008
|
Taiwan, China
|
|
76
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
I483299
|
January 9, 2009
|
Taiwan, China
|
|
77
|
Issuer
|
Wet process equipment
|
Design
|
D168609
|
November 20, 2013
|
Taiwan, China
|
|
78
|
Issuer
|
BARRIER LAYER REMOVAL METHOD AND APPARATUS
|
Invention
|
I501302
|
August 21, 2008
|
Taiwan, China
|
|
79
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
I501297
|
March 31, 2009
|
Taiwan, China
|
|
80
|
Issuer
|
Method and apparatus for pulse electrochemical polishing
|
Invention
|
I501307
|
July 31, 2013
|
Taiwan, China
|
|
81
|
Issuer
|
METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATES
|
Invention
|
I532083
|
June 24, 2011
|
Taiwan, China
|
|
82
|
Issuer
|
Vacuum chuck for electropolishing and/or electroplating
|
Invention
|
I576468
|
July 31, 2013
|
Taiwan, China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
83
|
Issuer
|
Cleaning fluid flow control system and cleaning fluid flow control method
|
Invention
|
I587115
|
August 27, 2013
|
Taiwan, China
|
|
84
|
Issuer
|
Detector and detection method for wafer position
|
Invention
|
I596695
|
September 26, 2013
|
Taiwan, China
|
|
85
|
Issuer
|
Method and device for cleaning semiconductor silicon wafer
|
Invention
|
I604522
|
May 16, 2014
|
Taiwan, China
|
|
86
|
Issuer
|
Apparatus and method for taping adhesive film on semiconductor substrate
|
Invention
|
I604521
|
December 19, 2014
|
Taiwan, China
|
|
87
|
Issuer
|
Vacuum chuck
|
Invention
|
I606545
|
July 31, 2013
|
Taiwan, China
|
|
88
|
Issuer
|
Formation method of air-gap interconnection structure
|
Invention
|
I608541
|
January 20, 2012
|
Taiwan, China
|
|
89
|
Issuer
|
Method and apparatus for through-silicon vias reveal
|
Invention
|
I611507
|
October 23, 2014
|
Taiwan, China
|
|
90
|
Issuer
|
Semiconductor wafer polishing method
|
Invention
|
I614799
|
May 16, 2014
|
Taiwan, China
|
|
91
|
Issuer
|
Formation method of interconnection structure
|
Invention
|
I621234
|
May 16, 2014
|
Taiwan, China
|
|
92
|
Issuer
|
Nozzle for stress-free electrochemical polishing
|
Invention
|
I639488
|
July 31, 2013
|
Taiwan, China
|
|
93
|
Issuer
|
Method and apparatus for uniformly metallization on substrate
|
Invention
|
I639725
|
October 13, 2014
|
Taiwan, China
|
|
94
|
Issuer
|
Substrate strutting apparatus
|
Invention
|
I644390
|
May 16, 2014
|
Taiwan, China
|
|
95
|
NOMURA
MICRO
SCIENCE
KK; Issuer;
HJS ENG
CO LTD
|
Manufacturing method and device of hydrogen water for cleaning
|
Invention
|
I646190
|
June 29, 2016
|
Taiwan, China
|
|
96
|
Issuer
|
Apparatus and method for electroplating or polishing wafer
|
Invention
|
I647343
|
May 16, 2014
|
Taiwan, China
|
|
97
|
Issuer
|
Apparatus and method for uniformly metallization on substrate
|
Invention
|
I658170
|
February 17, 2015
|
Taiwan, China
|
|
98
|
Issuer
|
Load lock chamber and method of using load lock chamber to process substrates
|
Invention
|
I663676
|
July 31, 2013
|
Taiwan, China
|
|
99
|
Issuer
|
Apparatus and method for removing edge film of reverse side of wafer
|
Invention
|
I665748
|
December 4, 2015
|
Taiwan, China
|
|
100
|
Issuer
|
METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES
|
Invention
|
US8,383,429
|
August 29, 2007
|
USA
|
|
101
|
Issuer
|
PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE
|
Invention
|
US8,518,224
|
November 2, 2007
|
USA
|
| ACM Research (Shanghai), Inc. |
[***] |
|
102
|
Issuer
|
METHODES AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US8,580,042
|
December 10, 2007
|
USA
|
|
103
|
Issuer
|
BARRIER LAYER REMOVAL METHOD AND APPARATUS
|
Invention
|
US8,598,039
|
August 20, 2008
|
USA
|
|
104
|
Issuer
|
METHODES AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US8,671,961
|
December 10, 2007
|
USA
|
|
105
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US9,070,723
|
July 5, 2007
|
USA
|
|
106
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US9,281,177
|
July 5, 2007
|
USA
|
|
107
|
Issuer
|
METHOD TO PREWET WAFER SURFACE
|
Invention
|
US9,295,167
|
November 12, 2013
|
USA
|
|
108
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US9,492,852
|
March 31, 2009
|
USA
|
|
109
|
Issuer
|
METHOD FOR FORMING INTERCONNECTION STRUCTURES
|
Invention
|
US9,496,172
|
November 27, 2012
|
USA
|
|
110
|
Issuer
|
VACUUM CHUCK
|
Invention
|
US9,558,985
|
March 28, 2012
|
USA
|
|
111
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US9,595,457
|
December 12, 2008
|
USA
|
|
112
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US9,633,833
|
March 31, 2009
|
USA
|
|
113
|
Issuer
|
METHODS AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATES
|
Invention
|
US9,666,426
|
June 24, 2011
|
USA
|
|
114
|
Issuer
|
NOZZLE FOR STRESS-FREE POLISHING METAL LAYERS ON SEMICONDUCTOR WAFERS
|
Invention
|
US9,724,803
|
March 30, 2012
|
USA
|
|
115
|
Issuer
|
METHOD AND APPARATUS FOR PULSE ELECTROCHEMICAL POLISHING
|
Invention
|
US9,865,476
|
May 24, 2012
|
USA
|
|
116
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS
|
Invention
|
US10,020,208
|
December 12, 2008
|
USA
|
|
117
|
Issuer and
NOMURA
MICRO
SCIENCE
CO., LTD.
|
WASHING HYDROGEN WATER PRODUCING METHOD AND PRODUCING APPARATUS
|
Invention
|
US10,059,911
|
July 14, 2016
|
USA
|
|
118
|
Issuer
|
METHOD AND APPARATUS FOR UNIFORMLY METALLIZATION ON SUBSTRATE
|
Invention
|
US10,113,244
|
April 22, 2013
|
USA
|
| ACM Research (Shanghai), Inc. |
[***] |
|
119
|
Issuer
|
APPARATUS AND METHOD FOR CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
US10,141,205
|
September 26, 2014
|
USA
|
|
120
|
Issuer
|
METHOD FOR PROCESSING INTERCONNECTION
STRUCTURE FOR
MINIMIZING BARRIER SIDEWALL RECESS
|
Invention
|
US10,217,662
|
August 12, 2015
|
USA
|
|
121
|
Issuer
|
APPARATUS AND METHOD FOR PLATING AND/OR
POLISHING WAFER
|
Invention
|
US10,227,705
|
May 9, 2013
|
USA
|
|
122
|
Issuer
|
METHOD AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFER
|
Invention
|
US10,297,472
|
November 28, 2012
|
USA
|
|
123
|
Issuer
|
SUBSTRATE SUPPORTING APPARATUS
|
Invention
|
US10,410,906
|
November 27, 2012
|
USA
|
|
124
|
Issuer
|
BARRIER LAYER REMOVAL METHOD AND
SEMICONDUCTOR
STRUCTURE FORMING METHOD
|
Invention
|
US10,453,743
|
October 17, 2014
|
USA
|
|
Issuer
|
METHODES AND APPARATUS FOR CLEANING S
UBSTRATES
USING HIGH TEMPERATURE CHEMICALS
AND ULTRASONIC DEVICE |
Invention
|
6670940
|
December 9, 2015
|
Japan
|
|
|
126
|
Issuer
|
SUBSTRATE HEAT TREATMENT APPARATUS
|
Invention
|
6697089
|
March 18, 2016
|
Japan
|
|
127
|
Issuer
|
METHOD AND APPARATUS FOR UNIFORMLY
METALLIZATION ON SUBSTRATE
|
Invention
|
10-2119634
|
October 20, 2015
|
Korea
|
|
128
|
Issuer
|
SUBSTRATE SUPPORTING APPARATUS
|
Invention
|
10-2124417
|
June 18, 2015
|
Korea
|
|
129
|
Issuer
|
APPARATUS AND METHOD FOR UNIFORM
METALLIZATION
ON SUBSTRATE
|
Invention
|
11201704192W
|
November 25, 2014
|
Singapore
|
|
130
|
Issuer
|
METHOD FOR REMOVING BARRIER LAYER FOR
MINIMIZING SIDEWALL RECESS
|
Invention
|
11201706167Q
|
February 15, 2015
|
Singapore
|
|
131
|
Issuer
|
Method for optimizing metal planarization process
|
Invention
|
I685029
|
June 22, 2016
|
Taiwan, China
|
|
132
|
Issuer
|
Gumming machine with automatic cleaning function and automatic
cleaning method for gumming machine
|
Invention
|
I689354
|
May 28, 2015
|
Taiwan, China
|
|
133
|
Issuer
|
Apparatus for holding substrate
|
Invention
|
I691619
|
August 25, 2016
|
Taiwan, China
|
|
134
|
Issuer
|
Method for electrochemical polish in constant voltage mode
|
Invention
|
I695092
|
October 27, 2016
|
Taiwan, China
|
|
135
|
Issuer
|
Method and device for cleaning substrates
|
Invention
|
I695743
|
November 2, 2016
|
Taiwan, China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
136
|
Issuer
|
METHOD FOR REMOVING BARRIER LAYER FOR MINIMIZING
SIDEWALL RECESS
|
Invention
|
US10,615,073
|
February 15, 2015
|
USA
|
|
137
|
Issuer
|
FUNCTIONAL WATER PRODUCING APPARATUS
AND FUNCTIONAL
WATER PRODUCING METHOD
|
Invention
|
US10,654,014
|
January 27, 2017
|
USA
|
|
138
|
Issuer
|
SUBSTRATE SUPPORTING APPARATUS
|
Invention
|
6758587
|
June 6, 2016
|
Japan
|
|
139
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
6770757
|
April 6, 2016
|
Japan
|
|
140
|
Issuer, NOMURA
MICRO
SCIENCE
CO., LTD.,
HJS ENG
CO., LTD.
|
FUNCTIONAL WATER PRODUCING APPARATUS AND
FUNCTIONAL WATER PRODUCING METHOD |
Invention
|
10-2017-0009919
|
January 20, 2017
|
Korea
|
|
141
|
Issuer
|
BARRIER LAYER REMOVAL METHOD AND SEMICONDUCTOR
STRUCTURE FORMING METHOD
|
Invention
|
11201703033R
|
October 17, 2014
|
Singapore
|
|
142
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR
WAFERS
|
Invention
|
11201808637X
|
April 6, 2016
|
Singapore
|
|
143
|
Issuer
|
COATER WITH AUTOMATIC CLEANING FUNCTION AND
COATER AUTOMATIC CLEANING METHOD
|
Invention
|
11201701411W
|
September 16, 2014
|
Singapore
|
|
144
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING
SEMICONDUCTOR WAFERS
|
Invention
|
11201709372X
|
May 20, 2015
|
Singapore
|
|
145
|
Issuer
|
TSV STRUCTURE PLANARIZATION PROCESS AND APPARATUS
|
Invention
|
11201808636T
|
April 7, 2016
|
Singapore
|
|
146
|
Issuer
|
A FALL-PROOF APPARATUS FOR CLEANING
SEMICONDUCTOR DEVICES AND A CHAMBER
WITH THE APPARATUS
|
Invention
|
11201706200U
|
September 8, 2015
|
Singapore
|
|
147
|
Issuer
|
Method for forming metal interconnection
|
Invention
|
I697983
|
January 4, 2016
|
Taiwan, China
|
|
148
|
Issuer
|
Substrate cleaning method and cleaning device
|
Invention
|
I698291
|
November 1, 2016
|
Taiwan, China
|
|
149
|
Issuer
|
Wafer cleaning device and method
|
Invention
|
I700730
|
January 4, 2017
|
Taiwan, China
|
|
150
|
Issuer
|
Method and device for cleaning semiconductor substrates
|
Invention
|
I702665
|
June 21, 2016
|
Taiwan, China
|
|
151
|
Issuer
|
Barrier layer removal method and semiconductor structure
forming method
|
Invention
|
I705162
|
April 12, 2016
|
Taiwan, China
|
| ACM Research (Shanghai), Inc. |
[***] |
|
152
|
Issuer
|
Method and apparatus for cleaning and drying integrated
circuit substrate
|
Invention
|
I706433
|
July 11, 2016
|
Taiwan, China
|
|
153
|
Issuer
|
Method for machining interconnection structure to minimize
sidewall recess of barrier layer
|
Invention
|
I706434
|
October 12, 2016
|
Taiwan, China
|
|
154
|
Issuer
|
Device and method for cleaning semiconductor selenium sheet
|
Invention
|
I710412
|
March 23, 2016
|
Taiwan, China
|
|
155
|
Issuer
|
Apparatus for substrate bevel and backside protection
|
Invention
|
I712095
|
August 9, 2016
|
Taiwan, China
|
|
156
|
Issuer
|
FALL-PROOF APPARATUS FOR CLEANING
SEMICONDUCTOR
DEVICES AND A CHAMBER WITH THE APPARATUS
|
Invention
|
US10770315
|
September 8, 2015
|
USA
|
|
157
|
Issuer
|
SUBSTRATE SUPPORTING APPARATUS
|
Invention
|
US10770335
|
July 6, 2016
|
USA
|
|
158
|
Issuer
|
COATER WITH AUTOMATIC CLEANING FUNCTION AND
COATER AUTOMATIC CLEANING METHOD
|
Invention
|
US10816901
|
September 16, 2014
|
USA
|
|
159
|
Issuer
|
METHOD FOR FORMING METAL INTERCONNECTION
|
Invention
|
10-2247940
|
January 9, 2017
|
Korea
|
|
160
|
Issuer
|
APPARATUS AND METHOD FOR WET PROCESS ON
SEMICONDUCTOR SUBSTRATE
|
Invention
|
6831134
|
October 25, 2016
|
Japan
|
|
161
|
Issuer
|
METHODS FOR CLEANING SUBSTRATE
|
Invention
|
6843402
|
December 16, 2019
|
Japan
|
|
162
|
Issuer
|
METHOD AND APPARATUS FOR UNIFORMLY
METALLIZATION ON
SUBSTRATE
|
Invention
|
US10,907,266
|
April 22, 2013
|
USA
|
|
163
|
Issuer
|
METHOD AND APPARATUS FOR CLEANING SUBSTRATES
USING HIGH
TEMPERATURE CHEMICALS AND ULTRASONIC DEVICE
|
Invention
|
US11,000,782
|
December 9, 2015
|
USA
|
|
164
|
Issuer
|
APPARATUS FOR HOLDING A SUBSTRATE
|
Invention
|
US11,008,669
|
December 4, 2015
|
USA
|
|
165
|
Issuer
|
METHODS AND APPARATUS FOR
CLEANING SUBSTRATES
|
Invention
|
3516684
|
July 31, 2019
|
EPO
|
|
166
|
Issuer
|
Barrier layer removal method and semiconductor structure
forming method
|
Invention
|
I717346
|
October 16, 2017
|
Taiwan, China
|
|
167
|
Issuer
|
Device for cleaning substrate and high temperature chemical solution
supply system
|
Invention
|
I721080
|
July 16, 2018
|
Taiwan, China
|
|
168
|
Issuer
|
Substrate strutting apparatus
|
Invention
|
I723240
|
July 16, 2019
|
Taiwan, China
|
|
169
|
Issuer
|
APPARATUS FOR SUBSTRATE BEVEL AND
BACKSIDE PROTECTION
|
Invention
|
11201709054V
|
May 14, 2015
|
Singapore
|
|
170
|
Issuer
|
METHODS AND APPARATUS FOR CLEANING
SUBSTRATES
|
Invention
|
11201902242R
|
September 19, 2016
|
Singapore
|
| ACM Research (Shanghai), Inc. |
[***] |
|
S/N
|
Owner
|
International
Classification
|
Trademark
|
Application
No./Registration
No.
|
Registration
Date
|
Expiry Date
|
|
1
|
Issuer
|
Class 7
|
|
13396066
|
August 28, 2015
|
August 27, 2025
|
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2
|
Issuer
|
Class 7
|
|
12186123
|
August 7, 2014
|
August 6, 2024
|
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3
|
Issuer
|
Class 7
|
|
12186124
|
August 7, 2014
|
August 6, 2024
|
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4
|
Issuer
|
Class 7
|
|
12186125
|
August 7, 2014
|
August 6, 2024
|
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5
|
Issuer
|
Class 7
|
|
12186126
|
August 7, 2014
|
August 6, 2024
|
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6
|
Issuer
|
Class 7
|
|
12186127
|
September 7, 2014
|
September 6, 2024
|
|
7
|
Issuer
|
Class 7
|
|
13396065
|
August 21, 2015
|
August 20, 2025
|
|
8
|
Issuer
|
Class 7
|
![]() |
13396064
|
March 14, 2015
|
March 13, 2025
|
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9
|
Issuer
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Class 7
|
|
13396063
|
March 14, 2015
|
March 13, 2025
|
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10
|
Issuer
|
Class 7
|
|
13396062
|
March 14, 2015
|
March 13, 2025
|
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11
|
Issuer
|
Class 7
|
|
13396061
|
August 28, 2015
|
August 27, 2025
|
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12
|
Issuer
|
Class 7
|
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13396060
|
January 7, 2016
|
January 6, 2026
|
|
13
|
Issuer
|
Class 7
|
|
20518382
|
August 28, 2017
|
August 27, 2027
|
|
14
|
Issuer
|
Class 7
|
|
20518381
|
October 21, 2017
|
October 20, 2027
|
|
15
|
Issuer
|
Class 7
|
|
48651305
|
April 7, 2021
|
April 6, 2031
|
|
16
|
Issuer
|
Class 7
|
|
46672000A
|
April 14, 2021
|
April 13, 2031
|
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17
|
Issuer
|
Class 7
|
|
50664878
|
June 14, 2021
|
June 13, 2031
|
| ACM Research (Shanghai), Inc. |
[***] |
|
S/N
|
Owner
|
International
Classification
|
Trademark
|
Application
No./Registration
No.
|
Registration
Date
|
Expiry
Date
|
Registration
Place
|
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1
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Issuer
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Class 7
|
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107059018/1986040
|
September 11, 2018
|
May 15, 2029
|
Taiwan, China
|
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2
|
Issuer
|
Class 7
|
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107059019/1980974
|
September 11, 2018
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April 15, 2029
|
Taiwan, China
|
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3
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Issuer
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Class 7
|
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107059021/1980975
|
September 11, 2018
|
April 15, 2029
|
Taiwan, China
|
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4
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Issuer
|
Class 7
|
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107059022/1980976
|
September 11, 2018
|
April 15, 2029
|
Taiwan, China
|
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5
|
Issuer
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Class 7
|
|
International Registration No.: 1467252
|
January 2, 2019
|
January 2, 2029
|
Singapore
|
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6
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Issuer
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Class 7
|
|
International Registration No.: 1467249
|
January 2, 2019
|
January 2, 2029
|
Singapore
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7
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Issuer
|
Class 7
|
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International Registration No.: 1467242
|
January 2, 2019
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January 2, 2029
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Singapore
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8
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Issuer
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Class 7
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International Registration No.: 1467241
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January 2, 2019
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January 2, 2029
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Singapore
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9
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Issuer
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Class 7
|
|
International Registration No.:
1467241
|
December 1, 2020
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January 2, 2029
|
Korea
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10
|
Issuer
|
Class 7
|
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International Registration No.:
1467242
|
November 12, 2020
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January 2, 2029
|
Korea
|
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11
|
Issuer
|
Class 7
|
|
International Registration No.:
1467249
|
November 12, 2020
|
January 2, 2029
|
Korea
|
| ACM Research (Shanghai), Inc. |
[***] |
|
12
|
Issuer
|
Class 7
|
|
International Registration No.:
1467252
|
November 12, 2020
|
January 2, 2029
|
Korea
|
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13
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Issuer
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Class 7
|
|
International Registration No.:
1451450
|
July 6, 2020
|
January 9, 2029
|
Korea
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14
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Issuer
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Class 7
|
|
International Registration No.:
1467241
|
April 23, 2021
|
January 2, 2029
|
Japan
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15
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Issuer
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Class 7
|
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International Registration No.:
1467242
|
April 23, 2021
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January 2, 2029
|
Japan
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16
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Issuer
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Class 7
|
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International Registration No.:
1467249
|
April 23, 2021
|
January 2, 2029
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Japan
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17
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Issuer
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Class 7
|
|
International Registration No.:
1467252
|
April 23, 2021
|
January 2, 2029
|
Japan
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18
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Issuer
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Class 7
|
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International Registration No.:
6197430
|
November 17, 2020
|
January 2, 2029
|
USA
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19
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Issuer
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Class 7
|
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International Registration No.:
6197431
|
November 17, 2020
|
January 2, 2029
|
USA
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20
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Issuer
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Class 7
|
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International Registration No.:
6197432
|
November 17, 2020
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January 2, 2029
|
USA
|
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21
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Issuer
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Class 7
|
|
International Registration No.:
6197433
|
November 17, 2020
|
January 2, 2029
|
USA
|
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22
|
Issuer
|
Class 7
|
|
International Registration No.:
6121048
|
August 11, 2020
|
January 9, 2029
|
USA
|

| Stock Code: 688082 | Short Name: ACMSH |
|
Category of investor relation activity
|
☐ Specific object research √ Analyst meeting
☐ Media interview ☐ Performance briefing ☐ Press conference ☐ Roadshow ☐ Site visit ☐ Teleconference ☐ Others (Please describe other activities in words) |
|||
|
Visitor’s Unit
|
BOCI SECURITIES
CHINA MERCHANTS SECURITIES
HUATAI SECURITIES
CSC
FOUNDER SECURITIES
CITIC SECURITIES
HAITONG SECURITIES
CICC
|
|||
|
Time of meeting
|
November, 2021
|
|||
|
Place of meeting
|
Company Conference Room
|
|||
|
Name of receptionists of the listed company
|
Chairman: HUI WANG
Director/General Manager: JIAN WANG
Person in Charge of Financial Matters: LISA YI LU FENG
Board Secretary: MINGZHU LUO
|

|
Introduction to main contents of investor relation activity
|
1. Introduction to the Company by the General Manager and the Person in Charge of Financial Matters of the Company
2. Q&A Q1: What’s your forward looking to the future market? A: With the increase of new products and new customers as well as the
expansion of existing domestic customers, the total demand of customers for our products will increase. We will continue to develop domestic and international markets through differentiated products in the future, with half of sales in
Mainland China and half of sales in the global market as our goal.
Q2: What do you think of cleaning technology? A: The cleaning technology is constantly updated. While developing horizontally, we are also deepening vertically towards the advanced high-temperature IPA drying technology and the supercritical CO2 drying technology, among others, having made a global patent layout for the above two technologies. In the future, we will continue to carry out technological innovation and R&D in response to the market demand. |

|
|
As to our megasonic technology, its main advantage is that its ability to clean particles below 30nm is much better than that of two-phase fluid technology.
Megasonic cleaning technology is more needed for technical nodes below 28nm, especially those below 14nm, as advanced technical nodes are in greater need of cleaning small particles below 30nm. Particularly in 3D structures, small particles
in grooves or deep holes, etc., cannot be cleaned by using two-phase fluids. Our cleaning equipment can be configured with SAPS or TEBO technology or two-phase fluid technology. The actual products will depend on the customer’s product
structure and particle cleaning requirements. In case of a fragile structure with high aspect ratio, TEBO is recommended. SAPS can be used for plane and deep holes, and two-phase fluid can be used for plane and large particle cleaning. Our
Tahoe cleaning equipment combines wet bench and single wafer, which can greatly reduce the amount of sulfuric acid compared with single wafer high-temperature sulfuric acid cleaning equipment. We have very strong IP to protect the patent of
wet bench and single wafer. For the cleaning process with special high temperature (greater than 180 ℃), we also have single high-temperature sulfuric acid cleaning equipment for verification on the customer’s production line.
Q3: What are the territorial jurisdiction and governing law of your product technology? A: Since our establishment in 2005, the ownership of the technology developed by us and all IP vest in ACMSH. Accordingly, the technology is protected and governed by Chinese laws. We are listed on the STAR Market as a completely domestic semiconductor equipment company in China, and the technology developed by us is non-American technology. If parts made in the U.S. are used, they will be subject to the jurisdiction of the U.S. import and export laws. The regulations on parts made in the U.S. are the same for all semiconductor equipment companies at home and abroad. |

|
Q4: What do you think of the parts supply cycle?
A: From the published financial data, it can be seen that our production demand for suppliers has increased significantly this year. We will, according to the production expansion plan in the next 12 months, strengthen communication with suppliers to ensure the medium and long-term supply of core parts. Q5: What do you think of your other products?
A: Copper plating equipment, etc., is covered in our plan. As for wet bench equipment, while still focusing on the market of 12-inch silicon wafer, we will enter the 8-inch market with differentiated technological innovation on the basis of ensuring gross profit margin. As for LPCVD of furnace tube, we have been in a leading position in the domestic market, and will explore the domestic market together with our partners. As for advanced packaging wet equipment, we have gluing, degluing, developing, etching, cleaning and electroplating copper equipment. We are also the only company in the world that can provide a complete set of wet processing solutions. In the future, we can not only accelerate localization, but also enter the global market for competition. Q6: What do you think of the decline of ASP for single wafer cleaning equipment? A: The main reason for the downward trend of the unit price of cleaning equipment mainly lies in the different number of chambers of cleaning equipment. The price will vary due to different number of chambers and different chemical preparation. In 2019, we mainly sold equipment with 8-12 chambers, and after 2020, we also began to sell certain equipment with 2-4 chambers, resulting in a decline in the ASP. Although the ASP has declined, the gross profit margin remains stable. |

|
Q7: What do you think of platformization?
A: The U.S. and Japan have similar experience in the goal of
platform-based equipment companies. Except for the special lithography machine, only with multiple platform-based products can we become stronger and bigger. However, it is very rare and difficult for companies to truly become platform-based,
and there are only a few companies in the world that can do so. It is not easy for a company to perfect one kind of equipment, let alone multiple platform-based products. A company may need more than ten or even decades of hard work before it
can be platform-based, and the key to success depends on the company’s differentiated innovation and original innovation ability. Through more than ten years of constant innovation, we have developed internationally advanced SAPS,
internationally leading TEBO, Tahoe cleaning equipment, advanced wet packaging equipment, and then have expanded to high-end copper electroplating equipment and vertical furnace tube series equipment, realizing the leap from wet process to
dry process. We are also continuing to develop two kinds of new front-end semiconductor equipment, so that the market coverage of our products will increase from the current USD5 billion to USD10 billion (calculated according to the global
semiconductor equipment market in 2020). It’s fair to say that we have basically completed the platform-based product layout and are moving towards the goal of becoming the first-tier semiconductor equipment company in the world.
|

